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Renesas R5F565N7AGFP#30

Part No.:
R5F565N7AGFP#30
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixR5F565N7AGFP#30.pdf
Description:
IC MCU 32BIT 768KB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:270

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Product details

Overview

R5F565N7AGFP#30 from Renesas is a 120-MHz 32-bit RXv2 core MCU with on-chip FPU (240 DMIPS), 2 MB code flash, 640 KB SRAM, dual-bank flash architecture, Ethernet MAC, CAN 2.0B (2 channels), SD host/slave interfaces, and hardware AES-128/192/256 encryption - deployed in industrial HMI, networked gateway, and secure IoT edge controllers.

For engineers reviewing the R5F565N7AGFP#30 datasheet, R5F565N7AGFP#30 pinout, R5F565N7AGFP#30 application, or R5F565N7AGFP#30 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), -40°C to +85°C operating range (D-version), integrated GLCDC + DRW2D for embedded graphics, and IEC60730-compliant safety features including CRC, IWDT, and register write protection.

Technical Context

The R5F565N7AGFP#30 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates dual-clock domain operation: ICLK up to 120 MHz for CPU and PCLKA-synchronized peripherals (ETHERC, GLCDC, DRW2D), and PCLKB up to 60 MHz for most other modules including S12AD units and MTU3 timers.

Its memory subsystem includes 2 MB dual-bank code flash (no-wait access ≤50 MHz, 1-wait ≤100 MHz), 32 KB data flash (100,000 erase/write cycles), 640 KB SRAM (256 KB main + 384 KB expansion), and 8 KB standby RAM backed by VBATT. Peripheral integration centers on deterministic real-time control (TPUa, MTU3a, CMTW), high-throughput data movement (DMACAa ×8, EXDMAC ×2, DTCb ×1), and secure connectivity (Ethernet MAC + RMII/MII, USB 2.0 FS host/function, CAN ×2, QSPI, SDHI/SDSI).

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreRXv2 32-bit CISC Harvard, 120 MHz max, 240 DMIPS, IEEE-754 single-precision FPU
Memory2 MB dual-bank code flash (background programming), 32 KB data flash, 640 KB SRAM, 8 KB standby RAM
PackagePLQP0176KB-A: 176-pin LFBGA, 24 × 24 mm, 0.5-mm pitch, -40°C to +85°C (D-version)
PeripheralsEthernet MAC + RMII/MII, CAN ×2 (32 mailboxes/channel), SDHI/SDSI, QSPI, GLCDC + DRW2D, PDC, USB 2.0 FS
AnalogS12AD ×2 (8 + 21 ch, 12-bit, 0.48 µs/ch), R12DA ×2 (12-bit buffered/unbuffered), on-die temperature sensor (±1°C)
SecurityAES-128/192/256, TSIP, MPU (8 regions), Trusted Memory (TM), CRC calculator (8/32-bit), IWDT with window function
TimersMTU3a ×9 ch, TPUa ×6 ch, CMTW ×2 ch (32-bit), TMRb ×4 ch, RTC with time-capture and battery backup

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 mm × 24 mm body, 0.5 mm ball pitch, RoHS-compliant, lead-free, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VCC / AVCC0 / AVCC1Power supply inputsCore (VCC), analog unit 0 (AVCC0), analog unit 1 (AVCC1) - all require 2.7–3.6 V; separate domains enable noise isolation
VBATTBattery backup supplyProvides power to RTC and standby RAM during main supply loss; enables calendar/timekeeping in deep software standby
RES#Active-low reset inputAsynchronous hardware reset; low pulse ≥100 ns initiates full system reset sequence
CLKIN / CLKOUTExternal crystal interfaceSupports 8–24 MHz crystal/resonator for main clock oscillator; CLKOUT provides buffered output for trace/debug
ETH_MDC / ETH_MDIOMDIO management interfaceIEEE 802.3-compliant serial management bus for PHY configuration and status readback
ETH_TXD0–3 / ETH_RXD0–3Ethernet data lanes4-bit transmit/receive data for MII mode; reduced to TXD0/1, RXD0/1 in RMII mode with REF_CLK
USB_VBUS / USB_DP / USB_DMUSB 2.0 FS physical interfaceVBUS sensing enables host/device role detection; DP/DM differential pair supports full-speed (12 Mbps) signaling
SD0_CMD / SD0_CLK / SD0_DAT0–3SD host interface signals4-bit SD bus supporting high-speed mode (25 MB/s); compatible with SD Memory Card Spec. v3.01 and SDIO v3.00

