My Inquiry
My Account
Renesas R5F5651EHGBG#20
- Part No.:
- R5F5651EHGBG#20
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 176-LFBGA
- Datasheet:
-
R5F5651EHGBG#20.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 176LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:147
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R5F5651EHGBG#20 from Renesas is a 32-bit RXv2 core microcontroller operating at up to 120 MHz (240 DMIPS), featuring 1 MB on-chip code flash, 640 KB SRAM (no wait states), single-precision IEEE-754 FPU, and integrated Ethernet MAC, CAN, SD host/slave, QSPI, and GLCDC for embedded HMI and industrial connectivity applications.
For engineers reviewing the R5F5651EHGBG#20 datasheet, R5F5651EHGBG#20 pinout, R5F5651EHGBG#20 application, or R5F5651EHGBG#20 equivalent, key selection considerations include its 176-pin LFBGA package (PLQP0176KB-A), dual-bank flash support for safe firmware updates, 12-bit A/D with self-diagnostic capability, TSIP-based AES encryption, and IEC60730 safety features for certified control systems.
Technical Context
The R5F5651EHGBG#20 implements the RXv2 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code. It integrates a memory protection unit (MPU) and Trusted Memory (TM) function to isolate secure code execution in the flash target area, preventing unauthorized read access while allowing CPU instruction fetch only.
Clock management includes independent PLL, HOCO/LOCO oscillators, and configurable peripheral clock domains (PCLKA up to 120 MHz for ETHERC/DRW2D, PCLKB up to 60 MHz for timers/A/D). Real-time operation is supported by battery-backed RTC, IWDT with window function, and four low-power modes including deep software standby with 8 KB backup RAM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit, 120 MHz max, 240 DMIPS - enables real-time deterministic control with floating-point math for motor or sensor processing. |
| Memory | 1 MB code flash (dual-bank), 640 KB SRAM, 32 KB data flash - supports background programming and firmware swap without system halt. |
| Analog Peripherals | Two 12-bit A/D units (8 + 21 ch), 2-channel 12-bit D/A, on-die temperature sensor (±1°C) - provides high-resolution sensing and actuation for closed-loop systems. |
| Connectivity | Ethernet MAC (10/100 Mbps), 2× CAN (ISO11898-1), 3× RSPI, 3× I²C (1 Mbps), QSPI, SDHI/SDSI, USB 2.0 FS - enables multi-protocol industrial networking and storage interfacing. |
| Graphics & Timing | GLCDC + DRW2D engine, 256-color CLUT, 3-plane overlay, vector/bit-blit rendering - accelerates GUI rendering without external GPU or frame buffer RAM. |
| Safety & Security | IEC60730-compliant CRC calculator, MPU, register write protection, TSIP AES-128/192/256 - meets Class B functional safety requirements and protects firmware integrity. |
| Package & Temp | PLQP0176KB-A (176-pin LFBGA, 24 × 24 mm, 0.5 mm pitch), –40°C to +105°C (G-version) - suitable for automotive under-hood and industrial control environments. |
Pinout & Package
Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 mm × 24 mm body, 0.5 mm ball pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Power supply inputs | Separate digital/analog domains enable noise isolation; AVCC1 powers A/D and D/A converters for precision analog performance. |
| VBATT | Battery backup supply | Provides continuous power to RTC during main VCC dropout - maintains timekeeping and alarm functions in energy-conscious systems. |
| XTAL / EXTAL | Main crystal oscillator terminals | Supports 8–24 MHz external crystal for precise timing; paired with internal PLL to generate stable 120 MHz system clock. |
| ETH_MDC / ETH_MDIO | MDIO management interface | Enables configuration and status polling of external PHY via IEEE 802.3 clause 22 - eliminates need for dedicated management MCU. |
| TXD0 / RXD0 | SCI0 asynchronous serial I/O | Dedicated UART pins for debug console or host communication; compatible with standard TTL-level logic and RS-232 transceivers. |
| PE0–PE15 | General-purpose I/O port E | 16-bit parallel bus capable of driving LCD data lines or camera interface signals; supports event linking for hardware-triggered DMA transfers. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables seamless firmware updates: one bank executes while the other is reprogrammed, eliminating downtime during field upgrades. |
