Renesas R5F56609BDFB#30
- Part No.:
- R5F56609BDFB#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R5F56609BDFB#30.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 144LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:240
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R5F56609BDFB#30 from Renesas is a 32-bit RXv3 microcontroller with 120 MHz maximum operating frequency, 1 Mbyte on-chip code flash, 128 Kbytes SRAM, and integrated CAN FD, 12-bit A/D and D/A converters, RTC, and remote control signal receiver - deployed in industrial motor control, building automation gateways, and IEC60730-compliant appliance controllers.
For engineers reviewing the R5F56609BDFB#30 datasheet, R5F56609BDFB#30 pinout, R5F56609BDFB#30 application, or R5F56609BDFB#30 equivalent, key selection considerations include its 144-pin LFQFP (PLQP0144KA-B) package, JTAG/FINE debug support, sub-clock oscillator inclusion, full 24-channel S12ADH ADC, dual 12-bit R12DAb DACs, and ISO 11898-1:2015 CAN FD compliance.
Technical Context
The R5F56609BDFB#30 implements the RXv3 CPU core with single-cycle instruction execution, IEEE 754-compliant single-precision FPU, and 16 register banks for fast context switching. Its clock system integrates main (8–24 MHz), sub (32.768 kHz), and on-chip oscillators (LOCO/HOCO/IWDT-dedicated), with independent PLL and peripheral clock domains (ICLK up to 120 MHz, PCLKA up to 120 MHz, PCLKB up to 60 MHz).
Peripheral integration includes MTU3a (9-channel 16/32-bit timer with complementary PWM), ELC for interrupt-free inter-module event linking, DMACAa (8-channel DMA), and safety features such as MPU, Trusted Memory (TM), CRC calculator (CRCA), and hardware-accelerated self-test functions aligned with IEC60730 Class B requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv3 32-bit, 120 MHz max, 709 CoreMark, IEEE 754 FPU, 16 register banks |
| Memory | 1 Mbyte code flash (no-wait at 120 MHz), 32 Kbyte data flash (100k erase cycles), 128 Kbyte SRAM (no-wait) |
| Analog Peripherals | 24-channel 12-bit S12ADH ADC (0.9 µs min conversion), 2-channel 12-bit R12DAb DAC, 4-channel CMPC, on-die temperature sensor (±1.0°C) |
| Communication | CAN FD (ISO 11898-1:2015, 1 channel), 13 SCI channels (async/sync/SmartCard/SPI/I²C), 2 RIIC (400 kbps), 1 RSPId (30 Mbps), 1 REMCa |
| Timers & Control | MTU3a (9 channels), TMRb (4×8-bit), CMT/CMTW (8×16/2×32-bit), IWDT + WDTA, RTCC with calendar/time capture |
| Package & Environment | 144-pin LFQFP (PLQP0144KA-B, 20×20 mm, 0.5 mm pitch), –40°C to +85°C (D-version), 2.7–5.5 V supply |
| Safety & Debug | MPU, TM, CRCA, DOCA, CAC, oscillation-stop detection, JTAG + FINE interfaces, IEC60730 support |
Pinout & Package
Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 × 20 mm body, 0.5 mm lead pitch, exposed thermal pad, RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, AVCC0 | Power supply inputs | Core/analog supply (2.7–5.5 V); AVCC0 ≥ VCC required for analog accuracy |
| RES#, RESET | Reset input | Active-low asynchronous reset; supports power-on, LVD, and software-initiated reset |
| MOSCXT1/2 | Main clock oscillator pins | Connects external 8–24 MHz crystal; enables PLL reference for 120 MHz system clock |
| SOSCIN/OUT | Sub-clock oscillator pins | Connects 32.768 kHz crystal; required for RTCC operation and deep standby RTC continuity |
| TXD0/RXD0 | SCI0 serial interface | Asynchronous UART interface; supports bootloader mode and debug communication |
| CTX0/CRX0 | CAN FD channel 0 | Differential CAN transceiver interface (CANH/CANL); compliant with ISO 11898-1:2015 |
| AD00–AD23 | Analog input channels | 24 dedicated pins for S12ADH; support programmable sampling time and group scan prioritization |
| DA0/DA1 | D/A converter outputs | 2×12-bit voltage outputs (0–AVCC0); usable as comparator references or analog control signals |
| MTIOC0A–MTIOC8A | MTU3a waveform I/O | 9-channel PWM/complementary output pins with dead-time control and synchronous update |
| TCLKA–TCLKD | External timer clock inputs | Four dedicated pins for external timing sources feeding MTU3a and TMRb modules |
| POE0#, POE4#, etc. | Port output enable controls | Five fault-input pins for MTU3a output short-circuit detection and automatic high-Z transition |
| TRD0–TRD2 | Remote control signal inputs | Three pins supporting NEC/RC-5 protocol decoding via REMCa module |
