Renesas R5F565NEDGFC#30
- Part No.:
- R5F565NEDGFC#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 176-LQFP
- Datasheet:
-
R5F565NEDGFC#30.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 176LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,091
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Product details
Overview
R5F565NEDGFC#30 from Renesas is a 32-bit RXv2 microcontroller with 120 MHz max operating frequency, 240 DMIPS performance, on-chip FPU compliant with IEEE-754 single-precision, 2 MB code flash memory with dual-bank support, and 640 KB SRAM - designed for industrial HMI, networked gateway, and secure IoT edge node applications requiring Ethernet MAC, CAN, SD host/slave, and hardware encryption.
For engineers reviewing the R5F565NEDGFC#30 datasheet, R5F565NEDGFC#30 pinout, R5F565NEDGFC#30 application, or R5F565NEDGFC#30 equivalent, this MCU delivers deterministic real-time control with integrated GLCDC, DRW2D graphics acceleration, IEC60730 safety features, and TSIP-based AES-128/192/256 cryptographic acceleration - critical for certified embedded systems demanding functional safety and secure firmware updates.
Technical Context
The R5F565NEDGFC#30 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates a dedicated 120-MHz system clock (ICLK), multiple peripheral clocks (PCLKA up to 120 MHz for ETHERC/DRW2D, PCLKB up to 60 MHz for timers/A/D), and independent ADCLK domains for dual 12-bit S12AD units.
Its memory subsystem includes dual-bank 2 MB code flash with background programming/erasing (BGO), 32 KB data flash rated for 100,000 write cycles, 640 KB SRAM (256 KB + 384 KB expansion), and 8 KB standby RAM backed by VBATT. Peripheral integration spans Ethernet MAC + RMII/MII PHY, 2-channel CAN (ISO 11898-1), 13 SCI channels, 3 RSPI, QSPI, SDHI/SDSI/MMCIF, PDC for CMOS camera, GLCDC, and DRW2D.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit CISC with 5-stage pipeline, 240 DMIPS @ 120 MHz |
| Max Operating Frequency | 120 MHz system clock (ICLK); PCLKA up to 120 MHz for ETHERC/GLCDC/DRW2D |
| Memory | 2 MB dual-bank code flash (no-wait ≤50 MHz), 32 KB data flash (100k cycles), 640 KB SRAM (no-wait) |
| Analog Peripherals | Dual 12-bit S12AD (8+21 ch), 2-channel 12-bit R12DA, on-die temperature sensor (±1°C) |
| Connectivity | Ethernet MAC + RMII/MII PHY, 2× CAN, 13× SCI, 3× RSPI, QSPI, SDHI/SDSI/MMCIF, USB 2.0 FS host/function |
| Security & Safety | TSIP crypto engine (AES-128/192/256), MPU (8 regions), Trusted Memory (TM), CRC calculator, IEC60730 self-test functions |
| Package & Temp | LFBGA-176 (PLQP0176KB-A, 24×24 mm, 0.5 mm pitch), –40°C to +105°C (G-version) |
Pinout & Package
LFBGA-176 package (PLQP0176KB-A) with 0.5 mm pitch, 24 mm × 24 mm body size, and 136 general-purpose I/O pins - including 19 5-V-tolerant inputs, full open-drain capability, and programmable pull-up resistors.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Power supply inputs | Separate digital/analog supplies (2.7–3.6 V); AVCC1 powers A/D and D/A converters |
| VBATT | Battery backup supply | Enables RTC operation during main power loss; connects to coin-cell or backup source |
| RES# | Active-low reset input | Hardware reset assertion; synchronous release after power stabilization and POR timing |
| EXTAL / XTAL | External crystal oscillator terminals | Supports 8–24 MHz crystal for main clock; enables high-accuracy timing and PLL reference |
| MD0 / MD1 | Mode setting pins | Configure boot mode (SCI/USB/FINE) and chip operating mode at power-on reset |
| ETXD0–ETXD3 / ETXEN / ETXER / ERXD0–ERXD3 / ERXDV / ERXER | Ethernet PHY interface | RMII-compliant 2-wire MII signals; supports 10/100 Mbps full/half-duplex with flow control |
| CAN0TX / CAN0RX / CAN1TX / CAN1RX | CAN transceiver I/O | Differential signaling per ISO 11898-1; each channel supports 32 mailboxes with FIFO buffering |
| SD0CMD / SD0CLK / SD0DAT0–3 | SD host interface signals | 4-bit SD bus supporting high-speed mode (25 MB/s); includes card detection and write-protect sensing |
Key Features
| Feature | Design Value |
|---|---|
