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Renesas R5F56609BDFL#10

Part No.:
R5F56609BDFL#10
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
48-LQFP
Datasheet:
AetrixR5F56609BDFL#10.pdf
Description:
IC MCU 32BIT 1MB FLASH 48LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,312

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Product details

Overview

R5F56609BDFL#10 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring 1 Mbyte on-chip code flash, 128 Kbytes SRAM, 32 Kbytes data flash, CAN FD interface, 12-bit A/D and D/A converters, and real-time clock with sub-clock oscillator support - deployed in industrial motor control, factory automation I/O modules, and smart sensor edge nodes.

For engineers reviewing the R5F56609BDFL#10 datasheet, R5F56609BDFL#10 pinout, R5F56609BDFL#10 application, or R5F56609BDFL#10 equivalent, key selection criteria include its 144-pin LFQFP (PLQP0144KA-B) package with JTAG/FINE debug, 2.7–5.5 V single-supply operation, IEC60730 safety features, and full peripheral set including MTU3a timer, ELC event linking, and dual-channel 12-bit D/A for analog feedback loops.

Technical Context

The R5F56609BDFL#10 implements the RXv3 CPU core with single-precision FPU compliant with IEEE 754, supporting 709 CoreMark at 120 MHz and collective register bank save for fast interrupt response. It integrates an MPU for memory protection and Trusted Memory (TM) to secure firmware in code flash.

Its clock system combines an 8–24 MHz main crystal oscillator, 32.768 kHz sub-clock for RTC, and internal HOCO/LOCO oscillators, with independent PLL and IWDT-dedicated 120 kHz oscillator. Peripheral clocks are independently configurable: PCLKA up to 120 MHz (MTU3a, RSPI), PCLKB up to 60 MHz (TMR, CMT), and ADCLK up to 60 MHz for S12ADH.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core RXv3 32-bit with single-precision FPU, 709 CoreMark @ 120 MHz - enables real-time math-intensive tasks like motor vector control without external coprocessor.
Flash Memory 1 Mbyte code flash + 32 Kbytes data flash - supports field firmware updates and parameter storage with background programming (BGO) and 100,000 erase cycles.
RAM 128 Kbytes SRAM, zero wait states @ 120 MHz - sufficient for real-time task stacks, communication buffers, and control algorithm variables.
ADC/DAC 24-channel 12-bit S12ADH (0.9 µs conversion) + dual-channel 12-bit R12DAb - enables simultaneous analog sensing and closed-loop reference generation for precision actuation.
Communication 1 CAN FD channel (ISO 11898-1:2015), 13 SCI channels (including SCIm with 16-byte FIFO), 2 RIIC, 1 RSPI (30 Mbps) - supports multi-protocol industrial networking and sensor fusion.
Timers & Control MTU3a (9 channels), TMRb (4), CMT/CMTW (8), ELC (83 event signals), POE3a - delivers synchronized PWM, encoder capture, and event-triggered peripheral coordination without CPU overhead.
Safety & Reliability MPU, TM, CRCA (8/32-bit CRC), CAC clock accuracy monitor, IWDT with window function, RAM test assist - meets IEC60730 Class B requirements for self-test and fault detection.

Pinout & Package

Package: 144-pin LFQFP (PLQP0144KA-B), 20 × 20 mm, 0.5 mm pitch, lead-free, RoHS-compliant. Includes dedicated JTAG and FINE debug pins, 130 general-purpose I/O pins (4 with 5-V tolerance), and dedicated power/ground pairs for analog/digital separation.

Pin/Terminal Circuit Role Design Meaning
VCC / AVCC0 Core & analog power supply 2.7–5.5 V digital supply; AVCC0 = 3.0–5.5 V analog reference - allows direct 5 V operation and clean ADC/DAC reference without LDO.
RES# Active-low reset input Asynchronous hardware reset with internal pull-up - ensures deterministic startup under brown-out or ESD events.
XTAL / EXTAL Main clock oscillator terminals Connects to 8–24 MHz crystal - provides high-accuracy system clock source for CAN FD timing and real-time control loops.
RTCXTAL / RTCXTAL Sub-clock oscillator terminals Connects to 32.768 kHz crystal - enables battery-backed real-time clock and low-power wake-up while in deep software standby mode.
TMS / TDI / TDO / TCK JTAG debug interface IEEE 1149.1-compliant boundary scan and emulation - supports full-speed debugging, flash programming, and production testing.
TXD10 / RXD10 SCIh channel 10 serial interface LIN/UART-capable interface with built-in start-frame detection - used for automotive diagnostics or master-slave device configuration.
TXD11 / RXD11 SCIm channel 11 with FIFO 16-byte TX/RX FIFO - reduces CPU load during high-throughput serial sensor data acquisition (e.g., multi-axis IMU streams).
CRX0 / CTX0 CAN FD channel 0 differential pair ISO 11898-1-compliant physical layer interface - supports 5 Mbps FD data phase and legacy 1 Mbps arbitration for mixed-network compatibility.

