Renesas R5F56609AGFM#30

Overview

R5F56609AGFM#30 from Renesas is a 32-bit RXv3 microcontroller designed for industrial and automotive control applications requiring high reliability, real-time performance, and functional safety support. It operates at up to 120 MHz, integrates 1 Mbyte of code flash, 128 Kbytes of SRAM, 32 Kbytes of data flash, CAN FD, 12-bit A/D and D/A converters, RTC with sub-clock oscillator, and supports IEC60730-compliant self-test functions.

For engineers reviewing the R5F56609AGFM#30 datasheet, R5F56609AGFM#30 pinout, R5F56609AGFM#30 application, or R5F56609AGFM#30 equivalent, key selection considerations include its 144-pin LFQFP (PLQP0144KA-B) package, G-grade temperature range (–40°C to +105°C), integrated FPU, ELC event-driven architecture, and dual-voltage tolerance (2.7–5.5 V supply with 5-V-tolerant I/O).

Technical Context

The R5F56609AGFM#30 implements the RXv3 CPU core with single-precision IEEE 754 FPU, 16 register banks for fast context switching, and MPU-based memory protection. Its clock system combines an 8–24 MHz external main oscillator, 32.768 kHz sub-clock, and selectable on-chip oscillators (LOCO/HOCO/IWDT-dedicated), enabling precise timing control across multiple domains (ICLK up to 120 MHz, PCLKA up to 120 MHz, PCLKB up to 60 MHz, ADCLK up to 60 MHz).

Peripheral integration includes CAN FD compliant with ISO 11898-1:2015, 13 SCI channels (including SCIm with 16-byte FIFOs), 2 RIIC interfaces (400 kbps Fast Mode), 1 RSPI (30 Mbps), MTU3a with complementary PWM and dead-time control, and ELC for interrupt-free inter-module triggering - all supporting deterministic low-latency operation in safety-critical environments.

Key Specifications

Pinout & Package

Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 × 20 mm body, 0.5 mm pitch, exposed thermal pad, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F56609AGFM#30, the R5F56608AGFM#30 reduces flash capacity while maintaining identical peripherals and timing - ideal for streamlined firmware; the R5F56609ADFM#30 retains full feature parity but relaxes temperature grading, lowering thermal design complexity and cost in benign environments.

Availability

R5F56609AGFM#30 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, smart metering, and factory automation applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F56609AGFM#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX660 Group - including the R5F56609AGFM#30 - was designed for high-integrity real-time control in demanding environments, integrating functional safety features, rich analog/motor control peripherals, and deterministic event-driven architecture.

FAQ

What is the maximum operating frequency and core type of the R5F56609AGFM#30?

The R5F56609AGFM#30 features a 32-bit RXv3 CPU core with a maximum operating frequency of 120 MHz. It achieves 709 CoreMark at this speed and includes a single-precision IEEE 754 floating-point unit. The core supports collective register bank save, memory protection unit (MPU), and JTAG/FINE debugging interfaces - all confirmed in the official R01DS0393EJ0100 datasheet Rev.1.00.

Does the R5F56609AGFM#30 support CAN FD, and what standard does it comply with?

Yes, the R5F56609AGFM#30 integrates one CAN FD module compliant with ISO 11898-1:2015, supporting both standard and extended frames. It operates at data rates up to 5 Mbps in FD mode and maintains backward compatibility with classical CAN. This capability is explicitly documented in the "Communication function" section of the R01DS0393EJ0100 datasheet.

What package and temperature grade does the R5F56609AGFM#30 use?

The R5F56609AGFM#30 uses a 144-pin LFQFP package (PLQP0144KA-B, 20 × 20 mm, 0.5 mm pitch) and is rated for the G-grade temperature range of –40°C to +105°C. This is specified in Table 1.1 and confirmed in the "List of Products" section of the R01DS0393EJ0100 datasheet Rev.1.00.

How much on-chip memory does the R5F56609AGFM#30 include?

The R5F56609AGFM#30 includes 1 Mbyte of code flash memory (with no-wait access at 120 MHz), 128 Kbytes of SRAM (no-wait), and 32 Kbytes of reprogrammable data flash (rated for 100,000 erase/write cycles). These values are listed in Table 1.1 of the R01DS0393EJ0100 datasheet and apply specifically to the R5F56609 variant.

What safety and reliability features does the R5F56609AGFM#30 provide for IEC60730 compliance?

The R5F56609AGFM#30 provides multiple IEC60730 Class B support features: oscillation-stoppage detection, A/D converter self-diagnosis and disconnection detection, clock frequency accuracy measurement circuit (CAC), independent watchdog timer (IWDT), RAM test assistance via DOC, CRC calculator (CRCA), and register write protection. These are detailed in the "Useful functions for IEC60730 compliance" section of the R01DS0393EJ0100 datasheet.