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Renesas R5F56604DGFN#30

Part No.:
R5F56604DGFN#30
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
80-LQFP
Datasheet:
AetrixR5F56604DGFN#30.pdf
Description:
IC MCU 32BIT 512KB FLASH 80LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:238

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Product details

Overview

R5F56604DGFN#30 from Renesas is a 32-bit RXv3 core MCU operating at up to 120 MHz, delivering 709 CoreMark performance, with 1 MB code flash, 128 KB SRAM, and 32 KB data flash. It integrates CAN FD (ISO 11898-1:2015), 12-bit A/D (24 channels), dual 12-bit D/A, RTC with sub-clock support, and operates from 2.7–5.5 V in industrial temperature range (–40°C to +85°C) for motor control and industrial automation systems.

For engineers reviewing the R5F56604DGFN#30 datasheet, R5F56604DGFN#30 pinout, R5F56604DGFN#30 application, or R5F56604DGFN#30 equivalent, key selection considerations include its 144-pin LFQFP (PLQP0144KA-B) package, JTAG/FINE debug interfaces, integrated FPU, ELC event-driven peripheral coordination, and IEC60730 safety features including MPU, CAC, CRCA, and register write protection.

Technical Context

The R5F56604DGFN#30 implements the RXv3 CPU core with single-cycle instruction execution, IEEE 754-compliant single-precision FPU, and 16-register bank save for fast context switching. Its clock system supports independent domain scaling: ICLK up to 120 MHz, PCLKA up to 120 MHz (for MTU3a/RSPI/SCI10–11), PCLKB up to 60 MHz (for TMR/CMT/CMTW/S12ADH), and ADCLK up to 60 MHz.

Peripheral integration centers on deterministic real-time operation: ELC enables interrupt-free inter-module triggering (e.g., MTU3a output capture → S12ADH conversion start), DMACAa provides 8-channel DMA with background operation, and the CAN FD module supports both standard and extended frames at data rates up to 5 Mbps. The device includes hardware safety mechanisms - MPU (8 regions, 16-byte granularity), Trusted Memory (TM) for code protection, and dedicated IWDT with windowed refresh and LOCO-derived 120-kHz clock.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreRXv3 32-bit, 120 MHz max, 709 CoreMark, IEEE 754 FPU, 113 instructions
Memory1 MB code flash (no-wait @120 MHz), 128 KB SRAM (no-wait), 32 KB data flash (100k erase cycles)
Analog Peripherals12-bit S12ADH (24 channels, 0.9 µs min conversion), dual 12-bit R12DAb (0–AVCC0 output), 4-channel CMPC
Timers & ControlMTU3a (9 channels), TMRb (4×8-bit), CMT (4×16-bit), CMTW (2×32-bit), RTCC with sub-clock input
CommunicationCAN FD (1 channel, ISO 11898-1:2015), 13 SCI variants, 2 RIIC (400 kbps), 1 RSPId (30 Mbps), REMCa (1 channel)
Power & Safety2.7–5.5 V supply, –40°C to +85°C (D-version), MPU, TM, CRCA, CAC, DOCA, IWDT with window function
Package & Debug144-pin LFQFP (PLQP0144KA-B, 20×20 mm, 0.5 mm pitch), JTAG and FINE debugging interfaces

Pinout & Package

Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 mm × 20 mm body, 0.5 mm lead pitch, exposed pad, RoHS compliant.

Pin/TerminalCircuit RoleDesign Meaning
VCC / AVCC0Core & analog power supply2.7–5.5 V digital supply; AVCC0 = 3.0–5.5 V analog reference (VCC ≤ AVCC0)
RES#Active-low reset inputHardware reset assertion; internal POR/LVD also available
CLKIN / CLKOUTMain clock oscillator interfaceConnects to 8–24 MHz crystal; supports oscillation-stop detection
XTAL / EXTALSub-clock oscillator interfaceConnects to 32.768 kHz crystal for RTC and low-power timing
TXD0 / RXD0SCI0 asynchronous serial I/OFull-duplex UART interface; supports LIN, smart card, SPI/I²C emulation
CTX0 / CRX0CAN FD channel 0 differential I/OCompliant with ISO 11898-1:2015; supports standard/extended frames up to 5 Mbps
AD00–AD23Analog input channels24-channel 12-bit S12ADH inputs; support self-diagnosis and disconnection detection
DA0 / DA1Digital-to-analog outputsDual 12-bit R12DAb outputs; usable as comparator reference voltage sources
MTIOC0A–MTIOC8AMTU3a waveform I/O9-channel PWM/complementary PWM/phase-counting outputs with dead-time control
IRQ0–IRQ15External interrupt inputs16 configurable edge/level-sensitive interrupt sources with priority levels