| Graphics Acceleration | Integrated GLCDC + DRW2D enables real-time 2D rendering, bit-blitting, and multi-plane LCD overlay without CPU load |
| Secure Boot & Firmware | Trusted Memory (TM) blocks read access to protected code flash regions; TSIP performs AES decryption in hardware during boot |
| Functional Safety Support | IEC60730-compliant features include oscillation-stop detection, CRC calculator, IWDT windowing, A/D self-diagnostic, and register write protection |
| Real-Time Determinism | Event Link Controller (ELC) enables direct peripheral-to-peripheral triggering (e.g., TPU → A/D start), eliminating CPU ISR latency |
| Low-Power Operation | Four low-power modes (sleep, module stop, software standby, deep software standby); 0.19 mA/MHz typical active current |
Applications
| Industrial HMI Panel | Smart Gateway Device |
|---|---|
Use Scenario: Touch-enabled factory display with real-time PLC data visualization, local alarm logging, and remote diagnostics via Ethernet. IC Role / Device Role / Timing Role: Primary application processor running RTOS, driving 480×272 RGB LCD via GLCDC, capturing touch events via SCI/USB, and managing secure OTA updates. Use Value: DRW2D accelerates UI rendering; dual-bank flash enables safe firmware swap; TSIP secures update payloads against tampering. |
Use Scenario: Field-deployed protocol translator aggregating Modbus RTU, CAN bus, and BACnet MS/TP traffic into unified Ethernet/IP or MQTT streams. IC Role / Device Role / Timing Role: Central protocol bridge with concurrent Ethernet MAC, dual CAN controllers, and 13 SCI ports handling asynchronous serial protocols. Use Value: Hardware CRC and ELC-linked timer-triggered A/D sampling ensure deterministic latency; 640 KB SRAM buffers multi-protocol packet queues. |
| Secure IoT Edge Node | Medical Data Logger |
Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and CO₂ via analog sensors, encrypting data, and transmitting over cellular via USB-connected modem. IC Role / Device Role / Timing Role: Secure sensor hub with on-die temperature sensor, dual 12-bit A/D, AES crypto engine, and USB host for modem control. Use Value: TSIP performs AES-256 encryption in <10 µs per 16-byte block; deep software standby draws <1 µA while preserving 8 KB standby RAM. |
Use Scenario: Portable patient vitals recorder acquiring ECG, SpO₂, and respiration waveforms at clinical-grade resolution, storing to SD card, and supporting USB mass storage export. IC Role / Device Role / Timing Role: High-fidelity data acquisition controller with dual S12AD units (21-channel unit for analog front-end), SDHI for high-speed SD writing, and 12-bit D/A for calibration signal generation. Use Value: 0.48 µs/channel A/D conversion time ensures >2 MSPS aggregate throughput; SDHI supports 25 MB/s high-speed mode for continuous waveform capture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F565NEHDFC#30 | Same RX65N Group, identical peripherals and memory, but LQFP-176 package (PLQP0176KB-A variant with different thermal/mechanical profile) | Requires PCB layout change due to LQFP vs LFBGA footprint; same pinout mapping but different soldering process and thermal dissipation | Select for prototyping or cost-sensitive designs where LQFP rework is preferred over BGA assembly. |
| R5F566NEDGFC#30 | RX66N Group successor: higher 160 MHz CPU, enhanced TSIP-Lite, additional CAN FD support, larger 4 MB flash option, but no SD slave interface | Not drop-in compatible; lacks SDSI module and uses different interrupt vector mapping; requires firmware porting for CAN FD and security enhancements | Choose for new designs needing CAN FD, higher performance, or extended lifecycle; not suitable for direct replacement in existing R5F565NEDGFC#30 systems. |
Compared with R5F565NEDGFC#30, the R5F565NEHDFC#30 offers identical functionality in LQFP packaging for easier assembly, while the R5F566NEDGFC#30 provides architectural upgrades (CAN FD, 160 MHz) at the cost of compatibility - making the original optimal for production systems requiring SD slave, proven reliability, and G-grade temperature range.