Key Features

Feature Design Value
Event Link Controller (ELC) 83 internal event sources linked without CPU intervention - enables autonomous peripheral coordination (e.g., MTU trigger → ADC start → DMA transfer → interrupt) in sleep modes.
Trusted Memory (TM) Code flash area protected against read access - prevents firmware IP leakage while allowing CPU instruction fetch only, satisfying secure boot requirements.
Real-Time Clock (RTCC) Sub-clock-driven calendar/time counter with alarm, periodic, and carry interrupts - maintains accurate timekeeping during deep software standby with RTC continuing to run.
Remote Control Signal Receiver (REMC) Single-channel IR pattern matcher with 8-byte buffer and TMR/sub-clock clock selection - enables embedded remote interface in HVAC controllers or industrial HMIs.
Temperature Sensor On-die sensor with ±1.0°C relative precision, digitized via S12ADH - provides thermal monitoring for overtemperature shutdown in motor drives or power supplies.

Applications

Industrial Motor Drive Factory I/O Module

Use Scenario: Closed-loop control of 3-phase BLDC/PMSM motors with field-oriented control (FOC) and current/voltage sensing.

IC Role / Device Role / Timing Role: Main controller executing FOC algorithm, generating complementary PWM via MTU3a, sampling ADC at 100 kSPS, and managing CAN FD command interface.

Use Value: Integrated 12-bit D/A channels provide precise reference voltages for comparator-based overcurrent protection, eliminating external DACs and reducing BOM count.

Use Scenario: Modular digital/analog I/O unit for PLC backplanes, supporting 16-channel DI/DO and 4-channel AI/AO with diagnostics.

IC Role / Device Role / Timing Role: Central processing node handling protocol translation (CAN FD ↔ Modbus RTU over SCI), local analog conditioning, and watchdog supervision.

Use Value: ELC-linked timer-to-ADC triggering ensures deterministic sampling of all 24 ADC channels within 1 ms, meeting IEC 61131-2 cycle-time requirements.

Smart Sensor Edge Node Energy Monitoring Gateway

Use Scenario: Battery-powered environmental sensor hub aggregating temperature, humidity, and vibration data for predictive maintenance.

IC Role / Device Role / Timing Role: Low-power coordinator using deep software standby mode, waking on RTC alarm or external interrupt, then performing burst ADC reads and CAN FD upload.

Use Value: Sub-clock oscillator and RTC enable accurate time-stamping of sensor events across months of operation on coin-cell backup power.

Use Scenario: DIN-rail-mounted gateway collecting energy metrics (voltage, current, kWh) from CT/PT sensors and reporting via CAN FD to SCADA systems.

IC Role / Device Role / Timing Role: High-accuracy measurement engine using S12ADH with self-diagnosis, CRCA for data integrity, and CAC for clock drift compensation.

Use Value: Integrated 12-bit D/A outputs serve as programmable voltage references for analog front-end gain calibration, improving long-term measurement stability.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
R5F56608BDFL#10 Same RX660 Group, identical 144-pin LFQFP package and peripherals, but with 512 Kbyte code flash instead of 1 Mbyte. Reduced firmware footprint requirement; suitable for cost-sensitive designs where bootloader + application fit in 512 KB. Select when full 1 Mbyte flash is unnecessary and BOM cost optimization is prioritized without sacrificing peripheral count or performance.
R5F56609BDGL#10 Identical functionality and pinout, but rated for –40°C to +105°C (G-version) vs. –40°C to +85°C (D-version) of R5F56609BDFL#10. Required for under-hood automotive or high-ambient industrial environments exceeding 85°C junction temperature. Choose for extended temperature operation; otherwise, R5F56609BDFL#10 is optimal for standard industrial ambient conditions.

