Renesas R5F56604BGFL#30

Overview

R5F56604BGFL#30 from Renesas is a 32-bit RXv3 microcontroller with 120 MHz maximum operating frequency, 1 Mbyte on-chip code flash, 128 Kbytes SRAM, and integrated CAN FD, 12-bit A/D and D/A converters, RTC, and remote control signal receiver - deployed in industrial motor control and automotive body electronics requiring deterministic real-time response and IEC 60730 compliance.

For engineers reviewing the R5F56604BGFL#30 datasheet, R5F56604BGFL#30 pinout, R5F56604BGFL#30 application, or R5F56604BGFL#30 equivalent, key selection considerations include its 144-pin LFQFP (PLQP0144KA-B) package, G-grade temperature range (–40°C to +105°C), sub-clock oscillator support for RTC operation, dual-channel 12-bit D/A output usable as comparator reference, and ELC-enabled event-driven peripheral coordination without CPU intervention.

Technical Context

The R5F56604BGFL#30 implements the RXv3 CPU core with single-precision FPU compliant with IEEE 754, supporting 709 CoreMark at 120 MHz and collective register bank save for fast context switching. Its clock system integrates main (8–24 MHz crystal), sub (32.768 kHz), and on-chip oscillators (LOCO/HOCO/IWDT-dedicated), with independent PLL and fine-grained peripheral clock domains (ICLK up to 120 MHz, PCLKA up to 120 MHz, PCLKB up to 60 MHz, ADCLK up to 60 MHz).

Peripheral architecture centers on event-driven operation via the Event Link Controller (ELC), enabling 83 internal event signals to trigger timer counting, A/D conversion, or GPIO state changes without interrupt overhead. It includes MTU3a (9-channel multifunction timer), CAN FD (ISO 11898-1:2015 compliant), RSPId (30 Mbps SPI), and RIICa (400 kbps I²C with SMBus support), all synchronized to dedicated clock domains and configurable via register-level access.

Key Specifications

Pinout & Package

Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 × 20 mm body, 0.5 mm lead pitch, exposed pad, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56604BGFL#30, the R5F56605BGFL#30 offers identical performance and peripherals at reduced flash capacity, while the R5F56606BGFL#30 removes SOSC to lower cost and power but forfeits RTC capability - both require no PCB changes but differ in firmware storage and timekeeping readiness.

Availability

R5F56604BGFL#30 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, smart energy metering, and PLC I/O modules requiring stable component supply, long-term lifecycle assurance, and G-grade thermal qualification.

Supply support for R5F56604BGFL#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, infrastructure, and IoT markets.

The RX660 Group is designed for high-performance, functional-safety-aware industrial and automotive applications - emphasizing real-time determinism, integrated safety features (IEC 60730), and heterogeneous peripheral integration to reduce system-level component count.

FAQ

What is the maximum operating frequency and core type of the R5F56604BGFL#30?

The R5F56604BGFL#30 operates at a maximum frequency of 120 MHz using the 32-bit RXv3 CPU core with single-precision floating-point unit (FPU) compliant with IEEE 754. It achieves 709 CoreMark at this speed and supports collective register bank save for rapid context switching - critical for real-time multitasking in the R5F56604BGFL#30.

Does the R5F56604BGFL#30 support CAN FD, and what standard does it comply with?

Yes, the R5F56604BGFL#30 integrates one CAN FD module compliant with ISO 11898-1:2015, supporting both standard and extended frames with data rates up to 5 Mbps and payload lengths up to 64 bytes. This capability is confirmed in the R01DS0393EJ0100 datasheet and enables high-bandwidth communication in modern automotive and industrial networks for the R5F56604BGFL#30.

What package and temperature grade does the R5F56604BGFL#30 use?

The R5F56604BGFL#30 uses the 144-pin LFQFP package (PLQP0144KA-B, 20 × 20 mm, 0.5 mm pitch) and is rated for the G-grade industrial temperature range of –40°C to +105°C. This package includes a sub-clock oscillator (SOSC) for RTC operation and supports JTAG/FINE debugging - defining the physical and environmental envelope of the R5F56604BGFL#30.

How much on-chip memory does the R5F56604BGFL#30 include, and what are its endurance characteristics?

The R5F56604BGFL#30 includes 1 Mbyte of on-chip code flash memory (zero-wait-state at 120 MHz), 32 Kbytes of reprogrammable data flash memory (rated for 100,000 write/erase cycles), and 128 Kbytes of SRAM (zero-wait-state). All flash operations support background execution (BGO), allowing firmware updates without halting real-time tasks in the R5F56604BGFL#30.

What safety and functional safety features does the R5F56604BGFL#30 provide for IEC 60730 compliance?

The R5F56604BGFL#30 provides dedicated hardware features for IEC 60730 Class B compliance, including oscillation-stop detection, A/D converter self-diagnosis and disconnection detection, clock frequency accuracy measurement circuit (CAC), independent watchdog timer (IWDT) with window function, RAM test assist (DOC), CRC calculator (CRCA), and register write protection. These are documented in the R01DS0393EJ0100 datasheet and form the foundation of safety-critical firmware validation for the R5F56604BGFL#30.