Availability
R5F565NEDGFC#30 is available at Aetrix Electronics and suitable for industrial HMI, smart gateway, and secure IoT edge node applications requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability under extended temperature conditions.
Supply support for R5F565NEDGFC#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.
The RX65N Group, which includes R5F565NEDGFC#30, was engineered for high-integration industrial control and human-machine interface applications - combining real-time determinism, graphics acceleration, functional safety, and hardware security in a single-chip solution.
FAQ
What is the maximum operating frequency and CPU performance of the R5F565NEDGFC#30?
The R5F565NEDGFC#30 operates at a maximum system clock frequency of 120 MHz using the RXv2 CPU core, delivering 240 DMIPS of processing performance. Its single-precision IEEE-754 floating-point unit (FPU), dual multiply-and-accumulate units, and 32-bit multiplier enable deterministic real-time computation for motor control, signal processing, and graphics rendering tasks within the R5F565NEDGFC#30's architecture.
Does the R5F565NEDGFC#30 support secure firmware updates and cryptographic operations?
Yes, the R5F565NEDGFC#30 integrates the Trusted Secure IP (TSIP) engine supporting AES-128, AES-192, and AES-256 encryption/decryption in hardware, along with Trusted Memory (TM) to protect code flash regions from unauthorized read access. These features enable secure boot, encrypted OTA updates, and runtime key management - all implemented directly within the R5F565NEDGFC#30 without external security ICs.
What display and graphics capabilities does the R5F565NEDGFC#30 provide?
The R5F565NEDGFC#30 includes a dedicated Graphic-LCD Controller (GLCDC) supporting RGB, YUV, and CLUT-based displays up to WXGA resolution, plus a 2D Drawing Engine (DRW2D) that accelerates vector drawing, bit-blitting, rotation, and scaling. These peripherals operate independently of the CPU, allowing the R5F565NEDGFC#30 to drive complex UIs with smooth animation and multi-layer overlays in resource-constrained HMI applications.
How many communication interfaces are integrated into the R5F565NEDGFC#30?
The R5F565NEDGFC#30 integrates 1 Ethernet MAC with RMII/MII PHY, 2 ISO 11898-1 CAN channels (32 mailboxes each), 13 serial communication interfaces (SCIg/h/i), 3 RSPI, 1 QSPI, SD host/slave interfaces, USB 2.0 FS host/function, and MMCIF - providing comprehensive wired connectivity for industrial gateways, protocol bridges, and multi-interface edge devices built around the R5F565NEDGFC#30.
What is the package type and temperature grade of the R5F565NEDGFC#30?
The R5F565NEDGFC#30 is housed in a 176-pin LFBGA package (PLQP0176KB-A, 24 mm × 24 mm, 0.5 mm pitch) and rated for the industrial G-grade temperature range of –40°C to +105°C. This package supports 136 general-purpose I/O pins with 5-V tolerance on 19 pins, open-drain outputs, and programmable pull-up resistors - optimized for high-density, thermally demanding applications using the R5F565NEDGFC#30.
R5F565NEDGFC#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 176-LQFP
- Series:
- RX65N
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv2
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 136
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 640K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 29x12b; D/A 2x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F565NEDGFC#30 FAQ
1.How can I place an order for R5F565NEDGFC#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F565NEDGFC#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F565NEDGFC#30 reliable?
The price and inventory of R5F565NEDGFC#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F565NEDGFC#30 is usually 5 days.
3.What payment methods are accepted for R5F565NEDGFC#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F565NEDGFC#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F565NEDGFC#30?
R5F565NEDGFC#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F565NEDGFC#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F565NEDGFC#30?
For technical support, including R5F565NEDGFC#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F565NEDGFC#30 requirements.
6.How does Aetrix verify that R5F565NEDGFC#30 is sourced from the original manufacturer or authorized distributors?
All R5F565NEDGFC#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F565NEDGFC#30 meets industry standards.
7.What is the process for return or replacement of R5F565NEDGFC#30?
All R5F565NEDGFC#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F565NEDGFC#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F565NEDGFC#30 part is unused and in its original packaging.
Return procedure for R5F565NEDGFC#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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