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Renesas R5F56609BGFM#30

Part No.:
R5F56609BGFM#30
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixR5F56609BGFM#30.pdf
Description:
MCU:RX
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:315

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Product details

Overview

R5F56609BGFM#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring 1 MB code flash, 128 KB SRAM, 32 KB data flash, integrated CAN FD, 12-bit A/D and D/A converters, RTC with sub-clock support, and hardware FPU compliant with IEEE 754. It targets industrial control, motor drive, and safety-critical embedded systems requiring IEC 60730 compliance.

For engineers reviewing the R5F56609BGFM#30 datasheet, R5F56609BGFM#30 pinout, R5F56609BGFM#30 application, or R5F56609BGFM#30 equivalent, key selection criteria include its 144-pin LFQFP package with JTAG+FINE debug, G-grade (–40°C to +105°C) operation, dual D/A outputs usable as comparator references, and full CAN FD compliance per ISO 11898-1:2015 - critical for automotive body control and industrial gateway designs.

Technical Context

The R5F56609BGFM#30 implements the RXv3 CPU core with single-cycle instruction execution, 16 general-purpose 32-bit registers, and hardware floating-point unit supporting IEEE 754 single-precision arithmetic. Its clock system integrates main (8–24 MHz crystal), sub-clock (32.768 kHz), and on-chip oscillators (LOCO/HOCO/IWDT-dedicated), with independent PLL and frequency-division paths for ICLK (up to 120 MHz), PCLKA (120 MHz), PCLKB (60 MHz), and ADCLK (60 MHz).

Peripheral integration includes MTU3a (9-channel 16/32-bit timer with complementary PWM and dead-time control), ELC for interrupt-free inter-module event chaining (83 internal signals), and safety features such as MPU (8 regions), Trusted Memory (TM), CRC calculator (CRCA), CAC clock accuracy monitoring, and register write protection - all aligned with IEC 60730 Class B requirements for self-test and fault detection.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreRXv3 32-bit, 120 MHz max, 709 CoreMark, IEEE 754 FPU, 113 instructions including DSP ops
Memory1 MB code flash (no-wait @120 MHz), 32 KB data flash (100k erase cycles), 128 KB SRAM (no-wait)
Operating Range2.7–5.5 V supply; –40°C to +105°C (G-version); 5-V tolerant I/O on 4 pins
Analog Peripherals24-channel 12-bit S12ADH (0.9 µs min conversion), 2-channel 12-bit R12DAb (0–AVCC0 output), 4-channel CMPC
CommunicationCAN FD (ISO 11898-1:2015), 13 SCI channels (async/sync/I²C/SPI/LIN), 2 RIIC (400 kbps), 1 RSPI (30 Mbps), 1 REMC
Timers & ControlMTU3a (9 ch), TMRb (4 ch), CMT (4 ch), CMTW (2 ch), IWDT (windowed, dedicated oscillator), RTCC (sub-clock referenced)
Safety FeaturesMPU (8 regions), TM protection, CRCA (8/32-bit CRC), CAC, DOCA, oscillation-stop detection, register write protection

Pinout & Package

Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 × 20 mm, 0.5 mm pitch, exposed pad, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
VCC / AVCC0Core & analog power supply2.7–5.5 V digital supply; 3.0–5.5 V analog reference (AVCC0 ≥ VCC)
RES#Active-low reset inputHardware reset assertion; supports power-on reset and external reset initiation
CLKIN / CLKOUTMain clock oscillator interfaceConnects to 8–24 MHz crystal/resonator; CLKOUT provides buffered output for system clock distribution
XTAL / EXTALSub-clock oscillator interfaceConnects to 32.768 kHz crystal for RTC and low-power timing
TMS / TDI / TDO / TCKJTAG debug interfaceIEEE 1149.1-compliant boundary-scan and emulation; supports full-speed debugging and programming
FINESingle-wire debug interfaceReduced-pin-count alternative to JTAG; enables programming and real-time trace in space-constrained layouts
TXD0 / RXD0SCI0 serial interfaceAsynchronous UART channel for bootloader, diagnostics, or host communication
CTX0 / CRX0CAN FD channel 0Differential CAN transceiver interface compliant with ISO 11898-1:2015 physical layer
AD00–AD23Analog input channels24 dedicated pins for 12-bit S12ADH; support sampling time per channel and group scan prioritization
DA0 / DA1Digital-to-analog outputs2-channel 12-bit voltage outputs (0–AVCC0); usable as reference inputs for CMPC comparators