| TDI/TDO/TCK/TMS | JTAG debug interface | IEEE 1149.1 boundary-scan and debug access; supports full SWD-equivalent functionality |
| FINE | Single-wire debug interface | One-pin FINE interface for programming and real-time trace; coexists with JTAG |
Key Features
| Feature | Design Value |
|---|---|
| Event Link Controller (ELC) | Enables 83 internal event signals to trigger peripheral actions (e.g., MTU start → ADC conversion) without CPU intervention or ISR overhead |
| Trusted Memory (TM) | Prevents unauthorized read-out of firmware in designated code flash regions while allowing CPU instruction fetch only |
| Complementary PWM with Dead-Time | Hardware-controlled non-overlapping gate drive waveforms for 3-phase inverters; configurable dead time eliminates external logic |
| IEC60730 Safety Support | Integrated hardware blocks for clock accuracy monitoring (CAC), RAM test assist (DOC), analog input disconnection detection, and register write protection |
| Background Operation (BGO) | Simultaneous flash programming/erasing and CPU execution - no code stall during firmware updates or parameter storage |
Applications
| Industrial Motor Drive | Building Automation Gateway |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC/PMSM motors in HVAC compressors and pumps using field-oriented control (FOC). IC Role / Device Role / Timing Role: Main controller executing FOC algorithm, generating complementary PWM via MTU3a, sampling current/voltage via S12ADH, and managing CAN FD bus communication with supervisory PLC. Use Value: Hardware-accelerated trigonometric functions (TFU), 120 MHz deterministic timing, and integrated dead-time control reduce BOM cost and improve torque ripple performance. | Use Scenario: Protocol translation hub connecting BACnet MS/TP field devices to Ethernet/IP backbone in commercial HVAC systems. IC Role / Device Role / Timing Role: Dual-role processor: SCI/RSPI handles legacy fieldbus peripherals; CAN FD and RIIC manage higher-layer network bridging and local sensor aggregation. Use Value: 13 SCI channels with flexible framing modes (LIN, SmartCard, SPI/I²C emulation) eliminate external protocol ICs; 128 Kbyte SRAM buffers multi-protocol message queues. |
| White Goods Appliance Controller | Medical Diagnostic Equipment |
Use Scenario: IEC60730-certified main controller for washing machine drum motion, water heating, and user interface in Class B safety applications. IC Role / Device Role / Timing Role: Safety-critical MCU performing runtime self-tests (RAM, clock, ADC, register integrity), managing relay drivers, reading thermistors, and driving display via SCI/RIIC. Use Value: On-chip MPU, CRCA, DOCA, CAC, and hardware-assisted diagnostics meet Class B requirements without external safety monitors. | Use Scenario: Signal conditioning and real-time waveform processing unit in portable ultrasound or ECG analyzers requiring precise analog acquisition and low-latency response. IC Role / Device Role / Timing Role: High-fidelity analog front-end controller: synchronizing 24-channel ADC sampling, applying digital filtering via DOCA, buffering data in SRAM, and transmitting over RSPI to host processor. Use Value: 0.9 µs ADC conversion time at 60 MHz ADCLK, 128 Kbyte zero-wait SRAM, and hardware CRC ensure deterministic signal chain latency and data integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F56608BDFB#30 | Same RX660 Group, identical 144-pin LFQFP package, but 512 Kbyte code flash (vs. 1 Mbyte) and no sub-clock oscillator | Not suitable for RTC-dependent applications (e.g., time-stamped logging, deep standby wake-up); lacks SOSC pins | Select only if flash requirement ≤512 KB and RTC is unused or externally supplied |
| R5F56609BDFA#30 | Same die, identical peripherals and memory, but in 100-pin LFQFP (PLQP0100KB-B); fewer GPIOs (88 vs. 130), no JTAG, single DAC channel | Limited I/O count and missing JTAG restrict debugging and analog output flexibility; unsuitable for complex motor control or dual-DAC feedback loops | Choose for space-constrained designs where 100-pin footprint and reduced feature set are acceptable trade-offs |
Compared with R5F56608BDFB#30 and R5F56609BDFA#30, the R5F56609BDFB#30 provides full 1 Mbyte flash, sub-clock oscillator support for RTC, JTAG debug, and dual DACs - making it the only variant in the RX660 family meeting full IEC60730 Class B requirements with on-chip RTC and comprehensive safety hardware.
