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Renesas R5F56604EDFB#30

Part No.:
R5F56604EDFB#30
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixR5F56604EDFB#30.pdf
Description:
IC MCU 32BIT 512KB FLASH 144LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:240

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Product details

Overview

R5F56604EDFB#30 from Renesas is a 32-bit RXv3 core MCU operating at up to 120 MHz, featuring 1 Mbyte on-chip code flash, 128 Kbytes SRAM, and 32 Kbytes data flash. It integrates CAN FD (ISO 11898-1:2015), 12-bit A/D (24 channels), dual 12-bit D/A converters, RTC with sub-clock support, and ELC for event-driven peripheral coordination - deployed in industrial motor control systems requiring deterministic real-time response and functional safety compliance.

For engineers reviewing the R5F56604EDFB#30 datasheet, R5F56604EDFB#30 pinout, R5F56604EDFB#30 application, or R5F56604EDFB#30 equivalent, key selection criteria include its 144-pin LFQFP (PLQP0144KA-B) package, JTAG/FINE debug interface, 2.7–5.5 V single-supply operation, IEC60730-ready self-test features, and full peripheral set including MTU3a (9-channel PWM), RSPId (30 Mbps SPI), and RIICa (400 kbps I²C).

Technical Context

The R5F56604EDFB#30 implements the RXv3 CPU core with single-cycle instruction execution, IEEE 754-compliant FPU, and 16-register bank save for fast context switching. Its clock system combines an 8–24 MHz external main oscillator, 32.768 kHz sub-clock, and selectable on-chip HOCO/LOCO sources feeding a PLL to achieve 120 MHz ICLK while supporting independent peripheral clock domains (PCLKA up to 120 MHz, PCLKB up to 60 MHz, ADCLK up to 60 MHz).

Peripheral coordination is managed via the Event Link Controller (ELC), which enables 83 internal event signals to trigger module actions (e.g., MTU3a capture, S12ADH conversion, or R12DAb output update) without CPU intervention - critical for low-latency deterministic operation in motor drive and power conversion applications where interrupt latency must be minimized.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreRXv3 32-bit, 120 MHz max, 709 CoreMark, IEEE 754 FPU, 16 register banks
Memory1 Mbyte code flash (no-wait @120 MHz), 128 Kbytes SRAM (no-wait), 32 Kbytes data flash (100k write cycles)
Analog Peripherals12-bit S12ADH (24 channels, 0.9 µs conv.), dual 12-bit R12DAb (0–AVCC0 output), 4-channel CMPC, on-die temp sensor (±1.0°C)
Timers & PWMMTU3a (9 channels, complementary PWM w/ dead-time control), TMRb (4×8-bit), CMT/CMTW (8×16/2×32-bit), IWDTa w/ window function
CommunicationCAN FD (1 ch, ISO 11898-1:2015), 13× SCI (async/sync/I²C/SPI/LIN), 2× RIIC (400 kbps), 1× RSPId (30 Mbps), REMCa (IR remote)
Power & Safety2.7–5.5 V supply, deep software standby w/ RTC active, MPU (8 regions), Trusted Memory (TM), CRCA, CAC, DOCA, IEC60730 self-test suite
Package & Temp144-pin LFQFP (PLQP0144KA-B, 20×20 mm, 0.5 mm pitch), D-version (–40°C to +85°C)

Pinout & Package

144-pin Low-profile Quad Flat Package (LFQFP), PLQP0144KA-B, 20 × 20 mm body, 0.5 mm pitch, exposed pad (thermal pad not electrically connected). Pinout validated per Renesas R01DS0393EJ0100 Rev.1.00, pages 42–47 (pin assignment tables) and Figure 1.2 (package outline).

