Renesas R5F565N4EDFB#10
- Part No.:
- R5F565N4EDFB#10
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R5F565N4EDFB#10.pdf
- Description:
- IC MCU 32BIT 512KB FLSH 144LFQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,494
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Product details
Overview
R5F565N4EDFB#10 from Renesas is a 120 MHz 32-bit RXv2 microcontroller with single-precision IEEE-754 FPU, 240 DMIPS performance, 2 MB on-chip code flash memory (dual-bank), 640 KB SRAM, and integrated Ethernet MAC, CAN, SD host/slave, QSPI, and GLCDC for industrial HMI and networked embedded systems.
For engineers reviewing the R5F565N4EDFB#10 datasheet, R5F565N4EDFB#10 pinout, R5F565N4EDFB#10 application, or R5F565N4EDFB#10 equivalent, key selection considerations include its 176-pin LFBGA package (PLQP0176KB-A), -40°C to +85°C operating range, dual-bank flash for safe firmware updates, hardware AES/TSIP encryption, and real-time clock with battery backup support.
Technical Context
The R5F565N4EDFB#10 implements the RXv2 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates dedicated peripherals including an Ethernet MAC with RMII/MII support, two CAN 2.0B channels (32 mailboxes each), and a full-featured graphic-LCD controller (GLCDC) with 3-plane overlay and DRW2D 2D drawing engine.
Its memory subsystem includes 2 MB dual-bank code flash (0-wait up to 50 MHz, 1-wait up to 100 MHz), 640 KB SRAM (no wait states at 120 MHz), 32 KB data flash (100,000 write cycles), and 8 KB standby RAM. Clocking supports external crystal (8–24 MHz), internal PLL, and multiple independent peripheral clocks (PCLKA up to 120 MHz, PCLKB up to 60 MHz).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit CISC Harvard, 120 MHz max, 240 DMIPS |
| FPU | Single-precision IEEE-754 compliant, 32-bit floating-point unit |
| Flash Memory | 2 MB code flash with dual-bank structure for background programming and safe bank switching |
| SRAM | 640 KB on-chip SRAM, zero-wait-state access at full 120 MHz CPU speed |
| Package | 176-pin LFBGA (PLQP0176KB-A), 24 × 24 mm, 0.5 mm pitch |
| Operating Temp | -40°C to +85°C (D-version), suitable for industrial environments |
| Peripherals | Ethernet MAC (10/100 Mbps), 2× CAN, SDHI/SDSI, QSPI, GLCDC, DRW2D, 12-bit A/D (29 ch), 12-bit D/A (2 ch) |
Pinout & Package
Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array, 24 mm × 24 mm, 0.5 mm ball pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, AVCC0, AVCC1 | Power supply inputs | Core, analog domain 0, and analog domain 1 supplies (2.7–3.6 V); separate domains enable noise isolation for ADC/DAC |
| VBATT | Battery backup input | Supplies RTC during main power loss; enables calendar/timekeeping in deep software standby mode |
| XTAL, EXTAL | Main crystal oscillator terminals | Supports 8–24 MHz external crystal for precise system clock generation and USB/Ethernet timing compliance |
| ETH_MDC, ETH_MDIO | MDIO management interface | IEEE 802.3-compliant PHY management bus for Ethernet configuration and status monitoring |
| ETH_TXD0–3, ETH_RXD0–3 | Ethernet data lanes | 4-bit transmit/receive data paths for MII; configurable for RMII (2-bit) with external PHY |
| CAN0_TX, CAN0_RX | Channel 0 CAN transceiver I/O | Differential signal pair compliant with ISO 11898-1; supports standard/extended frames and 32-mailbox FIFO |
| SD0_CMD, SD0_CLK, SD0_DAT0–3 | SD host interface signals | 4-bit SD bus supporting high-speed mode (25 MB/s); includes command, clock, and bidirectional data lines |
| QSPI_IO0–3, QSPI_SCK, QSPI_SSL | Quad SPI interface | Four I/O lines + clock + chip select for direct connection to serial NOR flash with quad read/write capability |
| GLCD_D0–23, GLCD_HSYNC, VSYNC, DE | Graphic LCD controller outputs | 24-bit RGB parallel interface with synchronization signals for driving TFT panels up to VGA resolution |
| DRW2D_FB_ADDR, FB_DATA | 2D drawing engine frame buffer interface | Bus master interface for direct access to external SDRAM frame buffer; supports texture and render target operations |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables seamless firmware updates without halting application execution; critical for OTA and safety-critical field deployments |