| Trusted Secure IP (TSIP) | Hardware-accelerated AES encryption with key wrapping and secure boot verification - prevents cloning and ensures firmware authenticity. |
| Event Link Controller (ELC) | 83 internal event sources can trigger peripherals directly (e.g., timer overflow → A/D start → DMA transfer), reducing CPU overhead and latency. |
| Graphic-LCD controller (GLCDC) | Integrated display controller supporting RGB565, YUV, and CLUT formats with triple-layer overlay - removes need for external display driver IC. |
| IEC60730 safety suite | Includes oscillation-stop detection, CRC calculator, IWDT windowing, and A/D self-test - simplifies certification for household appliances and industrial controllers. |
Applications
| Industrial HMI Panel | Smart Energy Gateway |
|---|---|
Use Scenario: Touch-enabled operator interface for PLC-controlled machinery with real-time diagnostics and alarm logging. IC Role / Device Role / Timing Role: Main application processor executing RTOS, rendering GUI via GLCDC+DRW2D, managing Ethernet/CAN fieldbus bridging, and sampling analog sensors. Use Value: On-chip graphics acceleration reduces BOM cost vs. external GPU; dual-bank flash enables remote OTA updates without production line interruption. | Use Scenario: DIN-rail mounted gateway aggregating data from smart meters (via RS485/CAN), uploading to cloud via Ethernet, and supporting local Zigbee/Z-Wave via USB-connected dongle. IC Role / Device Role / Timing Role: Central protocol translator and security enforcer, performing AES-encrypted payload packaging, RTC-synchronized data timestamping, and watchdog-monitored fail-safe reboot. Use Value: Integrated TSIP and IEC60730 features eliminate need for discrete security co-processor; SDHI supports local firmware rollback and log storage. |
| Automotive Body Control Module | Medical Infusion Pump Controller |
Use Scenario: Centralized vehicle body electronics unit managing door locks, lighting, HVAC, and CAN network diagnostics in passenger compartments. IC Role / Device Role / Timing Role: Safety-critical controller running ASIL-B compliant software, monitoring voltage rails via LVD, validating sensor inputs with A/D self-test, and controlling PWM-driven actuators. Use Value: MPU-enforced memory partitioning isolates safety-critical tasks; 105°C rating ensures reliability in under-dash thermal environments. | Use Scenario: Precision fluid delivery system requiring accurate motor control, pressure sensing, touch UI, and audit-trail logging for regulatory compliance. IC Role / Device Role / Timing Role: Real-time motion controller using TPU/MTU3 PWM outputs, acquiring analog pressure/flow signals via S12AD, and rendering therapy status on color LCD. Use Value: 12-bit A/D with disconnection detection prevents false readings from open-sensor faults; buffered D/A channels drive piezo valves with sub-millisecond response. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F565NEDFP#30 | Same RX65N family, 176-pin LQFP package, 2 MB flash, identical peripheral set - differs only in package (LQFP vs LFBGA) and flash size. | LQFP simplifies prototyping and manual rework but occupies more PCB area; lacks thermal performance of LFBGA for high-power density designs. | Select when board assembly uses through-hole or hand-soldered prototypes; verify thermal margin if operating near 105°C ambient. |
| R7FA6M2AF3CFP#AA0 | RX72M family successor: higher 200 MHz CPU, enhanced EtherCAT support, same pin count but different pinout - not pin-compatible. | Targets next-gen motion control with real-time industrial Ethernet; requires full PCB redesign and firmware adaptation due to architectural changes. | Choose for new designs needing EtherCAT master capability or >240 DMIPS; avoid for drop-in replacement of R5F5651EHGBG#20. |
Compared with R5F5651EHGBG#20, the R5F565NEDFP#30 offers identical functionality in an LQFP package ideal for development, while the R7FA6M2AF3CFP#AA0 delivers higher performance and EtherCAT readiness at the cost of full hardware and software requalification.
Availability
R5F5651EHGBG#20 is available at Aetrix Electronics and suitable for industrial HMI panels, smart energy gateways, automotive body control modules, and medical infusion pump controllers requiring stable component supply across extended product lifecycles.
