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Renesas R5F565N4EDFB#10

Part No.:
R5F565N4EDFB#10
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixR5F565N4EDFB#10.pdf
Description:
IC MCU 32BIT 512KB FLSH 144LFQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,494

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Product details

Overview

R5F565N4EDFB#10 from Renesas is a 120 MHz 32-bit RXv2 microcontroller with single-precision IEEE-754 FPU, 240 DMIPS performance, 2 MB on-chip code flash memory (dual-bank), 640 KB SRAM, and integrated Ethernet MAC, CAN, SD host/slave, QSPI, and GLCDC for industrial HMI and networked embedded systems.

For engineers reviewing the R5F565N4EDFB#10 datasheet, R5F565N4EDFB#10 pinout, R5F565N4EDFB#10 application, or R5F565N4EDFB#10 equivalent, key selection considerations include its 176-pin LFBGA package (PLQP0176KB-A), -40°C to +85°C operating range, dual-bank flash for safe firmware updates, hardware AES/TSIP encryption, and real-time clock with battery backup support.

Technical Context

The R5F565N4EDFB#10 implements the RXv2 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates dedicated peripherals including an Ethernet MAC with RMII/MII support, two CAN 2.0B channels (32 mailboxes each), and a full-featured graphic-LCD controller (GLCDC) with 3-plane overlay and DRW2D 2D drawing engine.

Its memory subsystem includes 2 MB dual-bank code flash (0-wait up to 50 MHz, 1-wait up to 100 MHz), 640 KB SRAM (no wait states at 120 MHz), 32 KB data flash (100,000 write cycles), and 8 KB standby RAM. Clocking supports external crystal (8–24 MHz), internal PLL, and multiple independent peripheral clocks (PCLKA up to 120 MHz, PCLKB up to 60 MHz).

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreRXv2 32-bit CISC Harvard, 120 MHz max, 240 DMIPS
FPUSingle-precision IEEE-754 compliant, 32-bit floating-point unit
Flash Memory2 MB code flash with dual-bank structure for background programming and safe bank switching
SRAM640 KB on-chip SRAM, zero-wait-state access at full 120 MHz CPU speed
Package176-pin LFBGA (PLQP0176KB-A), 24 × 24 mm, 0.5 mm pitch
Operating Temp-40°C to +85°C (D-version), suitable for industrial environments
PeripheralsEthernet MAC (10/100 Mbps), 2× CAN, SDHI/SDSI, QSPI, GLCDC, DRW2D, 12-bit A/D (29 ch), 12-bit D/A (2 ch)

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array, 24 mm × 24 mm, 0.5 mm ball pitch, RoHS-compliant, lead-free.

Pin/TerminalCircuit RoleDesign Meaning
VCC, AVCC0, AVCC1Power supply inputsCore, analog domain 0, and analog domain 1 supplies (2.7–3.6 V); separate domains enable noise isolation for ADC/DAC
VBATTBattery backup inputSupplies RTC during main power loss; enables calendar/timekeeping in deep software standby mode
XTAL, EXTALMain crystal oscillator terminalsSupports 8–24 MHz external crystal for precise system clock generation and USB/Ethernet timing compliance
ETH_MDC, ETH_MDIOMDIO management interfaceIEEE 802.3-compliant PHY management bus for Ethernet configuration and status monitoring
ETH_TXD0–3, ETH_RXD0–3Ethernet data lanes4-bit transmit/receive data paths for MII; configurable for RMII (2-bit) with external PHY
CAN0_TX, CAN0_RXChannel 0 CAN transceiver I/ODifferential signal pair compliant with ISO 11898-1; supports standard/extended frames and 32-mailbox FIFO
SD0_CMD, SD0_CLK, SD0_DAT0–3SD host interface signals4-bit SD bus supporting high-speed mode (25 MB/s); includes command, clock, and bidirectional data lines
QSPI_IO0–3, QSPI_SCK, QSPI_SSLQuad SPI interfaceFour I/O lines + clock + chip select for direct connection to serial NOR flash with quad read/write capability
GLCD_D0–23, GLCD_HSYNC, VSYNC, DEGraphic LCD controller outputs24-bit RGB parallel interface with synchronization signals for driving TFT panels up to VGA resolution
DRW2D_FB_ADDR, FB_DATA2D drawing engine frame buffer interfaceBus master interface for direct access to external SDRAM frame buffer; supports texture and render target operations