| Trusted Secure IP (TSIP) | Hardware-accelerated AES-128/192/256 and secure key storage; meets IEC 60730 Class B requirements for encrypted boot and firmware validation |
| Integrated GLCDC + DRW2D | Eliminates external graphics controller; supports 3-layer composition, alpha blending, and hardware-accelerated 2D primitives for responsive HMI rendering |
| Real-time Ethernet + CAN coexistence | Dedicated EDMAC and CAN mailboxes allow concurrent 100 Mbps Ethernet and dual-CAN traffic without CPU intervention or priority conflict |
| IEC 60730 safety functions | Includes oscillation-stop detection, CRC calculator (CRCA), IWDT windowing, register write protection, and A/D self-diagnostic-certifiable for Class B compliance |
Applications
| Industrial HMI Panel | Smart Gateway Controller |
|---|---|
Use Scenario: Touch-enabled operator interface for PLC-controlled machinery with local data logging and remote diagnostics via Ethernet. IC Role / Device Role / Timing Role: Primary application processor executing RTOS, managing GLCDC-driven TFT display, handling SD card data storage, and running TLS-secured MQTT over Ethernet. Use Value: Dual-bank flash enables silent firmware upgrades during runtime; TSIP secures OTA updates; DRW2D accelerates UI animations without taxing CPU. | Use Scenario: Protocol translation node aggregating Modbus RTU (via SCI), CANopen (via CAN), and BACnet/IP (via Ethernet) in building automation systems. IC Role / Device Role / Timing Role: Central protocol bridge with deterministic real-time scheduling across three communication stacks and time-synchronized event logging. Use Value: Independent watchdog (IWDT) with windowing ensures fail-safe recovery; 120 MHz CPU handles concurrent crypto (AES), TCP/IP stack, and CAN message filtering. |
| Secure IoT Edge Node | Medical Data Logger |
Use Scenario: Battery-backed environmental sensor hub collecting temperature, humidity, and motion data, then transmitting encrypted payloads via Ethernet or USB to cloud infrastructure. IC Role / Device Role / Timing Role: Secure edge processor performing sensor fusion, AES-encrypted payload generation, and time-stamped data buffering using standby RAM during sleep. Use Value: VBATT-powered RTC maintains accurate timestamps across power cycles; TSIP isolates cryptographic keys from software stack; low-power modes draw ≤0.19 mA/MHz. | Use Scenario: Portable diagnostic device acquiring ECG waveforms via analog front-end, storing raw samples to SD card, and displaying real-time traces on integrated LCD. IC Role / Device Role / Timing Role: Mixed-signal controller interfacing 12-bit A/D (S12AD) with programmable sampling, driving GLCDC for waveform rendering, and managing SDHI for lossless data capture. Use Value: On-chip 12-bit D/A provides calibrated reference voltage for A/D self-test; temperature sensor monitors die temp for ADC offset correction; 29-channel A/D supports multi-sensor acquisition. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F565NEDFB#10 | Same RX65N Group, identical 176-pin LFBGA package, but with 1 MB code flash and 256 KB SRAM instead of 2 MB/640 KB | Suitable for cost-sensitive designs where full 2 MB flash and large SRAM are unnecessary; lacks dual-bank capability for live firmware swap | Select when application firmware size < 1 MB and no background flash update is required |
| R5F566NEDFB#10 | Same package and pinout, but belongs to RX66N Group with RXv3 core (160 MHz), enhanced TSIP-Lite, and additional CAN FD support | Required for CAN FD networks or higher computational throughput; not drop-in compatible due to different instruction set and peripheral register maps | Choose for future-proofing with CAN FD or >120 MHz deterministic processing; requires full firmware porting |
Compared with R5F565N4EDFB#10, the R5F565NEDFB#10 reduces memory capacity and removes dual-bank flash-making it less suitable for field-upgradable systems-while the R5F566NEDFB#10 introduces architectural enhancements (RXv3, CAN FD) that demand software revalidation but deliver higher performance and protocol flexibility.