Key Features

FeatureDesign Value
Event Link Controller (ELC)Enables 83 internal peripheral events to trigger actions (e.g., timer start, ADC conversion) without CPU intervention - reduces latency and power in sleep modes
Complementary PWM with Dead-Time ControlMTU3a generates non-overlapping 3-phase gate drive waveforms with programmable dead time - eliminates shoot-through risk in inverter designs
Trusted Memory (TM) ProtectionPrevents unauthorized read access to designated code flash regions during runtime - essential for secure firmware updates and IP protection
IEC 60730 Safety SupportIntegrated hardware blocks (CAC, CRCA, DOCA, oscillation detection, RAM test assist) enable Class B compliance without external components
Background Operation (BGO)Code/data flash programming and erasing occur concurrently with CPU execution - enables seamless firmware updates and data logging

Applications

Industrial Motor ControlAutomotive Body Control Module

Use Scenario: Closed-loop control of 3-phase BLDC/PMSM motors in HVAC blowers, pumps, and compressors.

IC Role / Device Role / Timing Role: Main controller executing FOC algorithms via hardware FPU, generating complementary PWM via MTU3a, and sampling current/voltage via S12ADH.

Use Value: Integrated dead-time compensation, 0.9 µs ADC conversion, and ELC-triggered ADC sampling eliminate software overhead and ensure precise timing synchronization.

Use Scenario: Centralized control of door locks, lighting, window lifts, and seat position memory in passenger vehicles.

IC Role / Device Role / Timing Role: CAN FD node managing message routing, diagnostics, and actuator control while maintaining real-time response under bus load.

Use Value: Full ISO 11898-1:2015 compliance, 120 MHz deterministic processing, and IEC 60730 safety features meet OEM functional safety requirements without external co-processors.

Smart Energy GatewayFactory Automation I/O Controller

Use Scenario: Protocol translation and data aggregation between smart meters (M-Bus, PLC), cloud interfaces (Ethernet/Wi-Fi via external PHY), and local HMI.

IC Role / Device Role / Timing Role: Host MCU handling multiple serial protocols (SCI, RIIC, RSPI), secure firmware updates via TM-protected flash, and RTC-stamped event logging.

Use Value: 13 SCI channels with LIN/UART/I²C/SPI modes, 2-channel D/A for analog sensor calibration, and 32 KB reprogrammable data flash enable field-upgradable protocol stacks.

Use Scenario: Distributed I/O module collecting sensor data (temperature, pressure, proximity) and driving solenoids, relays, and indicator LEDs across production lines.

IC Role / Device Role / Timing Role: Real-time I/O manager using ELC to chain GPIO state changes, ADC sampling, and PWM output based on fieldbus triggers (e.g., EtherCAT sync signals).

Use Value: 134 GPIOs with 5-V tolerance, 4-channel analog comparator for threshold detection, and deep software standby mode with RTC wake-up reduce system power by >90% during idle periods.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F56608BGFN#30Same RX660 Group, 100-pin LFQFP (PLQP0100KB-B), 512 KB code flash, 17-channel ADC, single D/A channel, no JTAG interfaceLower pin count and memory; suited for cost-sensitive, space-constrained nodes without debug-in-field requirementSelect when footprint, BOM cost, and debug accessibility are secondary to thermal performance and basic CAN FD connectivity
R5F566T9BDFP#30D-version (–40°C to +85°C), same 144-pin package, identical peripherals and memory, but lacks sub-clock oscillator and RTC functionalityExcludes RTC and sub-clock support; unsuitable for battery-backed timekeeping or deep-sleep wake-up via 32.768 kHzSelect only for ambient-temperature industrial applications where RTC is unnecessary and lower temperature grade reduces procurement cost

Compared with R5F56608BGFN#30 and R5F566T9BDFP#30, the R5F56609BGFM#30 uniquely delivers full 144-pin I/O expansion, 1 MB flash for complex protocol stacks, dual D/A outputs for analog feedback loops, and guaranteed RTC operation - making it the only choice for high-integration, safety-certified, thermally demanding designs.

