Renesas R5F565NEHGLJ#20

Overview

R5F565NEHGLJ#20 from Renesas is a 120-MHz 32-bit RXv2 core MCU with single-precision IEEE-754 FPU, 240 DMIPS performance, 2 MB on-chip code flash (dual-bank), 640 KB SRAM, and integrated Ethernet MAC, CAN, SD host/slave, QSPI, and GLCDC for embedded HMI applications. It operates from 2.7–3.6 V and supports –40°C to +105°C (G-version).

For engineers reviewing the R5F565NEHGLJ#20 datasheet, R5F565NEHGLJ#20 pinout, R5F565NEHGLJ#20 application, or R5F565NEHGLJ#20 equivalent, key selection criteria include dual-bank flash for safe firmware updates, 136 GPIOs with 5-V tolerance, hardware AES/TSIP encryption, RTC with battery backup, and IEC60730 safety features including self-diagnostic A/D and oscillation-stop detection.

Technical Context

The R5F565NEHGLJ#20 implements the RXv2 CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and MPU-enforced memory protection. It integrates dedicated clock domains: ICLK up to 120 MHz for CPU/core logic, PCLKA up to 120 MHz for high-speed peripherals (ETHERC, EDMAC, AES, GLCDC), and PCLKB up to 60 MHz for timers, A/D, and communication interfaces.

Its peripheral subsystem includes a full-featured Ethernet controller (MII/RMII, 10/100 Mbps), two CAN channels (ISO 11898-1, 32 mailboxes each), and three independent serial interface families (SCIg/h/i, RIIC, RSPI/QSPI) with ELC-based event linking-enabling deterministic, CPU-free signal chaining between timers, A/D triggers, and I/O transitions.

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 × 24 mm body, 0.5-mm ball pitch, RoHS-compliant, lead-free, moisture sensitivity level 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F565NEHGLJ#20, the R5F565NEDFLJ#20 offers identical functionality in an LQFP package but limits operating temperature to +85°C, while the R5F566TEHGLJ#20 trades graphics and Ethernet capability for higher CPU speed and motor-control-specific peripherals-making it unsuitable as a drop-in replacement for HMI or gateway roles.

Availability

R5F565NEHGLJ#20 is available at Aetrix Electronics and suitable for industrial gateways, smart energy meters, HMI display controllers, and building automation nodes requiring stable component supply across extended temperature and long product lifecycles.

Supply support for R5F565NEHGLJ#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, infrastructure, and IoT markets.

The RX65N Group, which includes the R5F565NEHGLJ#20, was designed specifically for industrial HMI, gateway, and safety-certifiable embedded applications requiring rich connectivity, graphics acceleration, and functional safety support.

FAQ

What is the maximum operating frequency and CPU architecture of the R5F565NEHGLJ#20?

The R5F565NEHGLJ#20 features a 32-bit RXv2 CPU core with a maximum operating frequency of 120 MHz and delivers 240 DMIPS performance. It implements a CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and single-precision IEEE-754 floating-point unit-enabling deterministic real-time execution for industrial control and communication tasks.

Does the R5F565NEHGLJ#20 support secure boot and cryptographic operations?

Yes, the R5F565NEHGLJ#20 includes hardware AES engines supporting 128-, 192-, and 256-bit keys, plus the Trusted Secure IP (TSIP) module for secure key storage, encrypted firmware loading, and secure boot verification. These features are integral to its IEC60730 Class B compliance and enable robust device authentication and data confidentiality in networked industrial systems.

What package type and pin count does the R5F565NEHGLJ#20 use?

The R5F565NEHGLJ#20 uses a 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA) package designated PLQP0176KB-A, measuring 24 × 24 mm with 0.5-mm ball pitch. It provides 136 general-purpose I/O pins, of which 19 are 5-V tolerant, and supports industrial-grade operation from –40°C to +105°C.

Can the R5F565NEHGLJ#20 execute firmware updates without interrupting real-time operation?

Yes, the R5F565NEHGLJ#20 supports background programming and dual-bank flash architecture, allowing one bank to execute code while the other is being erased or programmed. This enables safe, atomic firmware updates in the field without halting application execution-critical for uninterrupted operation in industrial gateways and energy metering systems.

Which communication interfaces are integrated into the R5F565NEHGLJ#20 for industrial networking?

The R5F565NEHGLJ#20 integrates Ethernet MAC (10/100 Mbps MII/RMII), two ISO 11898-1 CAN channels (32 mailboxes each), 13 SCI channels (asynchronous, SPI/I²C emulation), three I²C buses (up to 1 Mbps), three RSPI interfaces, one QSPI port, SD host/slave, and MMCIF-providing comprehensive wired connectivity for multi-protocol industrial edge devices.