Pin/TerminalCircuit RoleDesign Meaning
VCC / AVCC0Core & analog power supply2.7–5.5 V digital supply; AVCC0 = 3.0–5.5 V analog reference, must be ≥ VCC
RES#Active-low reset inputAsynchronous hardware reset; drives internal POR/LVD logic when pulled low
CLKIN / CLKOUTMain crystal oscillator interfaceConnects 8–24 MHz crystal; CLKOUT provides buffered feedback for stability monitoring
XTAL / EXTALSub-clock oscillator interfaceConnects 32.768 kHz crystal for RTC and low-power timing; required for RTCC operation
TDI / TDO / TCK / TMSJTAG debug interfaceIEEE 1149.1-compliant boundary-scan and debug access; supports full-speed tracing
MD0 / MD1Mode setting pinsDetermine boot mode (single-chip, SCI boot, FINE boot, user boot) at power-on reset
MTIOC0A / MTIOC0BMTU3a channel 0 waveform I/OComplementary PWM outputs with programmable dead time; drive gate drivers directly
ADTRG0 / ADTRG1A/D conversion trigger inputsAccept external or ELC-generated pulses to start S12ADH conversions synchronously

Key Features

FeatureDesign Value
Event Link Controller (ELC)Enables 83 internal event signals to trigger peripheral actions (e.g., MTU3a capture, A/D start, D/A update) without CPU overhead or interrupt latency
Trusted Memory (TM)Prevents unauthorized read-out of firmware stored in designated code flash areas while allowing CPU instruction fetch - essential for IP protection
IEC60730 Safety SupportIncludes oscillation-stop detection, A/D disconnection check, RAM test assist (DOC), CRC calculator (CRCA), and register write protection for Class B compliance
Complementary PWM w/ Dead-TimeMTU3a generates non-overlapping high-side/low-side gate drive waveforms with automatic dead-time insertion for 3-phase inverter control
Background Operation (BGO)Code/data flash programming and erasing occur concurrently with CPU execution - no runtime interruption during firmware updates

Applications

Industrial Motor DriveSmart Power Inverter

Use Scenario: Closed-loop field-oriented control (FOC) of 3-phase BLDC/PMSM motors in HVAC compressors and industrial pumps.

IC Role / Device Role / Timing Role: Main controller executing FOC algorithm, generating synchronized 6-channel complementary PWM via MTU3a, sampling current/voltage via S12ADH, and managing CAN FD diagnostics.

Use Value: 120 MHz RXv3 core + FPU delivers real-time torque calculation; ELC-triggered ADC sampling ensures precise current measurement aligned with PWM edges.

Use Scenario: Grid-tied solar microinverter with MPPT, isolation, and anti-islanding protection.

IC Role / Device Role / Timing Role: System orchestrator handling DC-DC boost control, DC-AC inversion, grid synchronization, and safety shutdown via IWDTa and MPU.

Use Value: Dual R12DAb outputs serve as precision references for analog comparators monitoring overvoltage/overcurrent; RTC enables time-stamped fault logging.

Factory Automation PLCBuilding Energy Management

Use Scenario: Modular I/O controller in distributed control systems with analog input conditioning, digital I/O expansion, and fieldbus connectivity.

IC Role / Device Role / Timing Role: Central processing unit interfacing with 24-channel S12ADH for sensor inputs, RIICa for local I²C sensors, and CAN FD for backbone communication.

Use Value: 134 general-purpose I/O pins (4× 5-V tolerant) simplify direct connection to industrial sensors; data flash stores calibration coefficients with 100k-cycle endurance.

Use Scenario: HVAC zone controller integrating temperature sensing, damper actuation, occupancy detection, and BACnet/IP gateway functions.

IC Role / Device Role / Timing Role: Real-time coordinator managing on-chip temperature sensor, REMCa for IR remote, RIICa for environmental sensors, and RSPI for display interface.

Use Value: Sub-clock RTC maintains accurate time across power cycles; low-power modes (deep software standby w/ RTC active) extend battery life in wireless variants.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F56605EDFB#30Same RX660 Group, identical 144-pin LFQFP package and peripherals, but 512 Kbyte code flash (vs. 1 Mbyte)Suitable for cost-sensitive designs where firmware size < 512 KB; retains full CAN FD, MTU3a, and safety featuresSelect when application firmware fits within 512 KB and BOM cost optimization is prioritized over future scalability.
R5F56606EDFB#30Same package and memory sizes, but includes JTAG interface disabled (FINE-only debug); otherwise functionally identicalApplicable where JTAG is unnecessary and debug security via FINE-only access is preferredChoose when JTAG exposure poses a security risk and FINE debugging suffices for development and production test.

Compared with R5F56604EDFB#30, the R5F56605EDFB#30 reduces flash capacity by 50% without altering peripheral count or safety features, while the R5F56606EDFB#30 removes JTAG access to harden debug security - both retain identical timing, I/O, and real-time performance for drop-in evaluation in industrial control designs.

