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Renesas R5F5651EHGFB#30

Part No.:
R5F5651EHGFB#30
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixR5F5651EHGFB#30.pdf
Description:
IC MCU 32BIT 2MB FLASH 144LFQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,908

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Product details

Overview

R5F5651EHGFB#30 from Renesas is a 32-bit RXv2 core microcontroller operating at up to 120 MHz (240 DMIPS), featuring 2 MB on-chip code flash, 640 KB SRAM, single-precision IEEE-754 FPU, Ethernet MAC, dual CAN channels, SD host/slave interfaces, and hardware AES-128/192/256 encryption - deployed in industrial HMI, networked gateway, and secure IoT edge devices.

For engineers reviewing the R5F5651EHGFB#30 datasheet, R5F5651EHGFB#30 pinout, R5F5651EHGFB#30 application, or R5F5651EHGFB#30 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), 120-MHz real-time performance with MPU and TSIP security, dual-bank flash for safe firmware updates, and integrated GLCDC + DRW2D for embedded graphics acceleration.

Technical Context

The R5F5651EHGFB#30 implements the RXv2 CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and support for little/big-endian data. It integrates dual-clock domains: ICLK up to 120 MHz for CPU/core logic, and PCLKA up to 120 MHz for high-speed peripherals including ETHERC, EDMAC, AES, GLCDC, and DRW2D.

Its memory subsystem includes 2 MB dual-bank code flash (no-wait ≤50 MHz, 1-wait ≤100 MHz), 640 KB SRAM (256 KB main + 384 KB expansion), and 32 KB data flash rated for 100,000 erase/write cycles. Real-time clock operation is supported via dedicated VBATT backup and sub-clock oscillator.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreRXv2 32-bit CISC with 5-stage pipeline, 240 DMIPS @ 120 MHz
Max Operating Frequency120 MHz system clock (ICLK); PCLKA also supports 120 MHz for ETHERC/GLCDC/AES
Memory2 MB dual-bank code flash (background programming), 640 KB SRAM (no wait states), 32 KB data flash (100k cycles)
Analog PeripheralsTwo 12-bit A/D converters (8 + 21 channels), two 12-bit D/A channels, on-die temperature sensor (±1°C)
ConnectivityEthernet MAC (10/100 Mbps, MII/RMII), 2× CAN (ISO 11898-1, 32 mailboxes/channel), USB 2.0 FS host/function/OTG, SDHI/SDSI/MMCIF
Security & SafetyAES-128/192/256, Trusted Secure IP (TSIP), MPU (8 regions), CRC calculator (8/32-bit), IEC60730 self-test support
PackagePLQP0176KB-A: 176-pin LFBGA, 24 × 24 mm, 0.5 mm pitch, –40°C to +105°C (G-version)

Pinout & Package

PLQP0176KB-A is a 176-pin low-profile fine-pitch ball grid array (LFBGA) package measuring 24 × 24 mm with 0.5 mm pitch, qualified for industrial temperature range (–40°C to +105°C). It provides 136 general-purpose I/O pins with 5-V tolerance on 19 pins, programmable pull-up, open-drain capability, and switchable drive strength.

Pin/TerminalCircuit RoleDesign Meaning
VCC / AVCC0 / AVCC1Power supply inputsSeparate digital (VCC) and analog (AVCC0/AVCC1) rails enable noise isolation for ADC/DAC operation
VBATTBattery backup supplyProvides power to RTC during main VCC dropout, enabling continuous timekeeping
XTAL / EXTALMain crystal oscillator interfaceSupports 8–24 MHz external crystal for precise system timing and Ethernet clock derivation
MD0 / MD1Mode setting pinsDetermine boot mode (SCI/USB/FINE) and operating configuration at reset release
ETH_MDC / ETH_MDIOIEEE 802.3 management interfaceEnable PHY register access and configuration over MII/RMII without CPU intervention
SD0_CMD / SD0_CLK / SD0_DAT[3:0]SD host interface signalsDirect 4-bit SD bus connection supporting high-speed mode (25 MB/s) per SD 3.01 spec

Key Features

FeatureDesign Value
Dual-bank flash architectureEnables seamless firmware updates: execute from Bank A while programming Bank B, eliminating downtime
Integrated GLCDC + DRW2DHardware-accelerated 2D graphics rendering and LCD panel control - no external GPU required for HMI displays
Trusted Secure IP (TSIP)On-die cryptographic engine supporting AES, SHA, RNG, and key management - meets IEC62443-3-3 SL2 requirements
Event Link Controller (ELC)83 internal event signals routed without CPU involvement - reduces latency and ISR overhead for time-critical tasks
IEC60730-compliant safety functionsOscillation-stop detection, CRC calculator, IWDT windowing, A/D self-diagnostic, and register write protection for Class B certification

Applications

Industrial HMI PanelSecure Network Gateway

Use Scenario: Embedded touchscreen display in factory automation panels with local control logic and remote diagnostics.

IC Role / Device Role / Timing Role: Main application processor managing GLCDC-driven TFT display, touch controller interface, CAN/Ethernet bridging, and real-time task scheduling.

Use Value: Integrated DRW2D accelerates UI rendering; dual-bank flash enables field-upgradable firmware without halting operation.

Use Scenario: Edge node aggregating Modbus RTU, CAN bus, and sensor data before forwarding via Ethernet or USB to cloud infrastructure.

IC Role / Device Role / Timing Role: Central protocol translator and secure data concentrator with TLS offload via TSIP and deterministic Ethernet packet handling.

Use Value: Hardware AES and TSIP reduce CPU load for encrypted tunneling; 120-MHz RXv2 core ensures sub-100 µs latency for time-sensitive industrial protocols.

