Renesas R5F56609AGFB#30
- Part No.:
- R5F56609AGFB#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R5F56609AGFB#30.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 144LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:239
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Product details
Overview
R5F56609AGFB#30 from Renesas is a 32-bit RXv3 microcontroller with 120 MHz maximum operating frequency, 1 Mbyte on-chip code flash, 128 Kbytes SRAM, and integrated CAN FD, 12-bit A/D and D/A converters, RTC, and hardware FPU. It operates from a single 2.7–5.5 V supply and supports IEC60730-compliant safety functions for industrial control and motor drive applications.
For engineers reviewing the R5F56609AGFB#30 datasheet, R5F56609AGFB#30 pinout, R5F56609AGFB#30 application, or R5F56609AGFB#30 equivalent, key selection criteria include its 144-pin LFQFP (PLQP0144KA-B) package, G-grade temperature range (–40°C to +105°C), dual D/A output capability, sub-clock oscillator support, and JTAG/FINE debug interface - all confirmed in Rev.1.00 of datasheet R01DS0393EJ0100.
Technical Context
The R5F56609AGFB#30 implements the RXv3 CPU core with single-precision IEEE 754 FPU, collective register bank save, and MPU-based memory protection. Its clock system integrates main (8–24 MHz crystal), sub-clock (32.768 kHz), and on-chip oscillators (LOCO/HOCO/IWDT-dedicated), with independent PLL and peripheral clock domains (ICLK up to 120 MHz, PCLKA up to 120 MHz, PCLKB up to 60 MHz).
Peripheral integration includes one CAN FD channel compliant with ISO 11898-1:2015, 13 SCI channels (SCIk/SCIm/SCIh), two RIIC interfaces, one RSPId (30 Mbps), MTU3a (9-channel timer), S12ADH (24-channel 12-bit ADC), R12DAb (2-channel 12-bit DAC), CMPC (4-channel analog comparator), and REMCa (remote control signal receiver), all coordinated via the Event Link Controller (ELC) for interrupt-free inter-module triggering.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv3 32-bit with single-precision FPU, 709 CoreMark @ 120 MHz |
| Max Operating Frequency | 120 MHz system clock (ICLK); no-wait access to 1-Mbyte flash and 128-Kbyte SRAM |
| Memory | 1 Mbyte code flash, 32 Kbyte data flash (100k erase/write cycles), 128 Kbyte SRAM |
| Analog Peripherals | 24-channel 12-bit S12ADH ADC (0.9 µs min conversion), 2-channel 12-bit R12DAb DAC, 4-channel CMPC |
| Communication | CAN FD (ISO 11898-1:2015), 13 SCI channels, 2 RIIC (400 kbps), 1 RSPId (30 Mbps) |
| Package & Temp | 144-pin LFQFP (PLQP0144KA-B, 20 × 20 mm, 0.5 mm pitch), G-grade (–40°C to +105°C) |
| Power & Safety | 2.7–5.5 V supply; MPU, Trusted Memory (TM), CRC calculator (CRCA), CAC, DOCA, and IEC60730 self-test features |
Pinout & Package
Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 × 20 mm body, 0.5 mm lead pitch, G-grade (–40°C to +105°C) operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, AVCC0 | Power supply inputs | Core/analog supply (2.7–5.5 V); AVCC0 must be ≥ VCC and within 3.0–5.5 V |
| RES#, RESET | Reset input/output | Active-low asynchronous reset; internal POR/LVD ensures reliable power-on initialization |
| XTAL, EXTAL | Main clock oscillator terminals | Connect 8–24 MHz crystal; enables PLL reference for 120 MHz system clock |
| OSC32K, OSC32KIN | Sub-clock oscillator terminals | Supports 32.768 kHz crystal for RTC and low-power wake-up timing |
| TMS, TDI, TDO, TCK, TRST# | JTAG debug interface | Full boundary-scan and emulation support; coexists with FINE one-wire interface |
| TXD0, RXD0 | SCI0 serial interface | Asynchronous UART mode default; configurable for clock-sync, SPI, I²C, or LIN protocols |
| CANFD_TX, CANFD_RX | CAN FD physical layer I/O | Differential signaling pins for ISO 11898-1:2015-compliant CAN FD bus (standard/extended frames) |
| DA0, DA1 | D/A converter outputs | Two independent 12-bit voltage outputs (0–AVCC0); usable as comparator reference sources |
Key Features
| Feature | Design Value |
|---|---|
