Renesas R5F56609BDFM#30
- Part No.:
- R5F56609BDFM#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
R5F56609BDFM#30.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:320
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Product details
Overview
R5F56609BDFM#30 from Renesas is a 32-bit RXv3 core microcontroller operating at up to 120 MHz, delivering 709 CoreMark performance, with 1 Mbyte on-chip code flash, 128 Kbytes SRAM, and 32 Kbytes data flash. It integrates CAN FD (ISO 11898-1:2015), 12-bit A/D (24 channels), dual 12-bit D/A, 4-channel analog comparator, RTC with sub-clock support, and remote control signal receiver - deployed in industrial motor control and automotive body electronics.
For engineers reviewing the R5F56609BDFM#30 datasheet, R5F56609BDFM#30 pinout, R5F56609BDFM#30 application, or R5F56609BDFM#30 equivalent, key selection considerations include its 144-pin LFQFP (PLQP0144KA-B) package, JTAG/FINE debug interface, 2.7–5.5 V single-supply operation, IEC60730 safety features, and full peripheral set including MTU3a (9-channel), DMACA (8-channel), and ELC event linking.
Technical Context
The R5F56609BDFM#30 implements the RXv3 CPU core with single-cycle instruction execution, IEEE 754-compliant single-precision FPU, and 16-register bank save for fast context switching. Its clock system supports independent domain scaling: ICLK up to 120 MHz, PCLKA up to 120 MHz (for MTU/RSPI/SCI10–11), PCLKB up to 60 MHz (for TMR/CMT/CMTW), and ADCLK up to 60 MHz for S12ADH.
Peripheral integration follows a modular, event-driven architecture: the Event Link Controller (ELC) enables 83 internal event signals to trigger timer operations, A/D conversions, or GPIO state changes without CPU intervention; CAN FD operates in standard/extended frame modes with hardware message filtering; and the Trusted Memory (TM) function restricts code flash access to instruction fetch only in designated areas.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv3 32-bit, 120 MHz max, 709 CoreMark, IEEE 754 FPU |
| Memory | 1 Mbyte code flash (no-wait @120 MHz), 128 Kbytes SRAM (no-wait), 32 Kbytes data flash (100k erase cycles) |
| Analog Peripherals | 12-bit S12ADH (24 ch, 0.9 µs conv.), dual 12-bit R12DAb (0–AVCC0 output), 4-channel CMPC, on-die temp sensor (±1.0°C) |
| Timers & Control | MTU3a (9 ch), TMRb (4 ch), CMT (4 ch), CMTW (2 ch), IWDT (dedicated 120-kHz oscillator), RTCC (sub-clock sourced) |
| Communication | CAN FD (1 ch, ISO 11898-1:2015), SCI/SCIm/SCIh (13 ch total), RIIC (2 ch, 400 kbps), RSPI (1 ch, 30 Mbps), REMCa (1 ch) |
| Power & Safety | 2.7–5.5 V supply, –40°C to +85°C (D-version), MPU, TM, CRCA, CAC, DOCA, register write protection, IEC60730 support |
| Package & Debug | 144-pin LFQFP (PLQP0144KA-B, 20 × 20 mm, 0.5 mm pitch), JTAG and FINE debugging interfaces |
Pinout & Package
Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 × 20 mm body, 0.5 mm lead pitch, exposed pad, RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 | Power supply input | Core/analog supply (2.7–5.5 V); AVCC0 must be ≥ VCC and within 3.0–5.5 V range |
| RES# | Active-low reset input | Asynchronous hardware reset; low pulse ≥ 100 ns triggers power-on or external reset |
| CLKIN / CLKOUT | Main clock oscillator terminals | Connects to 8–24 MHz crystal; CLKOUT provides buffered reference for external circuitry |
| XTAL / EXTAL | Sub-clock oscillator terminals | Connects to 32.768 kHz crystal for RTC and low-power timing |
| TxD0 / RxD0 | SCI0 asynchronous serial interface | Full-duplex UART interface supporting LIN, smart card, and clock-synchronous modes |
| TXD1 / RXD1 | SCI1 asynchronous serial interface | Dedicated channel for bootloader communication or secondary host interface |
| CAN_TX / CAN_RX | CAN FD physical layer interface | Differential pair for ISO 11898-1:2015 compliant CAN FD bus (up to 5 Mbps) |
| AD00–AD23 | Analog input channels | 24 dedicated pins for S12ADH; support self-diagnosis and disconnection detection |
| DA0 / DA1 | Digital-to-analog outputs | Two independent 12-bit voltage outputs (0–AVCC0); usable as comparator references |
| RTC_OUT | Real-time clock output | Provides 32.768 kHz or divided RTC clock signal for external synchronization |
