Renesas R5F5651EHGFC#V0

Overview

R5F5651EHGFC#V0 from Renesas is a 32-bit RXv2 core microcontroller operating at up to 120 MHz (240 DMIPS), featuring 1 MB on-chip code flash, 256 KB SRAM, single-precision IEEE-754 FPU, Ethernet MAC, dual CAN 2.0B channels, and hardware AES-128/192/256 encryption - deployed in industrial HMIs with real-time graphics and secure firmware updates.

For engineers reviewing the R5F5651EHGFC#V0 datasheet, R5F5651EHGFC#V0 pinout, R5F5651EHGFC#V0 application, or R5F5651EHGFC#V0 equivalent, key selection criteria include its 176-pin LFBGA package, 120-MHz deterministic real-time performance, integrated GLCDC + DRW2D for embedded GUIs, and IEC60730-compliant safety features including CRC, IWDT, and register write protection.

Technical Context

The R5F5651EHGFC#V0 implements the RXv2 CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and MPU-enforced memory protection. It integrates dual-bank flash for safe firmware updates and supports little- or big-endian data arrangement with 4-Gbyte linear address space.

Clock subsystem includes PLL-synthesized 120-MHz ICLK, independent PCLKA/PCLKB domains (up to 120 MHz/60 MHz), and dedicated IWDT oscillator. Peripheral clocking enables concurrent high-speed operation of ETHERC, GLCDC, DRW2D (PCLKA), and S12AD units (PCLKC/PCLKD).

Key Specifications

Pinout & Package

Package: PLQP0176KB-A, 176-pin LFBGA, 24 × 24 mm, 0.5-mm pitch, –40°C to +85°C (D-version).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F5651EHGFC#V0, the R5F5651EHLFC#V0 offers identical functionality with extended temperature rating, while the R5F565NEDFP#30 trades graphics capability for doubled flash/SRAM - making the former ideal for thermal ruggedness and the latter for non-graphical high-memory applications.

Availability

R5F5651EHGFC#V0 is available at Aetrix Electronics and suitable for industrial HMIs, secure gateways, medical device controllers, and smart energy meters requiring stable component supply across long production lifecycles.

Supply support for R5F5651EHGFC#V0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets.

The RX651 Group targets high-integration industrial and medical applications requiring real-time performance, functional safety, and rich connectivity - with R5F5651EHGFC#V0 optimized for graphics-enabled edge devices needing compact footprint and security.

FAQ

What is the maximum operating frequency and core architecture of the R5F5651EHGFC#V0?

The R5F5651EHGFC#V0 operates at a maximum frequency of 120 MHz using the 32-bit RXv2 CPU core, achieving 240 DMIPS performance. Its CISC Harvard architecture features a 5-stage pipeline, variable-length instructions, and support for both little- and big-endian data formats. The core includes an on-chip 32-bit multiplier and divider, single-precision IEEE-754 FPU, and memory protection unit - all confirmed in the official R01DS0276EJ0240 datasheet for the RX651 Group. This makes R5F5651EHGFC#V0 suitable for deterministic real-time control tasks.

Does the R5F5651EHGFC#V0 support hardware-accelerated graphics rendering?

Yes, the R5F5651EHGFC#V0 integrates both a Graphic-LCD Controller (GLCDC) and a 2D Drawing Engine (DRW2D). The GLCDC supports up to 24-bit parallel interfaces for TFT panels (e.g., 800×480), while DRW2D provides hardware-accelerated vector drawing (lines, triangles, circles), bit-blitting (copy, stretch, rotate), and triple-plane overlay. These peripherals operate independently of the CPU, reducing load during UI rendering. This capability is explicitly documented in Section 1.1 of the R01DS0276EJ0240 datasheet and distinguishes R5F5651EHGFC#V0 from non-graphics RX65x variants.

What safety and security features does the R5F5651EHGFC#V0 include for IEC60730 compliance?

The R5F5651EHGFC#V0 includes multiple IEC60730 Class B–compliant features: oscillation-stoppage detection, CRC calculator (CRCA) for memory/data integrity, independent watchdog timer (IWDT) with configurable windowing, self-diagnostic A/D test modes, and register write protection. It also supports Trusted Memory (TM) to prevent unauthorized code read-out. These functions are validated in Renesas' safety manual R01UM0590EJ0200 and directly referenced in the R01DS0276EJ0240 datasheet. For certified implementations, R5F5651EHGFC#V0 reduces need for external safety monitors.

What is the package type and pin count of the R5F5651EHGFC#V0?

The R5F5651EHGFC#V0 uses the PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), measuring 24 × 24 mm with 0.5-mm ball pitch. It is rated for industrial temperature range (–40°C to +85°C, D-version). This package supports 136 general-purpose I/O pins with 5-V tolerance on 19 pins, open-drain capability, and programmable pull-up resistors - as specified in Table 1.2 of the R01DS0276EJ0240 datasheet. No alternate packages are assigned to this exact part number.

Can the R5F5651EHGFC#V0 execute firmware updates without interrupting operation?

Yes, the R5F5651EHGFC#V0 supports seamless firmware updates via its dual-bank flash architecture. One bank remains active for execution while the other is reprogrammed in background - enabling live updates without halting real-time tasks. Programming/erasing occurs as background operations (BGOs), and startup bank can be exchanged dynamically. This behavior is guaranteed by the on-chip flash controller and verified in Section 2.3.1 of the R01DS0276EJ0240 datasheet. Applications such as R5F5651EHGFC#V0-based gateways rely on this feature for secure, zero-downtime OTA deployments.