Renesas R5F56609BDFP#30

Overview

R5F56609BDFP#30 from Renesas is a 32-bit RXv3 core microcontroller operating at up to 120 MHz, delivering 709 CoreMark performance. It integrates 1 Mbyte of on-chip code flash memory with zero-wait-state access, 128 Kbytes of SRAM, and 32 Kbytes of reprogrammable data flash (100,000 write/erase cycles). The device supports CAN FD (ISO 11898-1:2015), 12-bit A/D and D/A converters, real-time clock with sub-clock oscillator support, and operates across –40°C to +85°C for industrial control applications.

For engineers reviewing the R5F56609BDFP#30 datasheet, R5F56609BDFP#30 pinout, R5F56609BDFP#30 application, or R5F56609BDFP#30 equivalent, key selection considerations include its 144-pin LFQFP (PLQP0144KA-B) package, dual 12-bit DAC outputs usable as comparator references, ELC-driven event-triggered peripheral coordination, and IEC60730-compliant safety features including MPU, CAC, CRCA, and register write protection.

Technical Context

The R5F56609BDFP#30 implements the RXv3 CPU core with single-cycle instruction execution, IEEE 754-compliant single-precision FPU, and 16-register bank save capability. Its clock system combines an 8–24 MHz main crystal oscillator, 32.768 kHz sub-clock oscillator, and selectable on-chip oscillators (LOCO/HOCO/IWDT-dedicated), enabling independent domain clocks - ICLK up to 120 MHz, PCLKA up to 120 MHz, PCLKB up to 60 MHz, and ADCLK up to 60 MHz.

Peripheral coordination is managed via the Event Link Controller (ELC), supporting 83 internal event signals for interrupt-free inter-module triggering - e.g., MTU3a timer events initiating A/D conversion or REMC pattern detection activating port output enable. Safety-critical operation is reinforced by MPU (8 regions, 16-byte granularity), Trusted Memory (TM) for code flash protection, and hardware-accelerated CRC (8-/32-bit) with LSB/MSB alignment support.

Key Specifications

Pinout & Package

Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 × 20 mm body, 0.5 mm lead pitch, exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F56609BDFP#30, R5F56608BDFP#30 reduces flash capacity without altering pinout or peripheral count, while R5F56609BDFF#30 trades package size and feature count (no sub-clock, one DAC) for PCB area savings - neither is pin-compatible, requiring layout revision.

Availability

R5F56609BDFP#30 is available at Aetrix Electronics and suitable for industrial automation, automotive body electronics, and medical device applications requiring stable component supply, long-term lifecycle assurance, and full IEC60730 compliance support.

Supply support for R5F56609BDFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise markets.

The RX660 Group, including R5F56609BDFP#30, is engineered for high-integrity embedded systems demanding real-time performance, functional safety (IEC60730), and rich connectivity - targeting programmable logic controllers, motor drives, and intelligent sensors.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F56609BDFP#30?

The R5F56609BDFP#30 operates at a maximum frequency of 120 MHz and achieves 709 CoreMark performance. This result is measured under specified conditions (VCC = 3.3 V, AVCC0 = 3.3 V, ambient temperature = 25°C) using the EEMBC CoreMark benchmark v1.0 with compiler optimizations enabled. The RXv3 core's single-cycle instruction execution and integrated 32-bit multiplier/divider contribute directly to this score.

Does the R5F56609BDFP#30 support CAN FD, and what standard does it comply with?

Yes, the R5F56609BDFP#30 includes a CAN FD module compliant with ISO 11898-1:2015. It supports both standard (11-bit) and extended (29-bit) frame formats, bit rates up to 5 Mbps in FD mode, and data payloads up to 64 bytes. The module integrates error counters, message buffers, and acceptance filtering, and operates independently of CPU intervention via ELC-triggered transmission/reception.

What are the analog capabilities of the R5F56609BDFP#30, and how are the DAC outputs used?

The R5F56609BDFP#30 integrates a 24-channel 12-bit A/D converter (S12ADH), two 12-bit D/A converters (R12DAb), and four analog comparators (CMPC). Each DAC output (DA0, DA1) provides a voltage range of 0 V to AVCC0 and is explicitly documented as usable as a reference voltage source for the CMPC comparators - enabling precision threshold detection without external components.

Is the R5F56609BDFP#30 qualified for industrial temperature range, and what is its supply voltage range?

Yes, the R5F56609BDFP#30 is rated for the industrial temperature range of –40°C to +85°C (D-version). Its supply requirements are VCC = 2.7–5.5 V and AVCC0 = 3.0–5.5 V, with AVCC0 required to be ≥ VCC. This dual-supply architecture isolates analog circuitry for stable ADC/DAC performance across wide input voltage conditions.

What debugging interfaces does the R5F56609BDFP#30 support, and are they available in the 144-pin package?

The R5F56609BDFP#30 supports both JTAG and FINE (single-wire) debugging interfaces, and both are fully available in the 144-pin LFQFP (PLQP0144KA-B) package. JTAG provides full boundary-scan and trace capability, while FINE enables minimal-pin debugging and programming - critical for space-constrained or security-hardened designs where JTAG may be disabled post-deployment.