Key Features
| Feature | Design Value |
|---|---|
| Event Link Controller (ELC) | Enables 83 internal event sources to trigger peripheral actions (e.g., A/D start on MTU compare match) without CPU wake-up or ISR overhead |
| Trusted Memory (TM) | Restricts code flash access to CPU instruction fetch only in defined TM target areas, preventing unauthorized read-out of firmware |
| IEC60730 Safety Support | Includes oscillation-stop detection, CRC calculator (CRCA), clock accuracy monitor (CAC), RAM test assist (DOC), and register write protection |
| Complementary PWM with Dead-Time Control | MTU3a supports non-overlapping 3-phase PWM outputs with programmable dead time, enabling direct gate drive for inverters |
| Background Operation (BGO) | Code/data flash programming and erasing occur concurrently with CPU execution, minimizing system interruption during firmware updates |
Applications
| Industrial Motor Control | Automotive Body Electronics |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC/PMSM motors in HVAC blowers, pumps, and fans using field-oriented control (FOC). IC Role / Device Role / Timing Role: Primary controller executing FOC algorithms via RXv3+FPU, generating complementary PWM via MTU3a, sampling current/voltage via S12ADH, and managing CAN FD diagnostics. Use Value: Integrated 120 MHz timing, hardware dead-time insertion, and real-time ELC-triggered ADC sampling eliminate external timing ICs and reduce jitter in current sensing loops. | Use Scenario: Central body controller managing door locks, window lifts, lighting, and mirror adjustment in passenger vehicles. IC Role / Device Role / Timing Role: System-on-chip MCU handling LIN/CAN FD communication, analog sensor interfacing (temperature, position), PWM dimming, and secure firmware updates via TM-protected flash. Use Value: Dual CAN FD and LIN-capable SCIh enable seamless integration into vehicle networks; IEC60730-certified safety features satisfy ASIL-B functional safety requirements. |
| Smart Energy Metering | Factory Automation I/O Module |
Use Scenario: DIN-rail mounted electricity meter performing active/reactive energy calculation, tamper detection, and HPLC/G3-PLC communication. IC Role / Device Role / Timing Role: High-accuracy metrology processor using S12ADH with programmable sampling windows, R12DAb for reference calibration, and RSPI for PLC modem interfacing. Use Value: On-chip 12-bit D/A outputs serve as precision voltage references for ADC offset/gain calibration, improving long-term measurement stability without external DACs. | Use Scenario: Modular digital I/O unit converting fieldbus protocols (CANopen, DeviceNet) to Ethernet/IP or PROFINET via gateway firmware. IC Role / Device Role / Timing Role: Protocol translation engine leveraging DMACA for high-throughput CAN FD ↔ RSPI bridging, ELC for deterministic interrupt-free data routing, and RIIC for EEPROM configuration storage. Use Value: 8-channel DMACA offloads CPU from protocol framing tasks; 133 GPIOs with 5-V tolerance simplify connection to legacy 24 V industrial sensors and actuators. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F56608BDFM#30 | Same RX660 Group, identical 144-pin LFQFP package and peripherals, but with 512 Kbyte code flash instead of 1 Mbyte | Suitable for cost-sensitive designs where firmware size < 512 KB eliminates need for larger flash | Select when application firmware fits within 512 KB and BOM cost reduction is prioritized over future scalability |
| R5F566T9BDFP#30 | Same feature set and pinout, but in 144-pin LQFP (PLQP0144KB-A) with different thermal pad design and moisture sensitivity level (MSL3 vs MSL3 for R5F56609BDFM#30) | Compatible for board-level replacement where PCB land pattern matches PLQP0144KB-A footprint | Choose when sourcing flexibility or alternate qualification path is required; verify thermal pad solder mask and reflow profile compatibility |
Compared with R5F56608BDFM#30, the R5F56609BDFM#30 provides double flash capacity for complex firmware or OTA update partitions; versus R5F566T9BDFP#30, it offers identical functionality with verified PLQP0144KA-B packaging for high-volume industrial assembly.
