Renesas R5F565N7ADFB#10

Overview

R5F565N7ADFB#10 from Renesas is a 32-bit RXv2 microcontroller operating at up to 120 MHz, delivering 240 DMIPS with integrated single-precision IEEE-754 FPU, 2 MB on-chip code flash, 640 KB SRAM, and hardware AES encryption. It integrates Ethernet MAC, dual CAN channels, SD host/slave interfaces, QSPI, GLCDC, DRW2D, and a 12-bit A/D converter with 21-channel input - deployed in industrial HMI, networked gateway, and secure embedded control systems.

For engineers reviewing the R5F565N7ADFB#10 datasheet, R5F565N7ADFB#10 pinout, R5F565N7ADFB#10 application, or R5F565N7ADFB#10 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), dual-bank flash for safe firmware updates, 120-MHz real-time execution with no-wait access up to 50 MHz, and IEC60730-compliant safety features including CRC, IWDT, and register write protection.

Technical Context

The R5F565N7ADFB#10 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It supports little-endian or big-endian data arrangement and includes two 72-bit accumulators, ten 32-bit control registers, and sixteen 32-bit general-purpose registers.

Its clock system combines external crystal oscillation (8–24 MHz), internal PLL, and multiple on-chip oscillators (LOCO, HOCO, IWDT-dedicated 120-kHz source), with independent clock domains: ICLK (up to 120 MHz for CPU), PCLKA (120 MHz for ETHERC/DRW2D), PCLKB (60 MHz for most peripherals), and dedicated ADCLKs (60 MHz) for dual 12-bit A/D units.

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 mm × 24 mm, 0.5 mm pitch, lead-free, RoHS compliant. Thermal pad exposed on underside for enhanced heat dissipation in high-duty-cycle applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F565N7ADFB#10, R5F565NEDFB#10 reduces memory capacity while preserving pinout and safety features, whereas R5F566TEHDFB#10 trades connectivity for enhanced timing precision - making the R5F565N7ADFB#10 uniquely balanced for secure, connected, graphics-capable industrial edge nodes.

Availability

R5F565N7ADFB#10 is available at Aetrix Electronics and suitable for industrial HMI, secure networked PLCs, and medical data loggers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F565N7ADFB#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX65N Group - including R5F565N7ADFB#10 - was designed for high-integrity, connected industrial applications demanding real-time performance, functional safety (IEC60730), and rich human-machine interface capabilities.

FAQ

What is the maximum operating frequency and CPU performance of the R5F565N7ADFB#10?

The R5F565N7ADFB#10 operates at a maximum system clock frequency of 120 MHz and delivers 240 DMIPS (Dhrystone MIPS) using the RXv2 32-bit CPU core. Its single-precision IEEE-754 floating-point unit enables efficient signal processing, and the 5-stage pipeline with variable-length instructions ensures high code density and deterministic interrupt latency - critical for real-time industrial control tasks executed by the R5F565N7ADFB#10.

Does the R5F565N7ADFB#10 support secure firmware updates and cryptographic operations?

Yes, the R5F565N7ADFB#10 integrates AES-128/192/256 hardware acceleration, Trusted Secure IP (TSIP), and a dual-bank flash architecture that enables background programming during runtime. Combined with the Memory Protection Unit (MPU) and Trusted Memory (TM) function, these features allow authenticated, encrypted, and atomic firmware updates - a core requirement for secure remote maintenance in devices built around the R5F565N7ADFB#10.

What display and graphics capabilities does the R5F565N7ADFB#10 provide?

The R5F565N7ADFB#10 includes a dedicated Graphic-LCD Controller (GLCDC) supporting up to 480×272 resolution with three overlay planes and a 2D Drawing Engine (DRW2D) capable of vector rendering, bit blitting, rotation, and texture mapping. These accelerators reduce CPU load for GUI rendering and enable responsive touch-enabled HMIs - a defining capability distinguishing the R5F565N7ADFB#10 from standard industrial MCUs.

Which communication interfaces are integrated into the R5F565N7ADFB#10 for industrial networking?

The R5F565N7ADFB#10 integrates Ethernet MAC (10/100 Mbps MII/RMII), two ISO11898-1 CAN channels (32 mailboxes each), three RSPI ports, one QSPI interface, three I2C buses (1 Mbps max), SD host/slave interfaces, and USB 2.0 FS host/device with OTG support. This comprehensive suite enables multi-protocol gateways and eliminates external bridge ICs - a key integration advantage of the R5F565N7ADFB#10 in factory automation systems.

What is the package type and thermal specification of the R5F565N7ADFB#10?

The R5F565N7ADFB#10 uses the PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 24 mm × 24 mm with 0.5 mm pitch and an exposed thermal pad. It is rated for industrial temperature range (–40°C to +85°C) and supports reflow soldering per J-STD-020. This package provides robust signal integrity and thermal performance essential for dense, fanless industrial PCB layouts hosting the R5F565N7ADFB#10.