Renesas R5F5651EHGBP#20

Overview

R5F5651EHGBP#20 from Renesas is a 32-bit RXv2 core microcontroller operating at up to 120 MHz (240 DMIPS), featuring 1.5 MB on-chip code flash, 640 KB SRAM (including 8 KB standby RAM), single-precision IEEE-754 FPU, Ethernet MAC, dual CAN channels, SD host/slave interfaces, and hardware AES-128/192/256 encryption - deployed in industrial HMI, networked gateway, and secure IoT edge node applications.

For engineers reviewing the R5F5651EHGBP#20 datasheet, R5F5651EHGBP#20 pinout, R5F5651EHGBP#20 application, or R5F5651EHGBP#20 equivalent, key selection criteria include its 176-pin LFBGA package with 136 GPIOs (19 × 5-V tolerant), dual-bank flash for safe firmware updates, integrated GLCDC + DRW2D for embedded graphics, and IEC60730-compliant safety features including CRC, IWDT, and register write protection.

Technical Context

The R5F5651EHGBP#20 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates a dedicated 120-kHz IWDT clock source, memory protection unit (MPU) with eight configurable regions, and Trusted Memory (TM) for secure code execution from protected flash areas.

Its peripheral subsystem includes an Ethernet MAC with RMII/MII support, two CAN 2.0B controllers (32 mailboxes each), three RSPI channels, quad SPI interface, and dual SD interfaces (host + slave) compliant with SD Physical Layer v3.01 and SDIO v3.00 - all synchronized to independent PCLK domains (PCLKA up to 120 MHz, PCLKB up to 60 MHz).

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Quad Flat Package (LFBGA), 24 mm × 24 mm, 0.5 mm pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F5651EHGBP#20, the R5F565NEDFP#30 reduces BOM cost by omitting Ethernet and graphics peripherals while retaining CAN and security features in a smaller footprint; the R7FA6M2AF3CFP#AA0 trades SDIO/TSIP for CAN FD and higher motor-control DSP capability - making R5F5651EHGBP#20 uniquely balanced for secure, graphics-enabled, multi-protocol edge nodes.

Availability

R5F5651EHGBP#20 is available at Aetrix Electronics and suitable for industrial HMI, smart energy gateways, and medical edge sensor hubs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F5651EHGBP#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets.

The RX65N Group - including R5F5651EHGBP#20 - was designed for secure, graphics-rich, network-connected industrial edge devices requiring functional safety compliance and real-time deterministic performance.

FAQ

What is the maximum operating frequency and core type of the R5F5651EHGBP#20?

The R5F5651EHGBP#20 features a 32-bit RXv2 CPU core with a maximum operating frequency of 120 MHz, delivering 240 DMIPS performance. Its Harvard architecture with 5-stage pipeline and variable-length instruction set enables high code density and efficient real-time execution - critical for deterministic industrial control tasks executed by the R5F5651EHGBP#20.

Does the R5F5651EHGBP#20 support secure firmware updates?

Yes, the R5F5651EHGBP#20 supports secure firmware updates via its dual-bank flash architecture and Trusted Memory (TM) feature. This allows background programming of one bank while executing from the other, enabling atomic, fail-safe updates. The TM function protects critical boot code from unauthorized read access - a key security capability built into the R5F5651EHGBP#20.

What graphics capabilities does the R5F5651EHGBP#20 provide?

The R5F5651EHGBP#20 integrates a Graphic-LCD Controller (GLCDC) and 2D Drawing Engine (DRW2D). The GLCDC supports up to three overlay planes (background, graphic 1, graphic 2) and multiple pixel formats (1–32 bpp). The DRW2D accelerates vector drawing, bit blitting, rotation, and scaling - offloading graphics processing from the CPU and enabling responsive UIs in applications using the R5F5651EHGBP#20.

Which communication interfaces are integrated into the R5F5651EHGBP#20?

The R5F5651EHGBP#20 integrates Ethernet MAC (10/100 Mbps, RMII/MII), dual CAN 2.0B channels (32 mailboxes each), SD host and slave interfaces (SDIO v3.00, SD Physical Layer v3.01), quad SPI, three RSPI channels, three I²C buses (up to 1 Mbps), and full-speed USB 2.0 host/function/OTG - providing comprehensive wired connectivity essential for modern industrial and IoT edge nodes built around the R5F5651EHGBP#20.

Is the R5F5651EHGBP#20 qualified for extended temperature operation?

Yes, the R5F5651EHGBP#20 is the G-version part, rated for operation from –40°C to +105°C. This extended temperature range, combined with its IEC60730-compliant safety features (CRC, IWDT, self-diagnostic A/D), makes it suitable for deployment in harsh industrial environments such as factory automation, energy infrastructure, and transportation systems where the R5F5651EHGBP#20 operates reliably under thermal stress.