Renesas R5F565N7EGFB#30

Overview

R5F565N7EGFB#30 from Renesas is a 32-bit RXv2 microcontroller with 120 MHz max operating frequency, 240 DMIPS performance, on-chip FPU, 2 MB code flash, 640 KB SRAM, and integrated Ethernet MAC, CAN, SD host/slave, QSPI, and GLCDC. It serves as a high-integration application processor for industrial HMI, networked gateways, and secure edge devices requiring real-time control and connectivity.

For engineers reviewing the R5F565N7EGFB#30 datasheet, R5F565N7EGFB#30 pinout, R5F565N7EGFB#30 application, or R5F565N7EGFB#30 equivalent, key selection criteria include its dual-bank flash architecture for safe firmware updates, TSIP-based AES-128/192/256 encryption, 136-pin LFBGA package (PLQP0176KB-A), -40°C to +105°C operating range, and hardware-accelerated 2D graphics rendering via DRW2D.

Technical Context

The R5F565N7EGFB#30 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and IEEE-754 single-precision FPU - enabling deterministic real-time execution at 120 MHz. Its memory subsystem includes 2 MB dual-bank flash (with background programming), 640 KB SRAM (no wait states), and 32 KB data flash rated for 100,000 erase/write cycles.

Peripherals are clocked across four domains: ICLK (up to 120 MHz for CPU), PCLKA (up to 120 MHz for ETHERC, GLCDC, DRW2D), PCLKB (up to 60 MHz for timers, SCI, I²C), and PCLKC/PCLKD (up to 60 MHz for A/D converters). The device integrates dedicated security IP (TSIP), IEC60730-compliant self-test functions, and event-linking controller (ELC) for zero-CPU-latency peripheral coordination.

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array, 24 mm × 24 mm, 0.5 mm ball pitch, 1.0 mm height, Pb-free, RoHS compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F565N7EGFB#30, the R5F565NEDFP#30 offers lower integration but simpler packaging and reduced cost, while the R5F566TEADFP#30 trades networking and graphics for superior motor control peripherals - making each optimal for distinct industrial subsystem roles.

Availability

R5F565N7EGFB#30 is available at Aetrix Electronics and suitable for industrial HMI, secure edge gateways, and networked energy meters requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F565N7EGFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets.

The RX65N Group - including R5F565N7EGFB#30 - was designed for secure, connected industrial applications demanding real-time performance, rich peripheral integration, and functional safety compliance.

FAQ

What is the maximum operating frequency and CPU architecture of the R5F565N7EGFB#30?

The R5F565N7EGFB#30 operates at a maximum frequency of 120 MHz using the 32-bit RXv2 CPU core with Harvard architecture and 5-stage pipeline. It delivers 240 DMIPS performance and includes a single-precision IEEE-754 floating-point unit. This architecture enables deterministic real-time execution required for industrial control and protocol stacks, and the R5F565N7EGFB#30 maintains full instruction compatibility within the RX65N Group.

Does the R5F565N7EGFB#30 support secure firmware updates and cryptographic operations?

Yes, the R5F565N7EGFB#30 integrates Trusted Secure IP (TSIP) supporting AES-128/192/256 encryption/decryption, a configurable CRC calculator, register write protection, and an 8-region memory protection unit (MPU). Its dual-bank flash architecture allows background programming and bank-swapping - enabling secure, zero-downtime firmware updates. These features make the R5F565N7EGFB#30 suitable for IEC62443-3-3 SL2-compliant deployments.

What display interfaces and graphics capabilities does the R5F565N7EGFB#30 provide?

The R5F565N7EGFB#30 includes a Graphic-LCD Controller (GLCDC) supporting RGB parallel interfaces up to 1024×768@60 Hz and a dedicated 2D Drawing Engine (DRW2D) for hardware-accelerated bit blitting, rotation, scaling, and CLUT-based color conversion. These peripherals eliminate the need for external video processors in embedded HMIs. The R5F565N7EGFB#30's DRW2D offloads GUI rendering from the CPU, improving system responsiveness and reducing power consumption.

How many communication interfaces does the R5F565N7EGFB#30 integrate, and which are supported?

The R5F565N7EGFB#30 integrates Ethernet MAC (10/100 Mbps MII/RMII), CAN (2 channels, ISO11898-1 compliant), USB 2.0 FS host/function/OTG, SD host/slave (1 channel each), MMCIF, QSPI, 3× RSPI, 13× SCI, 3× I²C, and parallel camera interface (PDC). All interfaces operate with dedicated DMA controllers and ELC event linking. This comprehensive set makes the R5F565N7EGFB#30 ideal for multi-protocol industrial gateways without external bridge ICs.

What is the package type and thermal specification of the R5F565N7EGFB#30?

The R5F565N7EGFB#30 uses a 176-pin LFBGA package (PLQP0176KB-A), measuring 24 mm × 24 mm with 0.5 mm ball pitch and 1.0 mm height. It is rated for operation from -40°C to +105°C (G-version), qualified for industrial and extended-temperature environments. The package supports standard reflow profiles and provides robust thermal dissipation for sustained 120 MHz operation in enclosed enclosures - a key requirement for the R5F565N7EGFB#30 in fanless industrial designs.