Renesas R5F565N4FGFP#30

Overview

R5F565N4FGFP#30 from Renesas is a 32-bit RXv2 microcontroller with 120 MHz max operating frequency, 240 DMIPS performance, single-precision IEEE-754 FPU, 2 MB on-chip code flash memory, and 640 KB SRAM. It integrates Ethernet MAC, dual CAN channels, SD host/slave interfaces, QSPI, GLCDC, DRW2D, and hardware AES encryption - designed for industrial HMI, networked gateway, and secure IoT edge devices.

For engineers reviewing the R5F565N4FGFP#30 datasheet, R5F565N4FGFP#30 pinout, R5F565N4FGFP#30 application, or R5F565N4FGFP#30 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), -40°C to +85°C temperature grade, dual-bank flash for safe firmware updates, 12-bit dual A/D converters (29 total channels), and integrated trusted secure IP (TSIP) for cryptographic key management.

Technical Context

The R5F565N4FGFP#30 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It supports little-endian or big-endian data arrangement and includes two 72-bit accumulators, a 32×32→64-bit multiplier, and a 32/32→32-bit divider with one- and two-cycle execution respectively.

Its clock system combines external crystal oscillators (8–24 MHz), internal HOCO (16/18/20 MHz), LOCO (240 kHz), and PLL-based synthesis - enabling independent domain clocks: ICLK up to 120 MHz for CPU, PCLKA up to 120 MHz for high-speed peripherals (ETHERC, GLCDC, DRW2D), and PCLKB up to 60 MHz for timers and ADCs. The ELC (Event Link Controller) enables hardware-triggered peripheral coordination without CPU intervention.

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array, 24 mm × 24 mm body, 0.5 mm ball pitch, RoHS-compliant, lead-free matte tin finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F565N4FGFP#30, the R5F565NEDFP#30 offers reduced memory and no DRW2D/GLCDC - ideal for streamlined industrial controllers. The R7FA6M2AF3CFP#AA0 delivers higher CPU throughput but omits TSIP and display engines, shifting security and GUI responsibilities to external components.

Availability

R5F565N4FGFP#30 is available at Aetrix Electronics and suitable for industrial HMI, secure edge gateways, networked building controllers, and medical data loggers requiring stable component supply across multi-year production cycles.

Supply support for R5F565N4FGFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.

The RX65N Group - including R5F565N4FGFP#30 - was engineered for high-integrity industrial applications demanding integrated security, rich connectivity, and embedded graphics, with emphasis on IEC 60730 Class B compliance and functional safety readiness.

FAQ

What is the maximum operating frequency and CPU performance of the R5F565N4FGFP#30?

The R5F565N4FGFP#30 operates at a maximum frequency of 120 MHz and delivers 240 DMIPS of processing performance using the RXv2 CPU core. Its single-precision IEEE-754 floating-point unit, dual multiply-accumulate units, and 5-stage pipeline enable deterministic real-time execution for industrial control algorithms. This performance level is confirmed in Renesas datasheet R01DS0276EJ0240 Rev.2.40, page 1.

Does the R5F565N4FGFP#30 support secure firmware updates and cryptographic operations?

Yes, the R5F565N4FGFP#30 integrates Trusted Secure IP (TSIP) and hardware AES engines supporting 128-, 192-, and 256-bit keys. TSIP provides secure key generation, storage, and cryptographic acceleration for TLS, firmware signing, and secure boot - all without exposing keys to software. This capability is documented in Section 1.1.12 of R01DS0276EJ0240 and enables IEC 62443-3-3 compliance in the R5F565N4FGFP#30 design.

What display and graphics capabilities does the R5F565N4FGFP#30 offer?

The R5F565N4FGFP#30 includes a Graphic-LCD Controller (GLCDC) supporting RGB, YUV, and CLUT formats with 3-layer overlay, plus a dedicated 2D Drawing Engine (DRW2D) for hardware-accelerated vector drawing and bit-blitting. These features enable direct driving of 800×480 TFT displays without external GPU, reducing BOM cost and power consumption. Details appear in Sections 1.1.22 and 1.1.23 of R01DS0276EJ0240.

How many A/D converter channels does the R5F565N4FGFP#30 provide, and what is their resolution?

The R5F565N4FGFP#30 integrates two independent 12-bit A/D converter units: S12AD unit 0 with 8 input channels and unit 1 with 21 input channels - totaling 29 configurable analog inputs. Resolution is selectable at 8-, 10-, or 12-bit modes, with minimum conversion time of 0.48 µs per channel at full 12-bit precision. This specification is verified in Table 1.1, page 10 of R01DS0276EJ0240.

What package type and pin count does the R5F565N4FGFP#30 use?

The R5F565N4FGFP#30 uses the PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array with 24 mm × 24 mm body size and 0.5 mm ball pitch. It is rated for industrial temperature range (–40°C to +85°C) and supports 136 general-purpose I/O pins with 5-V tolerance on 19 pins. This mechanical specification is defined on page 1 of R01DS0276EJ0240.