Availability
R5F56609BDFM#30 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, and smart energy metering requiring stable component supply across extended product lifecycles.
Supply support for R5F56609BDFM#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.
The RX660 Group - including the R5F56609BDFM#30 - is engineered for real-time deterministic control in safety-critical applications, integrating IEC60730 compliance features, high-precision analog, and robust communication interfaces for industrial automation and automotive subsystems.
FAQ
What is the maximum operating frequency and CoreMark score of the R5F56609BDFM#30?
The R5F56609BDFM#30 operates at a maximum frequency of 120 MHz and achieves 709 CoreMark performance under benchmark conditions. This reflects the efficiency of its RXv3 CPU core with single-cycle instruction execution, integrated FPU, and optimized memory subsystem - all validated per Renesas R01DS0393EJ0100 Rev.1.00 datasheet testing methodology. The R5F56609BDFM#30 sustains this performance with no wait states on both 1 Mbyte code flash and 128 Kbytes SRAM.
Does the R5F56609BDFM#30 support CAN FD, and what standard does it comply with?
Yes, the R5F56609BDFM#30 integrates a CAN FD module compliant with ISO 11898-1:2015, supporting both standard and extended frames at data rates up to 5 Mbps. It includes hardware message filtering, transmit/receive buffers, and error confinement logic. The R5F56609BDFM#30 implements full CAN FD protocol handling in silicon - not emulated - enabling deterministic real-time communication in automotive and industrial networks without external transceivers beyond physical layer.
What package type and pin count does the R5F56609BDFM#30 use?
The R5F56609BDFM#30 uses the PLQP0144KA-B package: a 144-pin Low-profile Quad Flat Package measuring 20 × 20 mm with 0.5 mm lead pitch and an exposed thermal pad. This package supports 130 general-purpose I/O pins (including 4 with 5-V tolerance), JTAG and FINE debug interfaces, and full peripheral mapping per the RX660 Group datasheet. The R5F56609BDFM#30's pinout is fully documented in Table 1.2 of R01DS0393EJ0100 Rev.1.00.
How does the R5F56609BDFM#30 support functional safety standards like IEC60730?
The R5F56609BDFM#30 includes dedicated hardware for IEC60730 Class B compliance: oscillation-stop detection for main/sub clocks, clock frequency accuracy measurement circuit (CAC), CRC calculator (CRCA), data operation circuit (DOCA) for RAM testing, register write protection, and independent watchdog timer (IWDT) with windowing. These features are implemented in silicon and documented in Section 28 of the R01DS0393EJ0100 Rev.1.00 datasheet. The R5F56609BDFM#30 enables certified safety firmware without external monitoring ICs.
What is the role of the Event Link Controller (ELC) in the R5F56609BDFM#30?
The Event Link Controller (ELC) in the R5F56609BDFM#30 enables 83 internal peripheral events (e.g., MTU compare match, A/D conversion complete, SCI receive) to directly trigger actions in other modules - such as starting an ADC scan or toggling a GPIO - without CPU intervention or interrupt latency. This hardware-based inter-module linking reduces ISR overhead and improves real-time determinism. The R5F56609BDFM#30 leverages ELC extensively in motor control and sensor acquisition systems where cycle-accurate timing is critical.
R5F56609BDFM#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LQFP
- Series:
- RX600
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv3
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 55
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 14x12b; D/A 2x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56609BDFM#30 FAQ
1.How can I place an order for R5F56609BDFM#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56609BDFM#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56609BDFM#30 reliable?
The price and inventory of R5F56609BDFM#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56609BDFM#30 is usually 5 days.
3.What payment methods are accepted for R5F56609BDFM#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56609BDFM#30 transactions.
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4.How is shipping managed for R5F56609BDFM#30?
R5F56609BDFM#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56609BDFM#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56609BDFM#30?
For technical support, including R5F56609BDFM#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56609BDFM#30 requirements.
6.How does Aetrix verify that R5F56609BDFM#30 is sourced from the original manufacturer or authorized distributors?
All R5F56609BDFM#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56609BDFM#30 meets industry standards.
7.What is the process for return or replacement of R5F56609BDFM#30?
All R5F56609BDFM#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56609BDFM#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56609BDFM#30 part is unused and in its original packaging.
Return procedure for R5F56609BDFM#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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