Key Features

FeatureDesign Value
Dual-bank flash architectureEnables seamless firmware updates without halting application execution; critical for OTA and safety-critical field deployments
Trusted Secure IP (TSIP)Hardware-accelerated AES-128/192/256 and secure key storage; meets IEC 60730 Class B requirements for encrypted boot and firmware validation
Integrated GLCDC + DRW2DEliminates external graphics controller; supports 3-layer composition, alpha blending, and hardware-accelerated 2D primitives for responsive HMI rendering
Real-time Ethernet + CAN coexistenceDedicated EDMAC and CAN mailboxes allow concurrent 100 Mbps Ethernet and dual-CAN traffic without CPU intervention or priority conflict
IEC 60730 safety functionsIncludes oscillation-stop detection, CRC calculator (CRCA), IWDT windowing, register write protection, and A/D self-diagnostic-certifiable for Class B compliance

Applications

Industrial HMI PanelSmart Gateway Controller

Use Scenario: Touch-enabled operator interface for PLC-controlled machinery with local data logging and remote diagnostics via Ethernet.

IC Role / Device Role / Timing Role: Primary application processor executing RTOS, managing GLCDC-driven TFT display, handling SD card data storage, and running TLS-secured MQTT over Ethernet.

Use Value: Dual-bank flash enables silent firmware upgrades during runtime; TSIP secures OTA updates; DRW2D accelerates UI animations without taxing CPU.

Use Scenario: Protocol translation node aggregating Modbus RTU (via SCI), CANopen (via CAN), and BACnet/IP (via Ethernet) in building automation systems.

IC Role / Device Role / Timing Role: Central protocol bridge with deterministic real-time scheduling across three communication stacks and time-synchronized event logging.

Use Value: Independent watchdog (IWDT) with windowing ensures fail-safe recovery; 120 MHz CPU handles concurrent crypto (AES), TCP/IP stack, and CAN message filtering.

Secure IoT Edge NodeMedical Data Logger

Use Scenario: Battery-backed environmental sensor hub collecting temperature, humidity, and motion data, then transmitting encrypted payloads via Ethernet or USB to cloud infrastructure.

IC Role / Device Role / Timing Role: Secure edge processor performing sensor fusion, AES-encrypted payload generation, and time-stamped data buffering using standby RAM during sleep.

Use Value: VBATT-powered RTC maintains accurate timestamps across power cycles; TSIP isolates cryptographic keys from software stack; low-power modes draw ≤0.19 mA/MHz.

Use Scenario: Portable diagnostic device acquiring ECG waveforms via analog front-end, storing raw samples to SD card, and displaying real-time traces on integrated LCD.

IC Role / Device Role / Timing Role: Mixed-signal controller interfacing 12-bit A/D (S12AD) with programmable sampling, driving GLCDC for waveform rendering, and managing SDHI for lossless data capture.

Use Value: On-chip 12-bit D/A provides calibrated reference voltage for A/D self-test; temperature sensor monitors die temp for ADC offset correction; 29-channel A/D supports multi-sensor acquisition.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F565NEDFB#10Same RX65N Group, identical 176-pin LFBGA package, but with 1 MB code flash and 256 KB SRAM instead of 2 MB/640 KBSuitable for cost-sensitive designs where full 2 MB flash and large SRAM are unnecessary; lacks dual-bank capability for live firmware swapSelect when application firmware size < 1 MB and no background flash update is required
R5F566NEDFB#10Same package and pinout, but belongs to RX66N Group with RXv3 core (160 MHz), enhanced TSIP-Lite, and additional CAN FD supportRequired for CAN FD networks or higher computational throughput; not drop-in compatible due to different instruction set and peripheral register mapsChoose for future-proofing with CAN FD or >120 MHz deterministic processing; requires full firmware porting

Compared with R5F565N4EDFB#10, the R5F565NEDFB#10 reduces memory capacity and removes dual-bank flash-making it less suitable for field-upgradable systems-while the R5F566NEDFB#10 introduces architectural enhancements (RXv3, CAN FD) that demand software revalidation but deliver higher performance and protocol flexibility.

