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Renesas R5F565N4BGFB#10

Part No.:
R5F565N4BGFB#10
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixR5F565N4BGFB#10.pdf
Description:
IC MCU 32BIT 512KB FLASH 144LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,119

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Product details

Overview

R5F565N4BGFB#10 from Renesas is a 32-bit RXv2 microcontroller with 120 MHz CPU, 240 DMIPS performance, single-precision IEEE-754 FPU, 2 MB on-chip code flash, 640 KB SRAM, and integrated Ethernet MAC, CAN, SD host/slave, QSPI, GLCDC, and DRW2D graphics engine - deployed in industrial HMIs, networked gateways, and secure IoT edge controllers.

For engineers reviewing the R5F565N4BGFB#10 datasheet, R5F565N4BGFB#10 pinout, R5F565N4BGFB#10 application, or R5F565N4BGFB#10 equivalent, key selection criteria include dual-bank flash for safe firmware updates, 136 GPIOs with 5-V tolerance, hardware AES/TSIP encryption, and real-time clock with battery backup - all in a 176-pin LFBGA (13 × 13 mm, 0.8-mm pitch) package rated for –40°C to +105°C operation.

Technical Context

The R5F565N4BGFB#10 implements the RXv2 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code. It integrates dual-bank flash for background programming and bank-swapping during runtime, supporting zero-downtime firmware updates in safety-critical systems.

Its peripheral set includes an Ethernet MAC with RMII/MII support, two CAN 2.0B channels (32 mailboxes each), three RSPI interfaces, one QSPI for serial flash, and dedicated graphics accelerators (GLCDC + DRW2D) with 3-plane overlay and vector/bit-blit rendering - all synchronized to independent clock domains (ICLK up to 120 MHz, PCLKA up to 120 MHz, PCLKB up to 60 MHz).

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core RXv2 32-bit, 120 MHz max - delivers 240 DMIPS and supports IEEE-754 single-precision FPU for deterministic floating-point math in motor control or sensor fusion.
Memory 2 MB dual-bank code flash (no-wait ≤50 MHz, 1-wait ≤100 MHz), 640 KB SRAM (no-wait at 120 MHz), 32 KB data flash (100k write cycles) - enables robust firmware update and data logging.
Package & Temp LFBGA-176 (PLBG0176GA-A, 13 × 13 mm, 0.8-mm pitch), G-grade - rated for –40°C to +105°C industrial operation with full peripheral availability.
I/O & Peripherals 136 GPIOs (5-V tolerant, open-drain, pull-up), 2× CAN, 1× Ethernet MAC, 1× SDHI/SDSI, 1× QSPI, 3× RSPI, 3× I²C, 13× SCI, GLCDC + DRW2D - supports complex HMI and gateway connectivity.
Security & Safety AES-128/192/256 + TSIP hardware accelerator, MPU (8 regions), Trusted Memory (TM), CRC calculator (8/32-bit), IEC60730 self-test functions - meets functional safety requirements for Class B appliances.
Analog Two 12-bit S12AD units (8 + 21 ch), 2× 12-bit R12DA, on-chip temperature sensor (±1°C), RTC with battery backup - enables local sensing, actuation, and time-stamped event logging.

Pinout & Package

Package: PLBG0176GA-A, 176-pin LFBGA, 13 × 13 mm, 0.8-mm pitch, G-grade (–40°C to +105°C). Pinout validated per Renesas R01DS0276EJ0240 Rev.2.40, pages 132–139 (pin function mapping for R5F565N4xGFB variants).

Pin/Terminal Circuit Role Design Meaning
VCC, AVCC0, AVCC1 Power supply inputs Separate digital (VCC), analog unit 0 (AVCC0), and analog unit 1 (AVCC1) supplies - enable noise isolation for precision ADC/DAC operation.
VBATT Battery backup input Supplies RTC during main power loss - maintains calendar/timekeeping and alarm functionality without external circuitry.
RES# Active-low reset input Hardware reset assertion; synchronous release ensures deterministic startup sequence and avoids metastability.
CLKIN, CLKOUT External crystal interface Supports 8–24 MHz crystal for main clock; CLKOUT provides buffered system clock output for trace/debug or external timing sync.
ETXD0–ETXD3, ETXEN, ETXER, ERXD0–ERXD3, ERXDV, ERXER Ethernet PHY interface RMII-compliant 2-wire (TX/RX) or MII-compliant 8-wire physical layer interface - selectable via mode pins and register configuration.
MDIO, MDC PHY management interface IEEE 802.3-compliant MDIO/MDC bus for configuring external PHY registers (e.g., link status, speed, duplex).
SD0DAT0–SD0DAT3, SD0CMD, SD0CLK SD host interface signals 4-bit SD bus supporting high-speed mode (25 MB/s); compatible with SD memory cards and SDIO peripherals per Physical Layer Spec v3.01.