Compared with R5F56608BDFL#10, the R5F56609BDFL#10 provides double code flash capacity for complex control algorithms and secure boot partitions, while R5F56609BDGL#10 extends thermal range without altering firmware or layout - making R5F56609BDFL#10 the balanced choice for most industrial applications requiring full feature set and standard temperature grade.

Availability

R5F56609BDFL#10 is available at Aetrix Electronics and suitable for industrial motor control, factory I/O modules, and smart sensor edge nodes requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for R5F56609BDFL#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and IoT markets.

The RX660 Group, including R5F56609BDFL#10, was designed for high-performance, functional-safety-compliant industrial control applications - integrating real-time responsiveness, robust communication, and embedded safety features in a single chip.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F56609BDFL#10?

The R5F56609BDFL#10 operates at a maximum frequency of 120 MHz and achieves 709 CoreMark in benchmark testing. This performance level is enabled by the RXv3 CPU core with optimized pipeline, on-chip FPU, and zero-wait-state 120 MHz access to both 1 Mbyte code flash and 128 Kbytes SRAM - making R5F56609BDFL#10 suitable for demanding real-time control tasks such as motor FOC and multi-axis motion profiling.

Does the R5F56609BDFL#10 support CAN FD, and what standards does it comply with?

Yes, the R5F5609BDFL#10 includes one CAN FD module compliant with ISO 11898-1:2015, supporting both standard and extended frames. It operates at up to 5 Mbps in the FD data phase and maintains backward compatibility with classical CAN 2.0B at 1 Mbps arbitration - enabling seamless integration into modern industrial networks requiring higher bandwidth and payload efficiency, as implemented in the R5F56609BDFL#10's integrated CANFD peripheral.

What debug interfaces are available on the R5F56609BDFL#10?

The R5F56609BDFL#10 supports both JTAG (IEEE 1149.1) and FINE (single-wire) debugging interfaces. JTAG provides full boundary-scan capability, high-speed emulation, and flash programming, while FINE enables minimal-pin debugging in space-constrained designs. Both interfaces are active simultaneously and supported by Renesas' e2 studio and CS+ toolchains - ensuring flexible development and production test access for the R5F56609BDFL#10.

How does the R5F56609BDFL#10 meet IEC60730 safety requirements?

The R5F56609BDFL#10 integrates multiple hardware features for IEC60730 Class B compliance: oscillation-stop detection, clock frequency accuracy measurement circuit (CAC), independent watchdog timer (IWDT) with window function, RAM test-assist via DOC, CRCA for data integrity, and register write protection. These are documented in the R5F56609BDFL#10 datasheet and supported by Renesas' safety manual - enabling certified self-test routines without external components.

What is the package type and pin count of the R5F56609BDFL#10?

The R5F56609BDFL#10 is housed in a 144-pin LFQFP package (PLQP0144KA-B), measuring 20 × 20 mm with 0.5 mm pitch. It provides 130 general-purpose I/O pins (including 4 with 5-V tolerance), dedicated JTAG/FINE debug pins, and separate analog/digital power domains - matching the mechanical and thermal requirements of industrial control boards where the R5F56609BDFL#10 is commonly deployed.

R5F56609BDFL#10 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
48-LQFP
Series:
RX600
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Core Processor:
RXv3
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
39
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x12b; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F56609BDFL#10 FAQ

1.How can I place an order for R5F56609BDFL#10 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F56609BDFL#10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F56609BDFL#10 reliable?

The price and inventory of R5F56609BDFL#10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56609BDFL#10 is usually 5 days.

3.What payment methods are accepted for R5F56609BDFL#10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56609BDFL#10 transactions.

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4.How is shipping managed for R5F56609BDFL#10?

R5F56609BDFL#10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F56609BDFL#10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F56609BDFL#10?

For technical support, including R5F56609BDFL#10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56609BDFL#10 requirements.

6.How does Aetrix verify that R5F56609BDFL#10 is sourced from the original manufacturer or authorized distributors?

All R5F56609BDFL#10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56609BDFL#10 meets industry standards.

7.What is the process for return or replacement of R5F56609BDFL#10?

All R5F56609BDFL#10 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56609BDFL#10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F56609BDFL#10 part is unused and in its original packaging.

Return procedure for R5F56609BDFL#10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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