Key Features

FeatureDesign Value
Event Link Controller (ELC)Enables 83 internal event signals to trigger peripheral actions (e.g., timer match → ADC start) without CPU intervention, reducing latency and ISR overhead
Trusted Memory (TM)Protects designated code flash regions from read access while allowing CPU instruction fetch only - critical for secure boot and IP protection
IEC60730 Safety SupportIncludes hardware-accelerated CRC (CRCA), clock accuracy monitoring (CAC), RAM test assist (DOC), and register write protection for Class B compliance
Low-Power OperationFour modes including deep software standby with RTC running; supports wake-up via external interrupt, RTC alarm, or CAN FD activity
Floating-Point Unit (FPU)Single-precision IEEE 754 unit integrated into RXv3 core - enables efficient motor control algorithms, sensor fusion, and trigonometric computation (TFU)

Applications

Industrial Motor ControlAutomotive Body Electronics

Use Scenario: Closed-loop control of 3-phase BLDC/PMSM motors in HVAC compressors, pumps, and fans using field-oriented control (FOC).

IC Role / Device Role / Timing Role: Primary controller executing FOC algorithm, generating complementary PWM with dead-time compensation via MTU3a, sampling current/voltage via S12ADH, and managing CAN FD communication with host ECU.

Use Value: Integrated MTU3a complementary PWM with automatic dead-time insertion and synchronized ADC triggers eliminate external gate drivers and reduce timing jitter in high-efficiency inverters.

Use Scenario: Central body controller managing door locks, lighting, window lifts, and seat position memory in passenger vehicles.

IC Role / Device Role / Timing Role: System-on-chip managing LIN and CAN FD networks, driving relays/LEDs via GPIO, monitoring switches/sensors via S12ADH, and logging events to data flash with RTC timestamping.

Use Value: Dual CAN FD and LIN-capable SCIh enable seamless integration into automotive domain controllers while 32 KB data flash supports over-the-air (OTA) parameter updates and diagnostic log storage.

Smart Energy MetersFactory Automation I/O Modules

Use Scenario: Polyphase electricity meter with harmonic analysis, tamper detection, and secure firmware updates via encrypted CAN FD.

IC Role / Device Role / Timing Role: Metering controller performing real-time RMS/THD calculation using FPU and TFU, isolating communication via CAN FD, and validating firmware integrity using CRCA and TM-protected boot code.

Use Value: Hardware CRC (CRCA), clock accuracy monitor (CAC), and MPU enable full IEC61000-4-30 Class A compliance and cybersecurity certification (e.g., IEC 62443).

Use Scenario: DIN-rail-mounted remote I/O module collecting analog/digital sensor data and executing local logic in PLC edge nodes.

IC Role / Device Role / Timing Role: Deterministic real-time processor running ladder logic via ELC-triggered timers and ADC conversions, communicating via RSPI to FPGA-based I/O expansion, and maintaining time-sync via RTC and sub-clock oscillator.

Use Value: ELC eliminates CPU polling for sensor acquisition and actuator response, enabling sub-millisecond I/O cycle times even under heavy communication load.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F56605DGFN#30Same RX660 Group, identical 144-pin LFQFP package and peripherals, but with 512 KB code flash instead of 1 MBSuitable for cost-sensitive designs where firmware footprint < 512 KB and no future feature expansion is plannedSelect when flash capacity requirement is ≤512 KB and BOM cost optimization is prioritized over headroom
R5F566T5DGFN#30Same package and flash size, but adds USB 2.0 FS host/device controller and removes one SCI channel (12 vs. 13 total)Better suited for human-interface or data-acquisition devices requiring USB connectivity (e.g., configuration tools, firmware loaders)Choose when USB interface is mandatory and one fewer SCI channel is acceptable in the system architecture

Compared with R5F56605DGFN#30 and R5F566T5DGFN#30, the R5F56604DGFN#30 provides maximum code density (1 MB flash) without USB overhead, making it optimal for complex real-time control applications where deterministic peripheral timing and large firmware image size are critical design constraints.