Key Features

Feature Design Value
Dual-bank flash architecture Enables background programming and seamless bank switching - critical for OTA updates without service interruption in field-deployed gateways.
Integrated GLCDC + DRW2D Hardware-accelerated 2D graphics with 3-plane overlay, alpha blending, and vector drawing - eliminates need for external GPU in industrial HMIs.
Hardware AES + TSIP Side-channel resistant cryptographic engine supporting AES-128/192/256 and secure key storage - satisfies IEC 62443-3-3 SL2 requirements for embedded devices.
Event Link Controller (ELC) 83 internal event sources routed without CPU intervention - reduces latency and jitter in time-critical sequences (e.g., PWM-triggered ADC sampling).
IEC60730-compliant safety features Oscillation-stop detection, CRC calculator, IWDT windowing, A/D self-diagnostic, register write protection - simplifies Class B certification for home/industrial appliances.

Applications

Industrial HMI Controller Secure IoT Gateway

Use Scenario: Touch-enabled factory floor display with real-time machine status, alarm history, and parameter configuration.

IC Role / Device Role / Timing Role: Main application processor running RTOS, driving TFT-LCD via GLCDC, capturing touch via SCI/ADC, and communicating over CAN/Ethernet.

Use Value: DRW2D hardware acceleration renders UI elements at 60 fps with <5% CPU load; dual-bank flash allows silent firmware patching during scheduled maintenance windows.

Use Scenario: Edge gateway aggregating Modbus RTU, CAN bus, and BLE sensor data, then forwarding to cloud via TLS-secured Ethernet.

IC Role / Device Role / Timing Role: Secure protocol translator with hardware AES/TSIP for encrypted tunneling, Ethernet MAC for upstream comms, and multiple SCI/RSPI for legacy device interfacing.

Use Value: On-chip TSIP performs TLS handshake in <120 ms; 136 GPIOs accommodate diverse interface adapters; 640 KB SRAM buffers multi-protocol message queues.

Networked Energy Meter Smart Building Controller

Use Scenario: DIN-rail mounted meter with pulse counting, tariff scheduling, remote firmware update, and Power Line Communication (PLC) coexistence.

IC Role / Device Role / Timing Role: Real-time data concentrator with RTC for time-of-use billing, SDHI for local log storage, and CAN/Ethernet for utility backhaul.

Use Value: Battery-backed RTC maintains accurate timestamping across power outages; dual-bank flash ensures certified firmware updates meet DLMS/COSEM compliance.

Use Scenario: HVAC controller managing VAV boxes, lighting zones, and occupancy sensors across multi-floor commercial buildings.

IC Role / Device Role / Timing Role: Central building controller executing PID loops, coordinating schedules via RTC, and interfacing with BACnet MS/TP (SCI) and KNX (CAN).

Use Value: 2× CAN channels handle separate BACnet and KNX networks; 12-bit ADC/DAC provide precise analog I/O for temperature/pressure feedback; 105°C rating suits enclosure mounting near HVAC ducts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
R5F565NEDFBL#10 Same RX65N Group, 176-pin LQFP (20 × 20 mm, 0.5-mm pitch), D-grade (–40°C to +85°C), identical peripherals and memory - differs only in package and temp grade. Suitable where PCB rework or socket-based prototyping is preferred; LQFP eases hand-soldering and debug probe access vs. LFBGA. Select when thermal margin permits D-grade operation and board layout accommodates larger footprint.
R5F566TEADFP#30 RX66T Group, 144-pin LQFP, 160 MHz CPU, enhanced MTU3 timers (3-phase PWM with dead-time compensation), no GLCDC/DRW2D, 1 MB flash, 384 KB RAM. Optimized for motor control (inverters, servo drives); lacks graphics engine but adds advanced PWM and faster CPU for real-time motion profiles. Choose for high-performance motor control where graphics capability is unnecessary and higher PWM resolution is required.

Compared with R5F565N4BGFB#10, the R5F565NEDFBL#10 offers identical functionality in a through-hole-friendly LQFP package at lower ambient temperature range, while the R5F566TEADFP#30 trades graphics acceleration for superior motor control peripherals and higher clock speed - making it unsuitable for HMI but superior for servo drive applications.

