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Renesas R5F5651EDGFB#30
- Part No.:
- R5F5651EDGFB#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R5F5651EDGFB#30.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 144LFQFP
- Quantity:
- Payment:
- Shipping:
Inventory:180
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Product details
Overview
R5F5651EDGFB#30 from Renesas is a 120-MHz 32-bit RXv2 core MCU with single-precision IEEE-754 FPU, 240 DMIPS performance, 2 MB on-chip code flash memory (dual-bank), 640 KB SRAM, and integrated Ethernet MAC, CAN, SD host/slave, QSPI, and GLCDC for industrial HMI and networked embedded control.
For engineers reviewing the R5F5651EDGFB#30 datasheet, R5F5651EDGFB#30 pinout, R5F5651EDGFB#30 application, or R5F5651EDGFB#30 equivalent, this device supports IEC60730-compliant safety functions, real-time clock with battery backup, hardware AES-128/192/256 encryption, and 136 GPIOs with 5-V tolerance - critical for secure, connected, and display-rich edge devices.
Technical Context
The R5F5651EDGFB#30 implements the RXv2 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates dual-bank flash for safe firmware updates and background programming/erasing of both code and 32 KB data flash (100,000 write cycles).
Its peripheral set includes an Ethernet MAC with RMII/MII support, two CAN channels (ISO 11898-1, 32 mailboxes each), 13 SCI channels (with SPI/I²C emulation), three RSPI interfaces, one QSPI, SDHI/SDSI/MMCIF controllers, and a full graphics subsystem comprising GLCDC, DRW2D, and PDC for CMOS camera input and LCD output.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit, 120 MHz max, 240 DMIPS, IEEE-754 single-precision FPU |
| Memory | 2 MB code flash (dual-bank), 640 KB SRAM, 32 KB data flash (100k cycles) |
| Connectivity | Ethernet MAC (10/100 Mbps), 2× CAN, 13× SCI, 3× RSPI, 1× QSPI, SDHI/SDSI/MMCIF |
| Analog | Two 12-bit A/D units (8 + 21 ch), 2× 12-bit D/A, on-chip temperature sensor (±1°C) |
| Graphics & Imaging | GLCDC (3-plane overlay), DRW2D (vector/bit-blit), PDC (CMOS camera interface) |
| Security & Safety | AES-128/192/256, TSIP, MPU (8 regions), CRC calculator, IEC60730 self-test features |
| Package | LFBGA-176 (PLQP0176KB-A), 24 × 24 mm, 0.5-mm pitch, –40°C to +105°C (G-version) |
Pinout & Package
LFBGA-176 package (PLQP0176KB-A), 24 × 24 mm, 0.5-mm pitch, 136 general-purpose I/O pins with 5-V tolerance, open-drain capability, and programmable pull-up resistors.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Power supply inputs | Separate analog/digital supplies (2.7–3.6 V); AVCC0/AVCC1 power ADC/DAC reference |
| XTAL / EXTAL | Main crystal oscillator terminals | Supports 8–24 MHz external crystal for precise system clock generation |
| RTC_VDD / VBATT | Real-time clock backup supply | Enables RTC operation during main power loss using external battery or capacitor |
| ETH_MDC / ETH_MDIO | Ethernet management interface | IEEE 802.3-compliant MDIO bus for PHY configuration and status monitoring |
| TXD0 / RXD0 / RTS0 / CTS0 | SCI0 serial interface signals | Asynchronous UART mode with hardware flow control for debug or peripheral comms |
| CAN0_TX / CAN0_RX | Channel 0 CAN transceiver interface | Differential signaling compliant with ISO 11898-1; supports standard/extended frames |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables seamless firmware updates without halting application execution |
| Hardware AES engine | Accelerates encryption/decryption for secure boot, OTA updates, and data-at-rest protection |
| Integrated GLCDC + DRW2D | Reduces external display controller BOM; supports 3-layer UI composition and 2D acceleration |
| IEC60730 safety support | Includes oscillation-stop detection, CRC calculator, IWDT windowing, and A/D self-diagnostic |
| SDHI/SDSI dual-mode interface | Allows same MCU to act as SD host (e.g., for logging) or SD slave (e.g., for removable config storage) |
Applications
| Industrial HMI Panel | Secure Gateway Controller |
|---|---|
Use Scenario: Embedded touchscreen panel in factory automation with local logic, real-time data visualization, and remote diagnostics. IC Role / Device Role / Timing Role: Main application processor running RTOS, driving 4.3"–7" RGB LCD via GLCDC, capturing button/touch events, and communicating over EtherCAT/CAN. Use Value: Integrated DRW2D accelerates UI rendering; dual-bank flash enables field-upgradable firmware without downtime. |
Use Scenario: Protocol translation gateway connecting legacy Modbus RTU field devices to cloud via Ethernet/Wi-Fi. IC Role / Device Role / Timing Role: Central protocol stack executor with CAN/SCI/RSPI peripherals for fieldbus interfacing and Ethernet MAC for upstream connectivity. Use Value: Hardware AES and TSIP ensure secure TLS handshake and encrypted payload transmission; IEC60730 features satisfy functional safety requirements. |
| Networked Energy Meter | Smart Building Controller |
Use Scenario: DIN-rail mounted electricity meter with pulse counting, harmonic analysis, and remote firmware update capability. IC Role / Device Role / Timing Role: High-accuracy measurement controller using 12-bit A/D with self-calibration, RTC for time-stamped logging, and SDHI for local data storage. Use Value: On-chip temperature sensor compensates A/D drift; dual-bank flash allows validated firmware swap during maintenance window. |