Availability

R5F56604DGFN#30 is available at Aetrix Electronics and suitable for industrial motor control, smart energy metering, and factory automation systems requiring stable component supply, long-term lifecycle support, and automotive-grade reliability.

Supply support for R5F56604DGFN#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.

The RX660 Group, including the R5F56604DGFN#30, is engineered for high-integrity real-time control in industrial automation and motor drive systems - emphasizing functional safety (IEC60730), deterministic timing, and integrated analog/motor control peripherals.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F56604DGFN#30?

The R5F56604DGFN#30 operates at a maximum frequency of 120 MHz and achieves 709 CoreMark performance. This benchmark reflects its RXv3 CPU core efficiency, including single-cycle instruction execution, 32-bit multiplier/divider, barrel shifter, and integrated FPU - all validated per the official Renesas R01DS0393EJ0100 datasheet Rev.1.00. The R5F56604DGFN#30 sustains this performance across its full industrial temperature range (–40°C to +85°C) with no wait states on code flash or SRAM.

Does the R5F56604DGFN#30 support CAN FD, and what protocol standard does it comply with?

Yes, the R5F56604DGFN#30 integrates a CAN FD module compliant with ISO 11898-1:2015, supporting both standard (11-bit) and extended (29-bit) frame formats at data rates up to 5 Mbps. It includes dedicated message RAM, flexible bit timing configuration, and error handling consistent with the standard. This capability is confirmed in Table 1.1 and Section 1.1 of the R01DS0393EJ0100 datasheet, and the R5F56604DGFN#30 implements the full CAN FD feature set without requiring external transceivers.

What package type and pin count does the R5F56604DGFN#30 use?

The R5F56604DGFN#30 uses a 144-pin Low-profile Quad Flat Package (LFQFP) with designation PLQP0144KA-B: 20 mm × 20 mm body, 0.5 mm lead pitch, and exposed thermal pad. This package supports all RX660 Group features including JTAG/FINE debug, sub-clock oscillator, and full 134 GPIO capability (130 I/O pins with JTAG + sub-clock enabled). The package is explicitly listed in Table 1.1 and Figure 1.1 of the R01DS0393EJ0100 datasheet.

How much on-chip memory does the R5F56604DGFN#30 include, and what are its access characteristics?

The R5F56604DGFN#30 includes 1 MB of code flash memory with zero-wait-state access at 120 MHz, 128 KB of SRAM with zero-wait-state access, and 32 KB of reprogrammable data flash rated for 100,000 erase/write cycles. All memory blocks support background programming/erasing (BGO), enabling concurrent execution and non-disruptive firmware updates. These specifications are detailed in Sections 1.1 and Table 1.1 of the R01DS0393EJ0100 datasheet, and apply specifically to the R5F56604DGFN#30 variant.

What safety and reliability features does the R5F56604DGFN#30 provide for IEC60730 compliance?

The R5F56604DGFN#30 includes hardware-assisted IEC60730 Class B compliance features: memory protection unit (MPU), Trusted Memory (TM) for code protection, clock frequency accuracy measurement circuit (CAC), CRC calculator (CRCA), data operation circuit (DOCA) for RAM testing, register write protection, and independent watchdog timer (IWDT) with windowed refresh. These are documented in Section 1.1 "Safety" of the R01DS0393EJ0100 datasheet and are implemented in silicon - not software libraries - ensuring deterministic runtime verification for the R5F56604DGFN#30.

R5F56604DGFN#30 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
80-LQFP
Series:
RX600
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
RXv3
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
69
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 17x12b; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F56604DGFN#30 FAQ

1.How can I place an order for R5F56604DGFN#30 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F56604DGFN#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F56604DGFN#30 reliable?

The price and inventory of R5F56604DGFN#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56604DGFN#30 is usually 5 days.

3.What payment methods are accepted for R5F56604DGFN#30?

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4.How is shipping managed for R5F56604DGFN#30?

R5F56604DGFN#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F56604DGFN#30 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F56604DGFN#30?

For technical support, including R5F56604DGFN#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56604DGFN#30 requirements.

6.How does Aetrix verify that R5F56604DGFN#30 is sourced from the original manufacturer or authorized distributors?

All R5F56604DGFN#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56604DGFN#30 meets industry standards.

7.What is the process for return or replacement of R5F56604DGFN#30?

All R5F56604DGFN#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56604DGFN#30, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F56604DGFN#30 part is unused and in its original packaging.

Return procedure for R5F56604DGFN#30:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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