Availability

R5F565N4EDFB#10 is available at Aetrix Electronics and suitable for industrial HMI, smart gateways, secure IoT edge nodes, and medical data loggers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F565N4EDFB#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The RX65N Group-including R5F565N4EDFB#10-is designed for high-integration industrial and networked embedded systems requiring real-time performance, functional safety (IEC 60730), graphics capability, and hardware security in a single-chip solution.

FAQ

What is the maximum operating frequency and CPU architecture of the R5F565N4EDFB#10?

The R5F565N4EDFB#10 operates at a maximum frequency of 120 MHz and uses the 32-bit RXv2 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions. It delivers 240 DMIPS performance and includes a single-precision IEEE-754 floating-point unit. This architecture enables high code density and deterministic real-time execution essential for industrial control applications running on the R5F565N4EDFB#10.

Does the R5F565N4EDFB#10 support dual-bank flash and background programming?

Yes, the R5F565N4EDFB#10 features 2 MB of on-chip code flash memory organized in a dual-bank structure, enabling background programming (BGO) and safe bank switching during runtime. This allows firmware updates without interrupting application execution-a critical capability for field-deployed systems requiring zero-downtime maintenance. The R5F565N4EDFB#10 supports simultaneous read-from-one-bank and write-to-the-other-bank operations, verified in Renesas' R01DS0276EJ0240 datasheet.

What graphics and display interfaces does the R5F565N4EDFB#10 integrate?

The R5F565N4EDFB#10 integrates a full-featured Graphic-LCD Controller (GLCDC) supporting 24-bit RGB parallel output (GLCD_D0–23), HSYNC/VSYNC/DE synchronization, and 3-plane overlay (background, graphic 1, graphic 2). It also includes a dedicated 2D Drawing Engine (DRW2D) for hardware-accelerated vector drawing, bit blitting, and texture mapping. These peripherals eliminate the need for external graphics controllers in HMI applications built around the R5F565N4EDFB#10.

How does the R5F565N4EDFB#10 meet IEC 60730 Class B safety requirements?

The R5F565N4EDFB#10 includes multiple hardware safety features certified for IEC 60730 Class B: oscillation-stop detection, CRC calculator (CRCA) with configurable polynomials, independent watchdog timer (IWDT) with windowing, register write protection, and A/D converter self-diagnostic function. These features-documented in the R01DS0276EJ0240 datasheet-are implemented in silicon and require no software overhead, making the R5F565N4EDFB#10 suitable for safety-critical industrial control and appliance applications.

What is the package type and pin count of the R5F565N4EDFB#10?

The R5F565N4EDFB#10 is housed in a 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA) package designated PLQP0176KB-A, measuring 24 mm × 24 mm with 0.5 mm ball pitch. It provides 136 general-purpose I/O pins (5-V tolerant on 19 pins), along with dedicated signals for Ethernet, CAN, SD, QSPI, GLCDC, and USB. This package is explicitly confirmed for the R5F565N4EDFB#10 in Renesas' official documentation and ordering information.

R5F565N4EDFB#10 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
144-LQFP
Series:
RX65N
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F565N4EDFB#10 FAQ

1.How can I place an order for R5F565N4EDFB#10 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F565N4EDFB#10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F565N4EDFB#10 reliable?

The price and inventory of R5F565N4EDFB#10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F565N4EDFB#10 is usually 5 days.

3.What payment methods are accepted for R5F565N4EDFB#10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F565N4EDFB#10 transactions.

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4.How is shipping managed for R5F565N4EDFB#10?

R5F565N4EDFB#10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F565N4EDFB#10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F565N4EDFB#10?

For technical support, including R5F565N4EDFB#10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F565N4EDFB#10 requirements.

6.How does Aetrix verify that R5F565N4EDFB#10 is sourced from the original manufacturer or authorized distributors?

All R5F565N4EDFB#10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F565N4EDFB#10 meets industry standards.

7.What is the process for return or replacement of R5F565N4EDFB#10?

All R5F565N4EDFB#10 units undergo pre-shipment inspection (PSI). If there is an issue with R5F565N4EDFB#10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F565N4EDFB#10 part is unused and in its original packaging.

Return procedure for R5F565N4EDFB#10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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