Use Scenario: HVAC and lighting controller managing multiple zones with occupancy sensing, schedule-based operation, and BACnet/IP communication. IC Role / Device Role / Timing Role: Real-time scheduler coordinating sensor polling (via SCI/ADC), actuator PWM (via MTU3), and Ethernet-based supervisory control. Use Value: 136 GPIOs support direct connection to relays, thermistors, and DALI drivers; 640 KB SRAM accommodates large BACnet object tables and history buffers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F5651EDGFB#10 | Same die, identical specs, but rated for –40°C to +85°C (D-version) instead of +105°C | Suitable for non-extended temperature industrial enclosures without active cooling | Select #10 when ambient operating temperature remains ≤85°C; otherwise use #30 for extended thermal range. |
| R5F5661EDGFB#30 | Higher flash (3 MB), larger SRAM (1 MB), adds USB HS host/device and additional CAN channel | Required for applications needing >2 MB code space, USB mass storage, or triple-CAN redundancy | Choose #661 only if extra memory or USB HS is essential; #651 offers optimal cost/performance for most Ethernet+CAN HMI designs. |
Compared with R5F5651EDGFB#10, the #30 variant provides guaranteed operation up to +105°C - critical for sealed outdoor cabinets. Against R5F5661EDGFB#30, the #651 delivers identical peripheral integration at lower cost and power, making it ideal for thermally constrained, cost-sensitive gateways and HMIs.
Availability
R5F5651EDGFB#30 is available at Aetrix Electronics and suitable for industrial HMI panels, secure protocol gateways, networked energy meters, and smart building controllers requiring stable component supply across multi-year production cycles.
Supply support for R5F5651EDGFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX65N/RX651 Group - including R5F5651EDGFB#30 - was designed for high-integration, safety-certifiable, and graphics-capable industrial edge devices demanding real-time responsiveness, security, and rich human-machine interaction.
FAQ
What is the maximum operating frequency and core type of the R5F5651EDGFB#30?
The R5F5651EDGFB#30 features a 32-bit RXv2 CPU core with a maximum operating frequency of 120 MHz, delivering 240 DMIPS performance and single-precision IEEE-754 floating-point unit. This core enables deterministic real-time execution and efficient signal processing in applications such as motor control and industrial networking where cycle count predictability matters.
Does the R5F5651EDGFB#30 support dual-bank flash for firmware updates?
Yes, the R5F5651EDGFB#30 supports dual-bank flash architecture, allowing background programming and bank switching while executing code from the active bank. This capability enables zero-downtime firmware updates - a key requirement for R5F5651EDGFB#30 deployments in unattended industrial gateways and HMIs where service interruption must be avoided.
What graphics and display interfaces are integrated into the R5F5651EDGFB#30?
The R5F5651EDGFB#30 integrates a Graphic-LCD Controller (GLCDC) supporting 3-plane overlay, a 2D Drawing Engine (DRW2D) for vector and bit-blit operations, and a Parallel Data Capture (PDC) unit for CMOS camera input. These peripherals eliminate the need for external display controllers in R5F5651EDGFB#30-based HMI designs targeting 4.3"–7" RGB panels with animated UIs.
How does the R5F5651EDGFB#30 meet IEC60730 functional safety requirements?
The R5F5651EDGFB#30 includes dedicated hardware features for IEC60730 compliance: oscillation-stop detection, CRC calculator (8-/32-bit), independent watchdog timer (IWDTa) with windowing, register write protection, and A/D converter self-diagnostic function. These capabilities allow R5F5651EDGFB#30-based systems to achieve Class B certification without external safety monitors.
What is the operating temperature range and package type of the R5F5651EDGFB#30?
The R5F5651EDGFB#30 is offered in the LFBGA-176 package (PLQP0176KB-A, 24 × 24 mm, 0.5-mm pitch) and rated for an industrial operating temperature range of –40°C to +105°C (G-version). This extended range ensures reliable operation in harsh environments such as outdoor energy infrastructure and factory-floor controllers where ambient heat buildup occurs.
R5F5651EDGFB#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RX651
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RXv2
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 111
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 640K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 29x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F5651EDGFB#30 FAQ
1.How can I place an order for R5F5651EDGFB#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F5651EDGFB#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F5651EDGFB#30 reliable?
The price and inventory of R5F5651EDGFB#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F5651EDGFB#30 is usually 5 days.
3.What payment methods are accepted for R5F5651EDGFB#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F5651EDGFB#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F5651EDGFB#30?
R5F5651EDGFB#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F5651EDGFB#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F5651EDGFB#30?
For technical support, including R5F5651EDGFB#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F5651EDGFB#30 requirements.
6.How does Aetrix verify that R5F5651EDGFB#30 is sourced from the original manufacturer or authorized distributors?
All R5F5651EDGFB#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F5651EDGFB#30 meets industry standards.
7.What is the process for return or replacement of R5F5651EDGFB#30?
All R5F5651EDGFB#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F5651EDGFB#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F5651EDGFB#30 part is unused and in its original packaging.
Return procedure for R5F5651EDGFB#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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