Availability

R5F56604EDFB#30 is available at Aetrix Electronics and suitable for industrial motor control, smart power inverters, factory automation PLCs, and building energy management systems requiring stable component supply, long-term lifecycle assurance, and functional safety certification support.

Supply support for R5F56604EDFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX660 Group, including R5F56604EDFB#30, was designed for high-performance industrial automation applications demanding real-time determinism, functional safety (IEC60730), and rich analog/motor control peripherals in a single-chip solution.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F56604EDFB#30?

The R5F56604EDFB#30 operates at a maximum frequency of 120 MHz and achieves 709 CoreMark under those conditions. This performance stems from the RXv3 CPU core's single-cycle instruction execution, 32-bit multiplier/divider, barrel shifter, and integrated FPU - all validated per Renesas R01DS0393EJ0100 Rev.1.00, Section 1.1. The R5F56604EDFB#30 sustains this speed with zero wait states on both 1 Mbyte code flash and 128 Kbytes SRAM.

Does the R5F56604EDFB#30 support CAN FD, and what standard does it comply with?

Yes, the R5F56604EDFB#30 integrates a CAN FD module compliant with ISO 11898-1:2015, supporting both standard and extended frames. It operates at data rates up to 5 Mbps in FD mode and includes bit-rate switching, flexible data-length payloads (up to 64 bytes), and error confinement - confirmed in Section 1.1, Table 1.1 and Section 22 of the R01DS0393EJ0100 datasheet. The R5F56604EDFB#30 uses this for real-time diagnostics and firmware updates in industrial networks.

What debug interfaces are available on the R5F56604EDFB#30?

The R5F56604EDFB#30 supports both JTAG (IEEE 1149.1) and FINE (Renesas' one-wire debug interface) for on-chip debugging and programming. JTAG enables full boundary-scan, real-time tracing, and multi-core debug; FINE provides minimal-pin debugging ideal for space-constrained layouts. Both are documented in Section 1.1 and Figure 1.2 of R01DS0393EJ0100. The R5F56604EDFB#30 requires no external debug probe for basic FINE use, reducing development tooling cost.

How many A/D and D/A converter channels does the R5F56604EDFB#30 include?

The R5F56604EDFB#30 includes one 12-bit S12ADH analog-to-digital converter with 24 input channels and two independent 12-bit R12DAb digital-to-analog converters. Each R12DAb channel outputs 0 V to AVCC0 and can serve as a reference voltage for the four-channel CMPC analog comparator - verified in Sections 1.1 (Table 1.1), 19 (S12ADH), and 20 (R12DAb) of R01DS0393EJ0100. This configuration supports closed-loop analog signal conditioning in the R5F56604EDFB#30.

What low-power modes and RTC capabilities does the R5F56604EDFB#30 offer?

The R5F56604EDFB#30 supports four low-power modes - sleep, all-module clock stop, software standby, and deep software standby - with RTC continuing to run in deep software standby using the 32.768 kHz sub-clock oscillator. RTC features include binary/BCD time counting, alarm/periodic interrupts, time capture on external events, and leap-year adjustment. These functions require the sub-clock oscillator (XTAL/EXTAL pins), as specified in Sections 1.1 and 26 of R01DS0393EJ0100. The R5F56604EDFB#30 leverages this for time-critical wake-up and energy-efficient operation.

R5F56604EDFB#30 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
144-LQFP
Series:
RX600
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
RXv3
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
132
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 24x12b; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F56604EDFB#30 FAQ

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Please submit a Request for Quotation (RFQ) for R5F56604EDFB#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of R5F56604EDFB#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56604EDFB#30 is usually 5 days.

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5.How can I obtain technical support or documentation for R5F56604EDFB#30?

For technical support, including R5F56604EDFB#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56604EDFB#30 requirements.

6.How does Aetrix verify that R5F56604EDFB#30 is sourced from the original manufacturer or authorized distributors?

All R5F56604EDFB#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56604EDFB#30 meets industry standards.

7.What is the process for return or replacement of R5F56604EDFB#30?

All R5F56604EDFB#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56604EDFB#30, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F56604EDFB#30 part is unused and in its original packaging.

Return procedure for R5F56604EDFB#30:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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