Availability
R5F56609BDFB#30 is available at Aetrix Electronics and suitable for industrial motor control, building automation gateways, and IEC60730-compliant appliance controllers requiring stable component supply across extended production lifecycles.
Supply support for R5F56609BDFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications.
The RX660 Group is designed for high-integrity industrial control applications demanding real-time determinism, functional safety (IEC60730), rich analog integration, and robust communication - targeting motor drives, factory HMIs, and smart energy equipment.
FAQ
What is the maximum operating frequency and CPU architecture of the R5F56609BDFB#30?
The R5F56609BDFB#30 operates at a maximum frequency of 120 MHz using the 32-bit RXv3 CPU core. It delivers 709 CoreMark performance and includes a single-precision IEEE 754 floating-point unit, 113 instructions, and a collective register bank save function with 16 banks. The R5F56609BDFB#30 supports little-endian or big-endian data arrangement and executes most instructions in one system clock cycle.
Does the R5F56609BDFB#30 support CAN FD, and what standard does it comply with?
Yes, the R5F56609BDFB#30 integrates a CAN FD module compliant with ISO 11898-1:2015, supporting both standard and extended frames. It operates at data rates up to 5 Mbps in FD mode and maintains full backward compatibility with classical CAN 2.0B. The R5F56609BDFB#30 provides dedicated CTX0/CRX0 pins and hardware message filtering, FIFO buffering, and error handling without CPU overhead.
What analog peripherals are included in the R5F56609BDFB#30, and how many channels do they support?
The R5F56609BDFB#30 includes a 24-channel 12-bit S12ADH analog-to-digital converter with 0.9 µs minimum conversion time, two 12-bit R12DAb digital-to-analog converters, four-channel CMPC analog comparators, and an on-die temperature sensor with ±1.0°C relative precision. All analog modules are directly accessible via dedicated pins and support event linking via ELC for synchronized operation - critical for motor control and sensor fusion in the R5F56609BDFB#30.
What package type and pin count does the R5F56609BDFB#30 use, and is it RoHS compliant?
The R5F56609BDFB#30 uses the PLQP0144KA-B package: a 144-pin Low-profile Quad Flat Package with 20 × 20 mm body size, 0.5 mm lead pitch, and exposed thermal pad. It is RoHS compliant and rated for industrial temperature range (–40°C to +85°C). This package includes JTAG and FINE debug interfaces, sub-clock oscillator pins, and full 24-channel ADC routing - distinguishing it from smaller-footprint RX660 variants like the R5F56609BDFA#30.
How does the R5F56609BDFB#30 support IEC60730 Class B compliance for safety-critical applications?
The R5F56609BDFB#30 integrates multiple hardware safety features required for IEC60730 Class B: memory protection unit (MPU), Trusted Memory (TM), CRC calculator (CRCA), clock frequency accuracy measurement circuit (CAC), oscillation-stoppage detection, register write protection, and hardware-assisted RAM testing via DOC. These features enable runtime self-diagnosis of clock, memory, analog input, and control logic - all verified and documented in Renesas' IEC60730 certification kit for the R5F56609BDFB#30.
R5F56609BDFB#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RX600
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv3
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 133
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b; D/A 2x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56609BDFB#30 FAQ
1.How can I place an order for R5F56609BDFB#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56609BDFB#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56609BDFB#30 reliable?
The price and inventory of R5F56609BDFB#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56609BDFB#30 is usually 5 days.
3.What payment methods are accepted for R5F56609BDFB#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56609BDFB#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F56609BDFB#30?
R5F56609BDFB#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56609BDFB#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56609BDFB#30?
For technical support, including R5F56609BDFB#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56609BDFB#30 requirements.
6.How does Aetrix verify that R5F56609BDFB#30 is sourced from the original manufacturer or authorized distributors?
All R5F56609BDFB#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56609BDFB#30 meets industry standards.
7.What is the process for return or replacement of R5F56609BDFB#30?
All R5F56609BDFB#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56609BDFB#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56609BDFB#30 part is unused and in its original packaging.
Return procedure for R5F56609BDFB#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R5F56609BDFB#30 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