Availability

R5F56609BGFM#30 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, and smart energy gateway applications requiring stable component supply, long-term lifecycle assurance, and G-grade extended temperature operation.

Supply support for R5F56609BGFM#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets, with over 40 years of microcontroller innovation.

The RX660 Group - including R5F56609BGFM#30 - was designed specifically for real-time, safety-aware industrial automation and automotive body electronics, integrating high-performance RXv3 cores, robust analog peripherals, and certified functional safety features in a scalable pin-compatible family.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F56609BGFM#30?

The R5F56609BGFM#30 operates at a maximum frequency of 120 MHz and achieves 709 CoreMark points under benchmark conditions. This performance stems from its RXv3 CPU core with single-cycle instruction execution, hardware FPU, and zero-wait-state access to both 1 MB code flash and 128 KB SRAM - enabling deterministic real-time response in demanding control applications.

Does the R5F56609BGFM#30 support CAN FD, and what standard does it comply with?

Yes, the R5F56609BGFM#30 integrates a CAN FD module compliant with ISO 11898-1:2015, supporting both standard and extended frames at data rates up to 5 Mbps. This enables high-bandwidth, deterministic communication in automotive body control and industrial networked systems - a capability confirmed in the official R01DS0393EJ0100 datasheet Rev.1.00.

What package type and pin count does the R5F56609BGFM#30 use?

The R5F56609BGFM#30 uses the PLQP0144KA-B package: a 144-pin Low-profile Quad Flat Package measuring 20 × 20 mm with 0.5 mm pitch and an exposed thermal pad. This package supports JTAG and FINE debugging interfaces and is rated for –40°C to +105°C operation (G-version), as specified in Renesas' RX660 Group documentation.

How many analog-to-digital and digital-to-analog converter channels does the R5F56609BGFM#30 include?

The R5F56609BGFM#30 includes one 12-bit A/D converter (S12ADH) with 24 input channels and two 12-bit D/A converter channels (R12DAb). Both D/A outputs can serve as reference voltages for the four-channel analog comparator (CMPC), enabling flexible sensor signal conditioning and closed-loop analog control without external components.

Is the R5F56609BGFM#30 qualified for IEC 60730 Class B compliance, and which hardware features enable this?

Yes, the R5F56609BGFM#30 includes dedicated hardware for IEC 60730 Class B compliance: memory protection unit (MPU), Trusted Memory (TM), clock accuracy measurement circuit (CAC), CRC calculator (CRCA), data operation circuit (DOCA), oscillation-stop detection, and register write protection. These features are documented in the R01DS0393EJ0100 datasheet and eliminate the need for external safety monitors in certified designs.

R5F56609BGFM#30 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
64-LQFP
Series:
RX600
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
RXv3
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
55
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 14x12b; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F56609BGFM#30 FAQ

1.How can I place an order for R5F56609BGFM#30 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F56609BGFM#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F56609BGFM#30 reliable?

The price and inventory of R5F56609BGFM#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56609BGFM#30 is usually 5 days.

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4.How is shipping managed for R5F56609BGFM#30?

R5F56609BGFM#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F56609BGFM#30 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F56609BGFM#30?

For technical support, including R5F56609BGFM#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56609BGFM#30 requirements.

6.How does Aetrix verify that R5F56609BGFM#30 is sourced from the original manufacturer or authorized distributors?

All R5F56609BGFM#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56609BGFM#30 meets industry standards.

7.What is the process for return or replacement of R5F56609BGFM#30?

All R5F56609BGFM#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56609BGFM#30, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F56609BGFM#30 part is unused and in its original packaging.

Return procedure for R5F56609BGFM#30:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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