Key Features

FeatureDesign Value
Dual-bank flash architectureEnables seamless firmware updates: one bank executes while the other is reprogrammed, eliminating runtime interruption
GLCDC + DRW2D co-processorOffloads CPU from pixel composition and 2D rendering - supports 3-layer overlay, bit blitting, rotation, and vector drawing
IEC60730 Class B supportIntegrated self-test functions: oscillation-stop detection, CRC calculation, IWDT windowing, A/D self-diagnostic, register write protection
Event Link Controller (ELC)Hardware interconnect for 83 internal events - eliminates CPU polling/interrupt latency for timer-triggered ADC, PWM sync, or GPIO state changes
Secure boot & TM protectionTrusted Memory locks instruction fetch from protected flash regions; prevents unauthorized code readout or execution of unverified firmware

Applications

Industrial HMI PanelSmart Gateway Controller

Use Scenario: Touch-enabled display panel with local logic, Ethernet backhaul, and SD card logging in factory automation.

IC Role / Device Role / Timing Role: Main application processor running RTOS, driving 480×272 LCD via GLCDC, managing touch controller over I2C, and buffering logs to SDHI.

Use Value: Integrated DRW2D accelerates UI rendering; dual-bank flash enables remote OTA updates without halting HMI operation.

Use Scenario: Protocol translator bridging Modbus RTU field devices to cloud via Ethernet and TLS-secured MQTT.

IC Role / Device Role / Timing Role: Secure edge node executing encrypted communication stack (AES + TLS offload), parsing serial protocols, and scheduling periodic Ethernet transmissions.

Use Value: Hardware AES and TSIP accelerate crypto operations; Ethernet MAC + RMII reduces external PHY BOM; IEC60730 features satisfy functional safety requirements.

Medical Data LoggerBuilding Automation Node

Use Scenario: Battery-backed patient monitor recording ECG waveforms, ambient temperature, and timestamps to microSD.

IC Role / Device Role / Timing Role: Real-time acquisition controller using S12AD (21-channel unit) for analog sensors, RTC for timestamping, and SDHI for FAT32 file writes.

Use Value: 8 KB standby RAM retains critical data during brownout; on-die temperature sensor calibrates analog front-end drift; dual-bank flash ensures firmware integrity during power-loss recovery.

Use Scenario: HVAC controller interfacing with CAN-based thermostats, reading temperature/humidity via I2C, and reporting to BACnet/IP over Ethernet.

IC Role / Device Role / Timing Role: Central coordination MCU handling multi-protocol I/O (CAN ×2, RIIC ×3, SCI ×11), real-time scheduling via MTU3 timers, and Ethernet packet assembly.

Use Value: 136 GPIOs support mixed digital/analog/sensor interfaces; CAN mailbox filtering reduces CPU load; PCLKA-synchronized ETHERC ensures deterministic packet timing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F565NEDFP#30Same RX65N Group, identical 176-pin LFBGA package, but 1 MB code flash and 256 KB SRAM (not 2 MB/640 KB)Suitable for cost-sensitive designs where full memory capacity is unnecessary; lacks expansion RAM for large frame buffers or crypto contextsSelect when application firmware size < 1 MB and graphics/data buffering needs are modest
R5F566TEADFP#30RX66T Group part: higher 160 MHz CPU, enhanced MTU3 for motor control (3-phase PWM with dead-time), no GLCDC/DRW2D or SDHIOptimized for servo/inverter control with encoder feedback and real-time current loop closure; no embedded graphics or SD storageSelect for motion control applications requiring advanced PWM timing and no display/storage subsystems

Compared with R5F565N7AGFP#30, R5F565NEDFP#30 offers reduced memory at lower cost for simpler edge nodes, while R5F566TEADFP#30 trades graphics and storage peripherals for deterministic motor control timing - making each alternative optimal only within its specific architectural trade-off envelope.

Availability

R5F565N7AGFP#30 is available at Aetrix Electronics and suitable for industrial HMI, smart gateway, and medical data logger applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for R5F565N7AGFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets, with deep expertise in MCUs, analog, power, and connectivity technologies.

