Renesas R5F565N9BDFB#10

Overview

R5F565N9BDFB#10 from Renesas is a 32-bit RXv2 microcontroller with 120 MHz max operating frequency, 240 DMIPS performance, single-precision IEEE-754 FPU, 2 MB on-chip code flash memory (dual-bank), and 640 KB SRAM - designed for industrial HMI, networked gateway, and secure IoT edge node applications requiring Ethernet MAC, CAN, SD host/slave, and hardware encryption.

For engineers reviewing the R5F565N9BDFB#10 datasheet, R5F565N9BDFB#10 pinout, R5F565N9BDFB#10 application, or R5F565N9BDFB#10 equivalent, key selection considerations include its 176-pin LFBGA package (PLQP0176KB-A), integrated TSIP/AES-256 security engine, 12-bit dual A/D converters (21-channel + 8-channel), real-time clock with battery backup, and full-speed USB 2.0 host/function support with OTG capability.

Technical Context

The R5F565N9BDFB#10 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates dedicated peripheral clocks (PCLKA up to 120 MHz for ETHERC/DRW2D, PCLKB up to 60 MHz for timers/ADC), event-link controller (ELC) for hardware-triggered peripheral coordination, and memory protection unit (MPU) supporting eight configurable regions.

Its mixed-signal subsystem includes two independent 12-bit A/D units with self-diagnostic and analog input disconnection detection, two buffered 12-bit D/A channels, and a calibrated on-die temperature sensor referenced to AVCC1. Security is enforced via Trusted Secure IP (TSIP) with AES-128/192/256, Trusted Memory (TM) for code read protection, and register write protection against runaway code.

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 mm × 24 mm body, 0.5 mm ball pitch, 136 general-purpose I/O pins (5-V tolerant on 19 pins), 1 dedicated IRQ input, pull-up resistors and open-drain outputs configurable per pin.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F565N9BDFB#10, the R5F565NEBDFB#10 reduces memory capacity for lower BOM cost, while the R5F566NHBDFB#10 upgrades CPU speed, security features, and CAN capability - making it suitable for next-generation designs demanding CAN FD or higher deterministic throughput.

Availability

R5F565N9BDFB#10 is available at Aetrix Electronics and suitable for industrial HMI panels, smart gateways, and secure IoT sensor nodes requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for production programs.

Supply support for R5F565N9BDFB#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.

The RX65N Group - including R5F565N9BDFB#10 - was engineered for secure, connected industrial edge devices requiring rich connectivity (Ethernet/CAN/USB/SD), real-time graphics, and hardware-accelerated cryptography in extended temperature environments.

FAQ

What is the maximum operating frequency and CPU performance of the R5F565N9BDFB#10?

The R5F565N9BDFB#10 operates at a maximum frequency of 120 MHz using the RXv2 CPU core and delivers 240 DMIPS of processing performance. Its single-precision IEEE-754 floating-point unit (FPU), dual multiply-accumulate units, and 5-stage pipeline enable deterministic real-time execution for industrial control and signal processing tasks. This performance level is confirmed in the official Renesas datasheet R01DS0276EJ0240 Rev.2.40.

Does the R5F565N9BDFB#10 support hardware encryption and security certification?

Yes, the R5F565N9BDFB#10 integrates Trusted Secure IP (TSIP) supporting AES-128/192/256 encryption, key wrapping, and secure boot. It also includes Trusted Memory (TM) for code read protection, CRC calculator (CRCA), memory protection unit (MPU), and IEC60730 Class B self-test functions - enabling compliance with industrial safety and cybersecurity standards. These capabilities are documented in Section 1.1 and Chapter 32 of the R01DS0276EJ0240 datasheet.

What package type and pin count does the R5F565N9BDFB#10 use?

The R5F565N9BDFB#10 uses the PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA) with 24 mm × 24 mm body size and 0.5 mm ball pitch. It provides 136 general-purpose I/O pins, including 19 pins with 5-V tolerance, and supports multiple low-power modes. This mechanical specification is defined on page 1 of the R01DS0276EJ0240 datasheet.

Can the R5F565N9BDFB#10 interface directly with an SD memory card and an SDIO peripheral simultaneously?

Yes, the R5F565N9BDFB#10 integrates three independent storage interfaces: SD host interface (SDHI), SD slave interface (SDSI), and MMC host interface (MMCIF). The SDHI supports 1-/4-bit SD memory and SDIO cards at up to 25 MB/s, while SDSI allows the device to act as an SDIO card - enabling concurrent connection to both an SD card (for logging) and an SDIO Wi-Fi module (for wireless upload). This dual-role capability is detailed in Sections 1.1 and 28 of the R01DS0276EJ0240 datasheet.

What are the key differences between the R5F565N9BDFB#10 and the R5F565NEBDFB#10?

The R5F565N9BDFB#10 and R5F565NEBDFB#10 share identical package (PLQP0176KB-A), CPU, peripherals, and temperature grade, but differ in memory configuration: R5F565N9BDFB#10 has 2 MB code flash and 640 KB SRAM, whereas R5F565NEBDFB#10 has 1.5 MB code flash and 256 KB SRAM. This makes the latter more cost-effective for applications with smaller firmware footprints and less demanding graphics or buffering needs - as specified in Table 1.2 of the R01DS0276EJ0240 datasheet.