Renesas R5F56609ADFP#10

Overview

R5F56609ADFP#10 from Renesas Electronics is a 32-bit RXv3 microcontroller with 120 MHz maximum operating frequency, 1 Mbyte on-chip code flash, 128 Kbytes SRAM, and integrated CAN FD, 12-bit A/D and D/A converters, RTC, and hardware FPU. It targets industrial control, motor drive, and safety-compliant embedded systems requiring deterministic real-time performance and IEC 60730 support.

For engineers reviewing the R5F56609ADFP#10 datasheet, R5F56609ADFP#10 pinout, R5F56609ADFP#10 application, or R5F56609ADFP#10 equivalent, key selection criteria include its 144-pin LFQFP (PLQP0144KA-B) package, dual D/A output capability, sub-clock oscillator inclusion, JTAG+FINE debug support, and full RX660 peripheral set including MTU3a, ELC, and Trusted Memory (TM) protection.

Technical Context

The R5F56609ADFP#10 implements the RXv3 CPU core with single-cycle instruction execution, IEEE 754-compliant single-precision FPU, and 16-register bank save for fast context switching. Its clock system integrates PLL, HOCO/LOCO oscillators, and independent IWDT clock, enabling precise timing control across PCLKA (up to 120 MHz), PCLKB (60 MHz), and ADCLK (60 MHz) domains.

Peripheral integration includes CAN FD compliant with ISO 11898-1:2015, 13-channel SCI with FIFO and LIN support, RSPI at 30 Mbps, RIIC at 400 kbps, and event-driven operation via ELC-allowing inter-module triggering without CPU intervention in sleep modes. The MCU supports IEC 60730 Class B compliance through oscillation-stop detection, RAM test assist, CRC calculator (CRCA), and register write protection.

Key Specifications

Pinout & Package

Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 × 20 mm body, 0.5 mm lead pitch, exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56609ADFP#10, the R5F56608ADFP#10 reduces code flash capacity by 50% while preserving all peripheral sets and safety features-ideal for firmware-constrained deployments. The R5F56609ADFP#30 offers identical silicon functionality but in tape-and-reel form factor, optimizing for automated manufacturing throughput rather than design differentiation.

Availability

R5F56609ADFP#10 is available at Aetrix Electronics and suitable for industrial automation, motor control, and smart metering applications requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability under extended temperature operation.

Supply support for R5F56609ADFP#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise markets.

The RX660 Group-including R5F56609ADFP#10-is designed for high-integrity industrial applications demanding real-time determinism, functional safety support (IEC 60730), and rich analog/motor control peripherals in a single-chip solution.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F56609ADFP#10?

The R5F56609ADFP#10 operates at a maximum frequency of 120 MHz and achieves 709 CoreMark points at that speed. This performance stems from the RXv3 CPU core's single-cycle instruction execution, 16-register bank architecture, and integrated single-precision floating-point unit-all verified per Renesas R01DS0393EJ0100 Rev.1.00 datasheet. The R5F56609ADFP#10 delivers deterministic real-time response essential for motor control and PLC applications.

Does the R5F56609ADFP#10 include a sub-clock oscillator and support RTC functionality?

Yes, the R5F56609ADFP#10 includes a sub-clock oscillator interface (XT1/XT2 pins) and fully supports real-time clock (RTCC) functionality per the RX660 Group specification. The device requires a 32.768 kHz crystal connected to XT1/XT2 to enable calendar/timekeeping, alarm interrupts, and time-capture features. This capability is confirmed in Table 1.2 of the R01DS0393EJ0100 datasheet, which lists RTC as "Available" for the 144-pin LFQFP variant with sub-clock oscillator.

How many CAN FD channels does the R5F56609ADFP#10 support, and what standard compliance does it meet?

The R5F56609ADFP#10 supports one CAN FD channel compliant with ISO 11898-1:2015, covering both standard and extended frame formats. It enables data rates up to 5 Mbps in the FD phase and maintains full backward compatibility with classical CAN 2.0B. This implementation is documented in Section 1.1 and Table 1.1 of the R01DS0393EJ0100 datasheet, and the CANFD module includes message RAM, filtering, and error handling hardware acceleration.

What are the memory capacities and endurance specifications for flash and SRAM in the R5F56609ADFP#10?

The R5F56609ADFP#10 integrates 1 Mbyte of on-chip code flash memory with no-wait-state access at 120 MHz, 32 Kbytes of reprogrammable data flash rated for 100,000 erase/write cycles, and 128 Kbytes of zero-wait-state SRAM. All memories support background operation (BGO), allowing concurrent code execution during flash programming. These values are specified in Tables 1.1 and 1.2 of the R01DS0393EJ0100 datasheet and apply specifically to the R5F56609ADFP#10 144-pin variant.

Is the R5F56609ADFP#10 pin-compatible with other RX660 Group MCUs in the same package?

Yes, the R5F56609ADFP#10 is pin-compatible with other RX660 Group devices in the 144-pin LFQFP (PLQP0144KA-B) package, including R5F56608ADFP#10 and R5F56609ADFP#30. Pin assignments for power, clocks, reset, JTAG/FINE, peripherals, and I/O are identical across this package variant. Functional differences (e.g., flash size) do not affect pinout-confirmed by Renesas' package-specific pin diagrams in the R01DS0393EJ0100 datasheet Figures 2.x and Table 1.2.