Renesas R5F56609AGFP#30

Overview

R5F56609AGFP#30 from Renesas is a 32-bit RXv3 microcontroller with 120 MHz maximum operating frequency, 1 Mbyte on-chip code flash, 128 Kbytes SRAM, and integrated CAN FD, 12-bit A/D and D/A converters, RTC, and hardware FPU. It targets industrial control, motor drive, and safety-compliant embedded systems requiring real-time performance and IEC60730 support.

For engineers reviewing the R5F56609AGFP#30 datasheet, R5F56609AGFP#30 pinout, R5F56609AGFP#30 application, or R5F56609AGFP#30 equivalent, key selection criteria include its 144-pin LFQFP (PLQP0144KA-B) package, G-grade temperature range (–40°C to +105°C), sub-clock oscillator inclusion, JTAG+FINE debug interface, and full peripheral set including MTU3a, ELC, and Trusted Memory (TM) protection.

Technical Context

The R5F56609AGFP#30 implements the RXv3 CPU core with single-precision IEEE 754 FPU, 16 register banks for fast context switching, and memory protection unit (MPU) supporting eight configurable regions. Its clock system integrates main (8–24 MHz crystal), sub (32.768 kHz), and on-chip oscillators (HOCO/LOCO/IWDT-dedicated), with independent PLL and fine-grained peripheral clock domains (ICLK up to 120 MHz, PCLKA/B/D at up to 120/60/60 MHz).

Peripheral integration includes a 1-channel CAN FD module compliant with ISO 11898-1:2015, 13 SCI channels (SCIk/SCIm/SCIh) supporting asynchronous, SPI/I²C emulation, LIN, and smart-card modes, plus RSPId (30 Mbps), RIICa (400 kbps), and REMCa for IR signal decoding - all coordinated via the Event Link Controller (ELC) to enable interrupt-free inter-module triggering in sleep states.

Key Specifications

Pinout & Package

Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 mm × 20 mm body, 0.5 mm lead pitch, exposed thermal pad, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit MCU applications.

Compared with R5F56609AGFP#30, R5F56608AGFP#30 reduces flash capacity by 50% without peripheral or clock performance loss, while R5F56609ADFP#30 maintains identical functionality but limits thermal operating range - both serve as validated alternatives when flash budget or ambient temperature constraints define the primary selection criterion.

Availability

R5F56609AGFP#30 is available at Aetrix Electronics and suitable for industrial automation, motor control, and smart metering applications requiring stable component supply, long-term lifecycle assurance, and automotive-grade thermal resilience.

Supply support for R5F56609AGFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, infrastructure, and IoT markets.

The RX660 Group - to which R5F56609AGFP#30 belongs - was designed for high-performance, safety-aware industrial control applications demanding real-time determinism, functional safety support (IEC60730), and rich connectivity including CAN FD and multiple serial interfaces.

FAQ

What is the maximum operating frequency and core architecture of the R5F56609AGFP#30?

The R5F56609AGFP#30 features a 32-bit RXv3 CPU core with a maximum operating frequency of 120 MHz, achieving 709 CoreMark performance. It includes a single-precision IEEE 754 floating-point unit (FPU), 16 register banks for fast context save/restore, and a memory protection unit (MPU). The core supports little-endian or big-endian data arrangement and executes instructions in one system clock cycle at full speed.

Does the R5F56609AGFP#30 support CAN FD, and what standard compliance does it meet?

Yes, the R5F56609AGFP#30 integrates one CAN FD module compliant with ISO 11898-1:2015, supporting both standard (11-bit) and extended (29-bit) frame formats. It operates at data rates up to 5 Mbps in FD mode and maintains full backward compatibility with classical CAN 2.0B. The module includes message RAM with configurable FIFOs, error counters, and loopback self-test capability - all accessible via the R5F56609AGFP#30's peripheral registers.

What are the memory resources available on the R5F56609AGFP#30?

The R5F56609AGFP#30 provides 1 Mbyte of on-chip code flash memory with no-wait-state access at 120 MHz, 32 Kbytes of reprogrammable data flash rated for 100,000 erase/write cycles, and 128 Kbytes of high-speed SRAM with zero wait states. It also includes a 12-byte unique ID and supports Trusted Memory (TM) protection to prevent unauthorized code read-out from designated flash regions.

How does the R5F56609AGFP#30 support functional safety standards like IEC60730?

The R5F56609AGFP#30 includes multiple hardware features for IEC60730 Class B compliance: oscillation-stop detection for main/sub clocks, clock frequency accuracy measurement circuit (CAC), CRC calculator (CRCA) for memory/data integrity, register write protection, RAM test assist via DOC, and independent watchdog timer (IWDTa) with window function. These capabilities are documented in the R5F56609AGFP#30 hardware manual and supported by Renesas' safety application notes.

What package type and pin count does the R5F56609AGFP#30 use, and is it RoHS-compliant?

The R5F56609AGFP#30 uses a 144-pin Low-profile Quad Flat Package (LFQFP) with type code PLQP0144KA-B: 20 mm × 20 mm body, 0.5 mm lead pitch, and exposed thermal pad. It is RoHS-compliant and rated for the G-grade temperature range (–40°C to +105°C). This package includes JTAG and FINE debug interfaces, sub-clock oscillator pins, and full peripheral pinout including CAN FD, 24 ADC inputs, and dual DAC outputs.