Renesas R5F565N4FGFB#30

Overview

R5F565N4FGFB#30 from Renesas is a 120-MHz 32-bit RXv2 microcontroller with single-precision IEEE-754 FPU, 240 DMIPS performance, 2 MB on-chip code flash (dual-bank), 640 KB SRAM, and integrated Ethernet MAC, CAN, SD host/slave, QSPI, GLCDC, DRW2D, and TSIP encryption. It targets industrial HMI, networked gateways, and secure edge controllers requiring real-time deterministic execution and rich peripheral integration.

For engineers reviewing the R5F565N4FGFB#30 datasheet, R5F565N4FGFB#30 pinout, R5F565N4FGFB#30 application, or R5F565N4FGFB#30 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), -40°C to +85°C operating range, 2 MB flash with background programming, dual 12-bit ADC units (29 total channels), and hardware-accelerated AES/TSIP for IEC60730-compliant safety-critical firmware.

Technical Context

The R5F565N4FGFB#30 implements the RXv2 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. Its memory subsystem includes dual-bank 2 MB flash supporting concurrent read/program operations and 640 KB zero-wait-state SRAM partitioned into 256 KB main RAM and 384 KB expansion RAM.

Peripherals are clocked across four domains: ICLK up to 120 MHz for CPU/core logic, PCLKA up to 120 MHz for high-speed modules (ETHERC, EDMAC, AES, GLCDC), PCLKB up to 60 MHz for most peripherals (SCI, I2C, CAN, TPU), and PCLKC/PCLKD up to 60 MHz for dual 12-bit ADC units-enabling precise timing isolation and power optimization.

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array, 24 mm × 24 mm body, 0.5 mm ball pitch, lead-free, RoHS compliant. Thermal pad exposed on underside for enhanced heat dissipation in industrial applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F565N4FGFB#30, the R5F565NEDFBL#30 offers identical functionality in a smaller footprint but fewer I/O and peripherals, while the R5F566NEDFBL#30 trades integrated graphics for higher CPU throughput and advanced crypto-making R5F565N4FGFB#30 optimal for cost-sensitive, display-centric industrial edge nodes.

Availability

R5F565N4FGFB#30 is available at Aetrix Electronics and suitable for industrial HMI panels, secure IoT gateways, and networked energy meters requiring stable component supply, long-term lifecycle support, and guaranteed traceability for safety-certified designs.

Supply support for R5F565N4FGFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The RX65N Group, including R5F565N4FGFB#30, was designed for industrial edge devices requiring real-time determinism, functional safety (IEC60730), rich connectivity, and integrated graphics-targeting HMI, gateway, and metering applications.

FAQ

What is the maximum operating frequency and CPU architecture of the R5F565N4FGFB#30?

The R5F565N4FGFB#30 operates at a maximum frequency of 120 MHz using the 32-bit RXv2 CPU core. This core features a CISC Harvard architecture with a 5-stage pipeline, variable-length instructions, and delivers 240 DMIPS performance. Its design emphasizes code density and real-time responsiveness, making it suitable for deterministic industrial control tasks where low-latency interrupt handling is critical. The R5F565N4FGFB#30 leverages this architecture to execute complex protocol stacks and graphics rendering concurrently without jitter.

Does the R5F565N4FGFB#30 support hardware-accelerated cryptography and safety certification?

Yes, the R5F565N4FGFB#30 integrates both AES encryption engines (128/192/256-bit keys) and the Trusted Secure IP (TSIP) module for secure key management, secure boot, and tamper-resistant cryptographic operations. It also includes dedicated IEC60730 safety features: oscillation-stop detection, CRC calculator (CRCA), independent watchdog timer (IWDT) with windowing, register write protection, and ADC self-diagnostic functions-enabling Class B compliance in safety-critical firmware deployments. These capabilities are fully implemented in the R5F565N4FGFB#30 silicon.

What display and graphics capabilities does the R5F565N4FGFB#30 provide?

The R5F565N4FGFB#30 includes a dedicated Graphic-LCD Controller (GLCDC) supporting 3-layer overlay (background + two graphics planes), multiple pixel formats (32/16 bpp), and direct AXI bus access to frame buffers. It also integrates a 2D Drawing Engine (DRW2D) that accelerates vector drawing, bit blitting with rotation/stretching, and CLUT-based color conversion. These subsystems eliminate the need for external graphics processors in industrial HMIs, reducing BOM cost and board area-core differentiators of the R5F565N4FGFB#30 within the RX65N family.

How many ADC channels and what resolution does the R5F565N4FGFB#30 support?

The R5F565N4FGFB#30 integrates two independent 12-bit A/D converter units: S12AD unit 0 with 8 input channels and unit 1 with 21 input channels, totaling 29 configurable analog inputs. Resolution is selectable per channel at 8-, 10-, or 12-bit modes, with minimum conversion times of 0.42 µs (8-bit), 0.45 µs (10-bit), and 0.48 µs (12-bit). Both units support self-diagnostic, analog input disconnection detection, and flexible trigger sources-including TPU, MTU3 timers, and external events-making the R5F565N4FGFB#30 ideal for multi-sensor industrial monitoring.

What package type and thermal characteristics apply to the R5F565N4FGFB#30?

The R5F565N4FGFB#30 is packaged in a 176-pin Low-Profile Fine-Pitch Ball Grid Array (PLQP0176KB-A) measuring 24 mm × 24 mm with 0.5 mm ball pitch. It is rated for industrial temperature range (–40°C to +85°C, D-version) and features an exposed thermal pad on the underside for efficient heat dissipation. This package supports high-density PCB layouts while maintaining signal integrity for high-speed interfaces like Ethernet MII and QSPI-critical for reliable operation in thermally demanding industrial enclosures where the R5F565N4FGFB#30 is deployed.