Renesas R5F5651EDGFC#30

Overview

R5F5651EDGFC#30 from Renesas is a 32-bit RXv2 microcontroller operating at up to 120 MHz, delivering 240 DMIPS with integrated single-precision IEEE-754 FPU, 2 MB on-chip code flash (dual-bank), 640 KB SRAM, and hardware AES/TSIP encryption. It integrates Ethernet MAC, CAN 2.0B (2 channels), SD host/slave, QSPI, GLCDC, DRW2D, and dual 12-bit ADCs (29 total channels) for industrial HMI and networked edge devices.

For engineers reviewing the R5F5651EDGFC#30 datasheet, R5F5651EDGFC#30 pinout, R5F5651EDGFC#30 application, or R5F5651EDGFC#30 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), -40°C to +85°C temperature grade, 2.7–3.6 V supply, and support for IEC60730-compliant safety functions including CRC, IWDT, and register write protection.

Technical Context

The R5F5651EDGFC#30 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code. It supports memory protection (MPU), Trusted Memory (TM) for secure code execution, and JTAG/FINE debugging interfaces.

Its clock system combines external crystal oscillators (8–24 MHz), internal PLL, and multiple on-chip oscillators (LOCO/HOCO/IWDT-dedicated), enabling independent clock domains: ICLK up to 120 MHz for CPU, PCLKA up to 120 MHz for high-speed peripherals (ETHERC, GLCDC), and PCLKB up to 60 MHz for timers and ADCs.

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 mm × 24 mm, 0.5 mm ball pitch, 136 general-purpose I/O pins (19 with 5-V tolerance), 1 dedicated input pin, full pull-up/open-drain support.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F5651EDGFC#30, R5F565NEDGFC#30 offers identical functionality and pinout, while R5F566TEBGFP#30 trades graphics/Ethernet capability for higher motor-control precision and speed-making it unsuitable as a drop-in replacement but viable for cost-optimized motion control.

Availability

R5F5651EDGFC#30 is available at Aetrix Electronics and suitable for industrial HMI panels, smart gateways, secure IoT nodes, and motor drive controllers requiring stable component supply across multi-year production cycles.

Supply support for R5F5651EDGFC#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The RX65N Group-including R5F5651EDGFC#30-is designed for high-integration industrial edge devices requiring real-time performance, functional safety, graphics, and secure connectivity in a single chip.

FAQ

What is the maximum operating frequency and CPU performance of the R5F5651EDGFC#30?

The R5F5651EDGFC#30 operates at a maximum system clock frequency of 120 MHz and delivers 240 DMIPS of processing performance using the RXv2 CPU core. Its single-precision IEEE-754 floating-point unit enables efficient math-intensive tasks such as motor control algorithms and signal processing without external coprocessors. The R5F5651EDGFC#30 achieves this performance with no wait states on SRAM and optimized flash access timing.

Does the R5F5651EDGFC#30 support Ethernet communication, and what physical layer options are available?

Yes, the R5F5651EDGFC#30 integrates a full-featured Ethernet MAC compliant with IEEE 802.3, supporting 10/100 Mbps operation in both full- and half-duplex modes. It supports MII (Media Independent Interface) and RMII (Reduced MII) physical layer configurations, enabling flexible PHY selection. The EDMAC peripheral offloads packet handling via descriptor-based DMA, reducing CPU overhead during high-throughput traffic. This capability is fully implemented in the R5F5651EDGFC#30's silicon.

What security features does the R5F5651EDGFC#30 provide for firmware and data protection?

The R5F5651EDGFC#30 includes AES-128/192/256 encryption engines, Trusted Secure IP (TSIP) for key management and secure boot, memory protection unit (MPU) with eight configurable regions, and register write protection to prevent accidental or malicious overwrites. It also supports CRC calculation (CRCA) for data integrity and an independent watchdog timer (IWDT) with windowing for fail-safe recovery-all required for IEC60730 Class B certification. These features are silicon-verified and documented in the R5F5651EDGFC#30 datasheet.

How many analog-to-digital converter (ADC) channels does the R5F5651EDGFC#30 have, and what resolution options are supported?

The R5F5651EDGFC#30 integrates two independent 12-bit A/D converter units: S12AD0 with 8 input channels and S12AD1 with 21 input channels, totaling 29 configurable analog inputs. Each unit supports selectable resolution of 8-, 10-, or 12-bit modes, with minimum conversion times of 0.42 µs (8-bit), 0.45 µs (10-bit), and 0.48 µs (12-bit). Both units feature sample-and-hold circuits, self-diagnostic functions, and disconnection detection-fully specified for the R5F5651EDGFC#30 in its official documentation.

What is the package type and pin count of the R5F5651EDGFC#30, and is it RoHS compliant?

The R5F5651EDGFC#30 is housed in a PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 24 mm × 24 mm with 0.5 mm ball pitch. It provides 136 general-purpose I/O pins, 19 of which are 5-V tolerant. The device is RoHS compliant and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. This package information is confirmed in the R5F5651EDGFC#30 datasheet revision 2.40 and Renesas packaging documentation.