Supply support for R5F5651EHGBG#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX65N Group, which includes the R5F5651EHGBG#20, was designed specifically for high-integration industrial human-machine interfaces and networked control systems requiring rich graphics, multiple communication protocols, and functional safety certification.
FAQ
What is the maximum operating frequency and DMIPS rating of the R5F5651EHGBG#20?
The R5F5651EHGBG#20 operates at a maximum frequency of 120 MHz and delivers 240 DMIPS (Dhrystone MIPS) performance. This is achieved through its optimized RXv2 CPU core with 5-stage pipeline and single-cycle 32-bit multiply. The R5F5651EHGBG#20 sustains this throughput across mixed workloads including floating-point math, interrupt handling, and peripheral I/O - critical for real-time industrial control loops.
Does the R5F5651EHGBG#20 support dual-bank flash for firmware updates?
Yes, the R5F5651EHGBG#20 supports dual-bank flash architecture in its 1 MB code flash memory. This allows background programming of one bank while executing code from the other, enabling zero-downtime firmware updates. The R5F5651EHGBG#20 implements bank switching via the FCLK divider and secure boot validation to prevent invalid bank activation - a key requirement for certified over-the-air (OTA) update systems.
What graphics capabilities does the R5F5651EHGBG#20 provide for HMI applications?
The R5F5651EHGBG#20 integrates a Graphic-LCD Controller (GLCDC) supporting RGB565, YUV, and CLUT-based displays up to WXGA resolution, plus a 2D Drawing Engine (DRW2D) for vector graphics and bit-blit operations. These accelerators offload GUI rendering from the CPU, enabling smooth animation and multi-layer overlays without external graphics memory. The R5F5651EHGBG#20's DRW2D supports rotation, scaling, and run-length encoding - essential for responsive touch-based HMIs in factory automation.
How does the R5F5651EHGBG#20 meet IEC60730 safety requirements?
The R5F5651EHGBG#20 includes multiple hardware features required for Class B IEC60730 compliance: oscillation-stop detection for clock monitoring, CRC calculator (CRCA) for memory/data integrity, independent watchdog timer (IWDT) with windowing, register write protection, and A/D converter self-diagnostic mode. These features are documented in Renesas' IEC60730 safety manual for the RX65N Group and validated in the R5F5651EHGBG#20 silicon - enabling certified appliance and industrial controller designs without external safety monitors.
What is the package type and thermal specification of the R5F5651EHGBG#20?
The R5F5651EHGBG#20 is housed in a PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 24 mm × 24 mm with 0.5 mm ball pitch. It is rated for operation from –40°C to +105°C (G-version), making it suitable for under-hood automotive and industrial environments. The LFBGA construction provides superior thermal dissipation compared to QFP alternatives, supporting sustained 120 MHz operation in compact, sealed enclosures.
R5F5651EHGBG#20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 176-LFBGA
- Series:
- RX651
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RXv2
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 136
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 640K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 29x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F5651EHGBG#20 FAQ
1.How can I place an order for R5F5651EHGBG#20 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F5651EHGBG#20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F5651EHGBG#20 reliable?
The price and inventory of R5F5651EHGBG#20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F5651EHGBG#20 is usually 5 days.
3.What payment methods are accepted for R5F5651EHGBG#20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F5651EHGBG#20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F5651EHGBG#20?
R5F5651EHGBG#20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F5651EHGBG#20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F5651EHGBG#20?
For technical support, including R5F5651EHGBG#20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F5651EHGBG#20 requirements.
6.How does Aetrix verify that R5F5651EHGBG#20 is sourced from the original manufacturer or authorized distributors?
All R5F5651EHGBG#20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F5651EHGBG#20 meets industry standards.
7.What is the process for return or replacement of R5F5651EHGBG#20?
All R5F5651EHGBG#20 units undergo pre-shipment inspection (PSI). If there is an issue with R5F5651EHGBG#20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F5651EHGBG#20 part is unused and in its original packaging.
Return procedure for R5F5651EHGBG#20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R5F5651EHGBG#20 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