Availability

R5F565N4BGFB#10 is available at Aetrix Electronics and suitable for industrial HMIs, secure IoT gateways, and networked energy meters requiring stable component supply, long-term lifecycle assurance, and guaranteed G-grade temperature compliance.

Supply support for R5F565N4BGFB#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The R5F565N4BGFB#10 belongs to the RX65N Group - designed specifically for industrial human-machine interfaces, secure networked gateways, and safety-certifiable equipment requiring integrated graphics, cryptography, and real-time connectivity.

FAQ

What is the maximum operating frequency and CPU performance of the R5F565N4BGFB#10?

The R5F565N4BGFB#10 operates at a maximum frequency of 120 MHz using the RXv2 CPU core and delivers 240 DMIPS of processing performance. Its single-precision IEEE-754 floating-point unit enables deterministic math operations for control algorithms, and the 5-stage pipeline with variable-length instructions ensures efficient code density. This performance level supports real-time multitasking in RTOS-based industrial applications without external coprocessors.

Does the R5F565N4BGFB#10 support secure firmware updates and cryptographic operations?

Yes, the R5F565N4BGFB#10 includes hardware-accelerated AES-128/192/256 and Trusted Secure IP (TSIP) for secure key management and encrypted communications. Its dual-bank flash architecture allows background programming and bank-swapping - enabling verified, atomic firmware updates without system downtime. Combined with MPU, Trusted Memory, and CRC calculator, the R5F565N4BGFB#10 meets IEC 62443-3-3 SL2 and IEC 60730 Class B requirements.

What graphics capabilities does the R5F565N4BGFB#10 provide for HMI applications?

The R5F565N4BGFB#10 integrates a Graphic-LCD Controller (GLCDC) supporting 3-plane overlay (background, graphic 1, graphic 2), and a 2D Drawing Engine (DRW2D) with vector drawing (lines, triangles, circles) and bit-blitting (copy, stretch, rotate). It supports 32-/16-/8-bpp pixel formats and CLUT-based color lookup, enabling smooth 60-fps UI rendering with <5% CPU utilization - eliminating the need for external GPU in industrial panel displays.

Which communication interfaces are integrated into the R5F565N4BGFB#10 for industrial connectivity?

The R5F565N4BGFB#10 integrates Ethernet MAC (10/100 Mbps, RMII/MII), two CAN 2.0B channels (32 mailboxes each), SD host/slave interfaces, quad SPI, three RSPI, three I²C, and 13 SCI channels. These interfaces support simultaneous operation across independent clock domains (PCLKA/PCLKB), enabling concurrent protocols such as Modbus TCP over Ethernet, CANopen on CAN, and SD card logging - essential for multi-protocol industrial gateways.

What is the package type, pin count, and temperature rating of the R5F565N4BGFB#10?

The R5F565N4BGFB#10 uses a 176-pin LFBGA package (PLBG0176GA-A, 13 × 13 mm, 0.8-mm pitch) and is rated for industrial temperature operation from –40°C to +105°C (G-grade). This compact, thermally robust package supports high-density PCB layouts and ensures reliability in harsh environments such as factory automation enclosures or outdoor energy infrastructure.

R5F565N4BGFB#10 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
144-LQFP
Series:
RX65N
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
RXv2
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F565N4BGFB#10 FAQ

1.How can I place an order for R5F565N4BGFB#10 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F565N4BGFB#10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F565N4BGFB#10 reliable?

The price and inventory of R5F565N4BGFB#10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F565N4BGFB#10 is usually 5 days.

3.What payment methods are accepted for R5F565N4BGFB#10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F565N4BGFB#10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R5F565N4BGFB#10?

R5F565N4BGFB#10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F565N4BGFB#10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F565N4BGFB#10?

For technical support, including R5F565N4BGFB#10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F565N4BGFB#10 requirements.

6.How does Aetrix verify that R5F565N4BGFB#10 is sourced from the original manufacturer or authorized distributors?

All R5F565N4BGFB#10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F565N4BGFB#10 meets industry standards.

7.What is the process for return or replacement of R5F565N4BGFB#10?

All R5F565N4BGFB#10 units undergo pre-shipment inspection (PSI). If there is an issue with R5F565N4BGFB#10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F565N4BGFB#10 part is unused and in its original packaging.

Return procedure for R5F565N4BGFB#10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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