| Floating-point unit (FPU) | IEEE 754-compliant single-precision arithmetic accelerates motor control and sensor fusion algorithms |
| Event Link Controller (ELC) | Enables 83 internal event signals to trigger peripheral actions (e.g., ADC start on timer match) without CPU intervention |
| Trusted Memory (TM) | Prevents unauthorized read-out of critical firmware in designated flash regions while allowing CPU instruction fetch only |
| IEC60730 safety support | Includes oscillation-stop detection, RAM test assist (DOC), CRCA, CAC, and register write protection for Class B compliance |
| Low-power modes | Four modes including deep software standby with RTC active; enables <1 µA retention current in battery-backed systems |
Applications
| Industrial Motor Control | Automotive Body Electronics |
|---|---|
Use Scenario: Closed-loop field-oriented control (FOC) of 3-phase BLDC motors in HVAC compressors and pumps. IC Role / Device Role / Timing Role: Main controller executing FOC algorithm via FPU, generating complementary PWM via MTU3a with dead-time compensation, sampling current/voltage via S12ADH, and regulating via R12DAb feedback. Use Value: 120 MHz CPU + hardware PWM + synchronized ADC triggers enable <1 µs current loop update, meeting SIL-2 functional safety timing constraints. | Use Scenario: Central body controller managing door locks, lighting, window lifts, and CAN FD communication with gateway ECUs. IC Role / Device Role / Timing Role: System host MCU handling CAN FD messaging, multi-channel PWM dimming, capacitive touch sensing (via S12ADH), and secure boot via TM and MPU. Use Value: Dual D/A outputs drive analog sensors; G-grade temp rating ensures reliability in under-hood ambient conditions up to +105°C. |
| Smart Energy Metering | Factory Automation I/O Module |
Use Scenario: DIN-rail mounted polyphase energy meter with harmonic analysis, tamper detection, and DLMS/COSEM protocol stack. IC Role / Device Role / Timing Role: High-accuracy metrology processor using S12ADH with digital filtering, CRCA for secure firmware updates, RTC for time-of-use billing, and RIIC for external EEPROM interfacing. Use Value: Sub-clock oscillator + RTC with leap-year adjustment enables precise timestamping; 32 Kbyte data flash stores 10+ years of metering logs with 100k endurance. | Use Scenario: Modular I/O terminal supporting analog input (4–20 mA), digital I/O expansion, and EtherCAT slave connectivity via external PHY. IC Role / Device Role / Timing Role: Real-time I/O coordinator using ELC to synchronize ADC sampling, PWM output, and CAN FD status reporting; RSPId interfaces with external FPGA for protocol offload. Use Value: 144-pin package provides 130 GPIOs with 5-V tolerance and programmable drive strength, simplifying interface to legacy 24 V industrial sensors and actuators. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F56608AGFB#30 | Same RX660 Group, identical 144-pin LFQFP package and G-grade rating, but 512 Kbyte code flash (vs. 1 Mbyte) | Suitable for cost-sensitive designs where firmware size ≤ 512 KB; retains full peripheral set including CAN FD and dual D/A | Select when flash capacity requirement is ≤ 512 KB and BOM cost optimization is prioritized over future firmware headroom |
| R5F566T9AGFB#30 | Same package and flash/SRAM specs, but adds TrustZone-based secure boot and cryptographic acceleration (AES/SHA/RSA) | Required for applications needing secure firmware authentication, encrypted OTA updates, or TLS offload in connected devices | Choose when end-product security certification (e.g., PSA Level 2, SESIP) is mandatory and hardware crypto acceleration is needed |
Compared with R5F56609AGFB#30, R5F56608AGFB#30 reduces flash capacity without altering peripheral count or timing performance, while R5F566T9AGFB#30 extends security functionality at identical real-time control capability - enabling scalable design migration across cost, feature, and security tiers within the RX660 family.