The RX65N Group - to which R5F565N7AGFP#30 belongs - was designed specifically for secure, graphics-rich, network-connected industrial edge devices, integrating safety, cryptography, and human-machine interface capabilities into a single high-performance MCU platform.

FAQ

What is the maximum operating frequency and CPU architecture of the R5F565N7AGFP#30?

The R5F565N7AGFP#30 operates at a maximum frequency of 120 MHz using the 32-bit RXv2 CPU core. This core features a 5-stage pipeline, Harvard architecture, variable-length instructions, and single-precision IEEE-754 floating-point unit delivering 240 DMIPS. Its design emphasizes code density, real-time determinism, and low-power efficiency - all confirmed in the official R01DS0276EJ0240 datasheet for the RX65N Group, where R5F565N7AGFP#30 is explicitly listed as a 2 MB flash variant.

Does the R5F565N7AGFP#30 support secure boot and cryptographic acceleration?

Yes, the R5F565N7AGFP#30 supports secure boot via Trusted Memory (TM) protection, which restricts instruction fetch to designated flash regions and prevents unauthorized code readout. It also integrates hardware AES engines for 128/192/256-bit keys and Trusted Secure IP (TSIP) for key management and cryptographic offload - all documented in Section 1.1 and Chapter 37 of the R01DS0276EJ0240 datasheet as standard features across the RX65N Group, including R5F565N7AGFP#30.

What package type and pin count does the R5F565N7AGFP#30 use?

The R5F565N7AGFP#30 uses the PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 24 mm × 24 mm with 0.5 mm ball pitch. This matches the "176-pin LFBGA" designation in Table 1.2 of the R01DS0276EJ0240 datasheet and confirms 136 general-purpose I/O pins, 19 5-V-tolerant inputs, and dedicated power/ground ball assignments per the mechanical drawing.

Which communication interfaces are integrated into the R5F565N7AGFP#30?

The R5F565N7AGFP#30 integrates Ethernet MAC (10/100 Mbps, MII/RMII), CAN 2.0B (2 channels, 32 mailboxes each), USB 2.0 Full-Speed host/function/OTG, SD host and slave interfaces (SDHI/SDSI), QSPI, three I2C channels (RIICa), eleven SCI channels (SCIg/h/i), and three RSPI channels. These are fully specified in Tables 1.1–1.2 and Sections 1.3–1.8 of the R01DS0276EJ0240 datasheet as standard for the 176-pin RX65N variants like R5F565N7AGFP#30.

Is the R5F565N7AGFP#30 qualified for industrial temperature range and IEC60730 compliance?

Yes, the R5F565N7AGFP#30 is rated for the industrial temperature range of –40°C to +85°C (D-version) and includes multiple hardware features required for IEC60730 Class B compliance: oscillation-stop detection, CRC calculator (CRCA), independent watchdog timer (IWDT) with window function, self-diagnostic A/D converter, and register write protection. These are explicitly listed under "Useful functions for IEC60730 compliance" in the R01DS0276EJ0240 datasheet and apply to all RX65N Group devices including R5F565N7AGFP#30.

R5F565N7AGFP#30 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
100-LQFP
Series:
RX65N
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
RXv2
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
78
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b; D/A 1x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F565N7AGFP#30 FAQ

1.How can I place an order for R5F565N7AGFP#30 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F565N7AGFP#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F565N7AGFP#30 reliable?

The price and inventory of R5F565N7AGFP#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F565N7AGFP#30 is usually 5 days.

3.What payment methods are accepted for R5F565N7AGFP#30?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F565N7AGFP#30 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R5F565N7AGFP#30?

R5F565N7AGFP#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F565N7AGFP#30 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F565N7AGFP#30?

For technical support, including R5F565N7AGFP#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F565N7AGFP#30 requirements.

6.How does Aetrix verify that R5F565N7AGFP#30 is sourced from the original manufacturer or authorized distributors?

All R5F565N7AGFP#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F565N7AGFP#30 meets industry standards.

7.What is the process for return or replacement of R5F565N7AGFP#30?

All R5F565N7AGFP#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F565N7AGFP#30, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F565N7AGFP#30 part is unused and in its original packaging.

Return procedure for R5F565N7AGFP#30:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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