Availability
R5F565N4EDFB#10 is available at Aetrix Electronics and suitable for industrial HMI, smart gateways, secure IoT edge nodes, and medical data loggers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for R5F565N4EDFB#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.
The RX65N Group-including R5F565N4EDFB#10-is designed for high-integration industrial and networked embedded systems requiring real-time performance, functional safety (IEC 60730), graphics capability, and hardware security in a single-chip solution.
FAQ
What is the maximum operating frequency and CPU architecture of the R5F565N4EDFB#10?
The R5F565N4EDFB#10 operates at a maximum frequency of 120 MHz and uses the 32-bit RXv2 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions. It delivers 240 DMIPS performance and includes a single-precision IEEE-754 floating-point unit. This architecture enables high code density and deterministic real-time execution essential for industrial control applications running on the R5F565N4EDFB#10.
Does the R5F565N4EDFB#10 support dual-bank flash and background programming?
Yes, the R5F565N4EDFB#10 features 2 MB of on-chip code flash memory organized in a dual-bank structure, enabling background programming (BGO) and safe bank switching during runtime. This allows firmware updates without interrupting application execution-a critical capability for field-deployed systems requiring zero-downtime maintenance. The R5F565N4EDFB#10 supports simultaneous read-from-one-bank and write-to-the-other-bank operations, verified in Renesas' R01DS0276EJ0240 datasheet.
What graphics and display interfaces does the R5F565N4EDFB#10 integrate?
The R5F565N4EDFB#10 integrates a full-featured Graphic-LCD Controller (GLCDC) supporting 24-bit RGB parallel output (GLCD_D0–23), HSYNC/VSYNC/DE synchronization, and 3-plane overlay (background, graphic 1, graphic 2). It also includes a dedicated 2D Drawing Engine (DRW2D) for hardware-accelerated vector drawing, bit blitting, and texture mapping. These peripherals eliminate the need for external graphics controllers in HMI applications built around the R5F565N4EDFB#10.
How does the R5F565N4EDFB#10 meet IEC 60730 Class B safety requirements?
The R5F565N4EDFB#10 includes multiple hardware safety features certified for IEC 60730 Class B: oscillation-stop detection, CRC calculator (CRCA) with configurable polynomials, independent watchdog timer (IWDT) with windowing, register write protection, and A/D converter self-diagnostic function. These features-documented in the R01DS0276EJ0240 datasheet-are implemented in silicon and require no software overhead, making the R5F565N4EDFB#10 suitable for safety-critical industrial control and appliance applications.
What is the package type and pin count of the R5F565N4EDFB#10?
The R5F565N4EDFB#10 is housed in a 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA) package designated PLQP0176KB-A, measuring 24 mm × 24 mm with 0.5 mm ball pitch. It provides 136 general-purpose I/O pins (5-V tolerant on 19 pins), along with dedicated signals for Ethernet, CAN, SD, QSPI, GLCDC, and USB. This package is explicitly confirmed for the R5F565N4EDFB#10 in Renesas' official documentation and ordering information.
R5F565N4EDFB#10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RX65N
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RXv2
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 111
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 29x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F565N4EDFB#10 FAQ
1.How can I place an order for R5F565N4EDFB#10 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F565N4EDFB#10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F565N4EDFB#10 reliable?
The price and inventory of R5F565N4EDFB#10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F565N4EDFB#10 is usually 5 days.
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Once your R5F565N4EDFB#10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F565N4EDFB#10?
For technical support, including R5F565N4EDFB#10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F565N4EDFB#10 requirements.
6.How does Aetrix verify that R5F565N4EDFB#10 is sourced from the original manufacturer or authorized distributors?
All R5F565N4EDFB#10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F565N4EDFB#10 meets industry standards.
7.What is the process for return or replacement of R5F565N4EDFB#10?
All R5F565N4EDFB#10 units undergo pre-shipment inspection (PSI). If there is an issue with R5F565N4EDFB#10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F565N4EDFB#10 part is unused and in its original packaging.
Return procedure for R5F565N4EDFB#10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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