Renesas R5F5651EHGFP#30

Overview

R5F5651EHGFP#30 from Renesas is a 120-MHz 32-bit RXv2 core MCU with on-chip FPU, 240 DMIPS performance, 2 MB code flash (dual-bank), 640 KB SRAM, Ethernet MAC, CAN, SD host/slave, QSPI, and hardware AES-128/192/256 encryption - deployed in industrial HMI, networked gateways, and secure IoT edge controllers.

For engineers reviewing the R5F5651EHGFP#30 datasheet, R5F5651EHGFP#30 pinout, R5F5651EHGFP#30 application, or R5F5651EHGFP#30 equivalent, key selection considerations include its 176-pin LFBGA package, -40°C to +105°C G-grade operation, integrated GLCDC+DRW2D for embedded graphics, and dual-bank flash enabling safe firmware updates without halting real-time execution.

Technical Context

The R5F5651EHGFP#30 implements the RXv2 CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and IEEE-754 single-precision FPU - delivering deterministic 240 DMIPS at 120 MHz. It integrates a memory protection unit (MPU) with eight configurable regions and Trusted Memory (TM) for secure code execution in safety-critical applications.

Its clock system combines external crystal (8–24 MHz), internal HOCO (16/18/20 MHz), LOCO (240 kHz), and PLL to generate independent clocks for CPU (ICLK ≤ 120 MHz), peripherals (PCLKA ≤ 120 MHz, PCLKB ≤ 60 MHz), ADC (ADCLK ≤ 60 MHz), and flash interface (FCLK ≤ 60 MHz), enabling precise timing isolation across subsystems.

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 mm × 24 mm, 0.5 mm pitch, 136 general-purpose I/O pins with 5-V tolerance, open-drain capability, and programmable pull-up resistors.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F5651EHGFP#30, the R5F565NEDFP#30 offers identical functionality at lower thermal rating, while the R7FA6M2AF3CFP#AA0 trades Ethernet/GLCDC for CAN FD and stronger cryptographic primitives - making R5F5651EHGFP#30 optimal for graphics-enabled, Ethernet-connected industrial edge nodes requiring extended temperature resilience.

Availability

R5F5651EHGFP#30 is available at Aetrix Electronics and suitable for industrial HMI, secure edge gateways, and networked building controllers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F5651EHGFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX65N Group - including R5F5651EHGFP#30 - was designed for high-integrity industrial applications demanding integrated Ethernet, graphics, security, and functional safety support per IEC 60730.

FAQ

What is the maximum operating frequency and CPU performance of the R5F5651EHGFP#30?

The R5F5651EHGFP#30 operates at a maximum frequency of 120 MHz using the RXv2 32-bit CPU core and delivers 240 DMIPS of computational performance. Its single-precision IEEE-754 floating-point unit, dual multiply-accumulate units, and 5-stage pipeline enable deterministic real-time execution critical for industrial control loops and signal processing tasks within the R5F5651EHGFP#30.

Does the R5F5651EHGFP#30 support secure firmware updates?

Yes, the R5F5651EHGFP#30 supports secure firmware updates via its dual-bank flash architecture and Trusted Memory (TM) feature. The dual-bank structure allows background programming (BGO) of one bank while executing from the other, ensuring zero-downtime updates. TM protects designated code areas from unauthorized read access, and the integrated AES engine enables encrypted image verification before loading - all enforced within the R5F5651EHGFP#30 silicon.

What graphics capabilities does the R5F5651EHGFP#30 provide?

The R5F5651EHGFP#30 integrates a Graphic-LCD Controller (GLCDC) supporting up to three overlay planes (background, graphic 1, graphic 2) and a 2D Drawing Engine (DRW2D) capable of vector drawing (lines, triangles, circles) and bit blitting with rotation and scaling. These hardware accelerators offload GUI rendering from the CPU, enabling smooth animation and responsive touch interfaces directly within the R5F5651EHGFP#30 without external graphics ICs.

How many communication interfaces does the R5F5651EHGFP#30 include?

The R5F5651EHGFP#30 includes Ethernet MAC (10/100 Mbps), CAN (2 channels, 32 mailboxes each), USB 2.0 FS host/function/OTG, SD host/slave, QSPI, three RSPI, three RIIC, 13 SCI channels (including FIFO-equipped SCIi), and MMCIF - totaling 29 dedicated serial/parallel communication peripherals. This comprehensive set enables complex multi-protocol connectivity in a single R5F5651EHGFP#30 device for gateway and edge node applications.

Is the R5F5651EHGFP#30 qualified for industrial temperature operation?

Yes, the R5F5651EHGFP#30 is rated for G-grade industrial operation from –40°C to +105°C, validated per JEDEC JESD22-A104 and JESD22-A108 standards. Its thermal design, package construction (PLQP0176KB-A), and internal voltage regulation ensure reliable operation across this extended range - making it suitable for deployment in harsh environments such as factory automation, outdoor infrastructure, and transportation systems where the R5F5651EHGFP#30 must maintain functional integrity under thermal stress.