Renesas R5F565NEHDFB#10

Overview

R5F565NEHDFB#10 from Renesas is a 120-MHz 32-bit RXv2 MCU with single-precision IEEE-754 FPU, 240 DMIPS performance, 2 MB on-chip code flash (dual-bank), 640 KB SRAM, and integrated Ethernet MAC, CAN, SD host/slave, QSPI, and GLCDC for embedded HMI and industrial connectivity applications.

For engineers reviewing the R5F565NEHDFB#10 datasheet, R5F565NEHDFB#10 pinout, R5F565NEHDFB#10 application, or R5F565NEHDFB#10 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), -40°C to +85°C operating range, dual-bank flash for safe firmware updates, hardware AES/TSIP encryption, and real-time clock with battery backup support.

Technical Context

The R5F565NEHDFB#10 implements the RXv2 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code. It integrates a memory protection unit (MPU) and Trusted Memory (TM) for IEC60730-compliant safety-critical operation.

Its clock system combines external crystal oscillators (8–24 MHz), internal PLL, and multiple on-chip oscillators (LOCO/HOCO/IWDT-dedicated), with independent clock domains for ICLK (up to 120 MHz), PCLKA (120 MHz), PCLKB (60 MHz), and peripheral-specific clocks (ADCLK, FCLK, BCLK).

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array, 24 mm × 24 mm, 0.5 mm pitch, RoHS-compliant, lead-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F565NEHDFB#10, the R5F565NEDDFB#10 reduces memory capacity while maintaining identical safety and connectivity features, whereas the R5F566TEHDFB#10 trades graphics acceleration for superior real-time motor control timing and higher CPU throughput.

Availability

R5F565NEHDFB#10 is available at Aetrix Electronics and suitable for industrial HMI panels, smart energy gateways, factory automation controllers, and medical infusion pumps requiring stable component supply across extended product lifecycles.

Supply support for R5F565NEHDFB#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX65N Group, including R5F565NEHDFB#10, was designed for high-integration industrial and HMI applications requiring real-time performance, functional safety, graphics capability, and secure connectivity.

FAQ

What is the maximum operating frequency and CPU architecture of the R5F565NEHDFB#10?

The R5F565NEHDFB#10 operates at a maximum frequency of 120 MHz and uses the 32-bit RXv2 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions. It delivers 240 DMIPS performance and includes a single-precision IEEE-754 floating-point unit. This architecture enables deterministic real-time execution and ultra-compact code density, making the R5F565NEHDFB#10 suitable for demanding industrial control and HMI applications.

Does the R5F565NEHDFB#10 support secure firmware updates and cryptographic operations?

Yes, the R5F565NEHDFB#10 integrates Trusted Secure IP (TSIP) for hardware-accelerated AES-128/192/256 encryption and secure key storage, plus a dual-bank flash memory architecture that enables background programming and safe bank switching. These features allow authenticated, encrypted over-the-air (OTA) firmware updates without interrupting application execution-critical for maintaining security and uptime in deployed R5F565NEHDFB#10-based systems.

What graphics and display capabilities does the R5F565NEHDFB#10 provide?

The R5F565NEHDFB#10 includes a Graphic-LCD Controller (GLCDC) supporting 3-layer overlay (background + two graphics planes), 32/16 bpp pixel formats, and CLUT-based color mapping, plus a dedicated 2D Drawing Engine (DRW2D) for vector drawing, bit blitting, and display list execution. These integrated peripherals eliminate the need for external graphics controllers and reduce BOM cost in HMI applications built around the R5F565NEHDFB#10.

How does the R5F565NEHDFB#10 meet IEC60730 Class B safety requirements?

The R5F565NEHDFB#10 incorporates multiple IEC60730-compliant safety mechanisms: a CRC calculator (CRCA) for data integrity, self-diagnostic A/D converter testing, oscillation-stoppage detection, register write protection, and memory protection unit (MPU) enforcement. These features-documented in Renesas' safety manual for the RX65N Group-enable certified Class B implementation in appliances and industrial equipment using the R5F565NEHDFB#10 as the primary controller.

What is the package type and thermal specification of the R5F565NEHDFB#10?

The R5F565NEHDFB#10 is housed in a 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA) package designated PLQP0176KB-A, measuring 24 mm × 24 mm with 0.5 mm pitch. It is rated for industrial temperature operation from –40°C to +85°C (D-version), and its thermal design supports sustained 120 MHz operation under typical PCB layout and airflow conditions specified in the R5F565NEHDFB#10 datasheet.