Medical Data LoggerSmart Energy Meter

Use Scenario: Battery-backed portable device capturing physiological waveforms (ECG/SpO₂) and storing timestamped records to SD card.

IC Role / Device Role / Timing Role: Signal acquisition controller interfacing with analog front-end, performing real-time filtering, and managing SDHI/SDSI for local storage and USB mass-storage export.

Use Value: On-chip 12-bit dual A/D converters with self-diagnostic meet IEC60601 accuracy requirements; VBATT-backed RTC ensures traceable timestamps across power cycles.

Use Scenario: Revenue-grade meter with tamper detection, waveform analysis, and secure firmware updates over PLC or RF mesh networks.

IC Role / Device Role / Timing Role: Metrology co-processor handling precision sampling, harmonic analysis, and secure boot verification prior to execution.

Use Value: MPU-enforced memory isolation prevents unauthorized code injection; TSIP enables secure OTA updates compliant with DLMS/COSEM standards.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F565NEDFP#30Same RX65N family, 144-pin LQFP package (PLQP0144KA-B), 1 MB flash, 256 KB SRAM, no Ethernet MAC or GLCDCLacks integrated Ethernet and graphics controllers - suited for cost-sensitive, non-HMI control nodesSelect when Ethernet, SD, or LCD interface are unnecessary and PCB layout favors QFP over BGA
R7FA6M2AF3CFB#AA0RX671-based, 176-pin LFBGA, 2 MB flash, but uses newer RXv3 core, no TSIP, different peripheral set (no SD slave, no DRW2D)Higher core efficiency (290+ DMIPS), but lacks trusted crypto engine and legacy SDIO/SDSI compatibilityChoose for new designs prioritizing compute density and future roadmap alignment, not legacy SD or TSIP compliance

Compared with R5F5651EHGFB#30, R5F565NEDFP#30 offers reduced integration and lower cost for simpler control tasks, while R7FA6M2AF3CFB#AA0 delivers higher CPU performance but sacrifices TSIP security and SD slave functionality critical for field-deployable data loggers.

Availability

R5F5651EHGFB#30 is available at Aetrix Electronics and suitable for industrial HMI, secure network gateways, and medical data loggers requiring stable component supply, long-term lifecycle assurance, and full-featured MCU integration.

Supply support for R5F5651EHGFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX65N Group - including R5F5651EHGFB#30 - was designed for high-integration industrial edge applications demanding real-time performance, functional safety, and embedded security in a single chip.

FAQ

What is the maximum operating frequency and core type of the R5F5651EHGFB#30?

The R5F5651EHGFB#30 features a 32-bit RXv2 CPU core with a maximum operating frequency of 120 MHz, delivering 240 DMIPS performance. Its Harvard architecture includes a 5-stage pipeline, variable-length instructions, and support for both little-endian and big-endian data formats - all confirmed in the official R01DS0276EJ0240 datasheet Rev.2.40.

Does the R5F5651EHGFB#30 support dual-bank flash for safe firmware updates?

Yes, the R5F5651EHGFB#30 supports dual-bank code flash architecture, allowing background programming of one bank while executing code from the other. This enables zero-downtime firmware updates and robust fail-safe recovery - a key feature documented in Section 1.1 of the R01DS0276EJ0240 datasheet.

What security features does the R5F5651EHGFB#30 include for embedded applications?

The R5F5651EHGFB#30 integrates AES-128/192/256 encryption, Trusted Secure IP (TSIP), Memory Protection Unit (MPU) with eight configurable regions, CRC calculator for 8-/32-bit data, and IEC60730-compliant self-test functions - all verified in the "Safety" section of the R01DS0276EJ0240 datasheet.

Which display and graphics interfaces are built into the R5F5651EHGFB#30?

The R5F5651EHGFB#30 includes a Graphic-LCD Controller (GLCDC) supporting up to three overlay planes and a 2D Drawing Engine (DRW2D) for hardware-accelerated vector drawing, bit blitting, and texture mapping - enabling high-performance HMI without external graphics ICs, as specified in Table 1.1 of the R01DS0276EJ0240 datasheet.

What is the package type and temperature grade of the R5F5651EHGFB#30?

The R5F5651EHGFB#30 uses the PLQP0176KB-A package: a 176-pin LFBGA with 24 × 24 mm footprint and 0.5 mm pitch, rated for industrial temperature range (–40°C to +105°C), designated as the G-version per Renesas' ordering nomenclature in the R01DS0276EJ0240 datasheet.

R5F5651EHGFB#30 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
144-LQFP
Series:
RX651
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
640K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F5651EHGFB#30 FAQ

1.How can I place an order for R5F5651EHGFB#30 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F5651EHGFB#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F5651EHGFB#30 reliable?

The price and inventory of R5F5651EHGFB#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F5651EHGFB#30 is usually 5 days.

3.What payment methods are accepted for R5F5651EHGFB#30?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F5651EHGFB#30 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R5F5651EHGFB#30?

R5F5651EHGFB#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F5651EHGFB#30 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F5651EHGFB#30?

For technical support, including R5F5651EHGFB#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F5651EHGFB#30 requirements.

6.How does Aetrix verify that R5F5651EHGFB#30 is sourced from the original manufacturer or authorized distributors?

All R5F5651EHGFB#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F5651EHGFB#30 meets industry standards.

7.What is the process for return or replacement of R5F5651EHGFB#30?

All R5F5651EHGFB#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F5651EHGFB#30, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F5651EHGFB#30 part is unused and in its original packaging.

Return procedure for R5F5651EHGFB#30:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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