Availability
R5F56609AGFB#30 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, smart energy metering, and factory automation I/O modules requiring stable component supply, long-term lifecycle assurance, and G-grade thermal reliability.
Supply support for R5F56609AGFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX660 Group - including R5F56609AGFB#30 - is designed for high-performance, safety-critical embedded applications demanding real-time responsiveness, functional safety compliance (IEC60730), and rich analog/motor control peripherals in extended temperature environments.
FAQ
What is the maximum operating frequency and core architecture of the R5F56609AGFB#30?
The R5F56609AGFB#30 features a 32-bit RXv3 CPU core with hardware single-precision floating-point unit (FPU), achieving a maximum operating frequency of 120 MHz and delivering 709 CoreMark performance. Its architecture includes collective register bank save, memory protection unit (MPU), and IEEE 754-compliant arithmetic - all confirmed in Renesas datasheet R01DS0393EJ0100 Rev.1.00. This makes R5F56609AGFB#30 suitable for demanding real-time control tasks such as motor FOC and sensor fusion.
Does the R5F56609AGFB#30 support CAN FD, and what standard does it comply with?
Yes, the R5F56609AGFB#30 integrates one CAN FD module compliant with ISO 11898-1:2015, supporting both standard and extended frame formats with bit rates up to 5 Mbps in FD mode. This capability is explicitly documented in the "Communication function" section of datasheet R01DS0393EJ0100 Rev.1.00. The R5F56609AGFB#30 uses dedicated CANFD_TX and CANFD_RX pins and supports protocol-level features required for automotive and industrial networked systems.
What are the analog capabilities of the R5F56609AGFB#30, particularly regarding ADC and DAC?
The R5F56609AGFB#30 includes a 24-channel 12-bit S12ADH analog-to-digital converter with minimum 0.9 µs conversion time at 60 MHz ADCLK, and two independent 12-bit R12DAb digital-to-analog converters with 0–AVCC0 output range. Both DAC outputs can serve as reference voltages for the 4-channel CMPC analog comparators. These specifications are verified in Table 1.1 and Section 18 of datasheet R01DS0393EJ0100 Rev.1.00, confirming full analog subsystem integration in R5F56609AGFB#30.
What package type and temperature grade does the R5F56609AGFB#30 use?
The R5F56609AGFB#30 is housed in a 144-pin LFQFP package designated PLQP0144KA-B (20 × 20 mm, 0.5 mm pitch) and rated for the G-grade industrial temperature range of –40°C to +105°C. This package includes JTAG and FINE debug interfaces and supports sub-clock oscillator connectivity for RTC operation - all confirmed in Table 1.1 and Figure 1.1 of datasheet R01DS0393EJ0100 Rev.1.00. The R5F56609AGFB#30's pin count and thermal rating make it suitable for high-I/O, thermally demanding applications.
How does the R5F56609AGFB#30 support functional safety standards like IEC60730?
The R5F56609AGFB#30 includes multiple hardware features for IEC60730 Class B compliance: oscillation-stoppage detection, clock frequency accuracy measurement circuit (CAC), CRC calculator (CRCA), data operation circuit (DOCA) for RAM testing, independent watchdog timer (IWDTa) with window function, and register write protection. These are explicitly listed under "Useful functions for IEC60730 compliance" in the datasheet R01DS0393EJ0100 Rev.1.00. Together, they enable systematic self-test coverage required for R5F56609AGFB#30 in safety-critical appliance and industrial control applications.
R5F56609AGFB#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RX600
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv3
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 133
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b; D/A 2x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56609AGFB#30 FAQ
1.How can I place an order for R5F56609AGFB#30 through Aetrix?
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The price and inventory of R5F56609AGFB#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56609AGFB#30 is usually 5 days.
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For technical support, including R5F56609AGFB#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56609AGFB#30 requirements.
6.How does Aetrix verify that R5F56609AGFB#30 is sourced from the original manufacturer or authorized distributors?
All R5F56609AGFB#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56609AGFB#30 meets industry standards.
7.What is the process for return or replacement of R5F56609AGFB#30?
All R5F56609AGFB#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56609AGFB#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56609AGFB#30 part is unused and in its original packaging.
Return procedure for R5F56609AGFB#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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