Renesas R5F56609BGFN#30

Overview

R5F56609BGFN#30 from Renesas is a 32-bit RXv3 core MCU operating at up to 120 MHz, featuring 1 Mbyte on-chip code flash, 128 Kbytes SRAM, 32 Kbytes data flash, CAN FD interface, 12-bit A/D and D/A converters, and real-time clock with sub-clock oscillator support - deployed in industrial HMI, motor control, and smart sensor nodes requiring deterministic timing and IEC 60730 compliance.

For engineers reviewing the R5F56609BGFN#30 datasheet, R5F56609BGFN#30 pinout, R5F56609BGFN#30 application, or R5F56609BGFN#30 equivalent, this page delivers verified package mapping (144-pin LFQFP PLQP0144KA-B), confirmed peripheral channel counts (e.g., 24-channel S12ADH, 1-channel CANFD), low-power mode behavior (deep software standby with RTC active), and precise alternative selection guidance for functional migration paths.

Technical Context

The R5F56609BGFN#30 implements the RXv3 CPU core with single-precision FPU compliant to IEEE 754, supporting 709 CoreMark at 120 MHz and collective register bank save across 16 banks. Its memory subsystem includes zero-wait-state access to both 1 Mbyte code flash and 128 Kbytes SRAM at full speed.

Peripherals are clocked via independent domain dividers: PCLKA (up to 120 MHz) drives MTU3a and RSPI; PCLKB (up to 60 MHz) serves TMRb, CMT, and CANFD; ADCLK (up to 60 MHz) clocks the 12-bit S12ADH; and BCLK (up to 40 MHz) enables external bus interfacing across four CS areas with 8-/16-bit selectability per area.

Key Specifications

Pinout & Package

144-pin Low-profile Quad Flat Package (LFQFP), PLQP0144KA-B, 20 × 20 mm body, 0.5 mm pitch, exposed pad not specified, RoHS-compliant, moisture sensitivity level (MSL) 3 per J-STD-020.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F56609BGFN#30, R5F56608BGFN#30 reduces flash capacity by 50% without altering peripheral count or performance, while R5F566T9BGFN#30 retains full feature parity and adds hardware security extensions - making the former ideal for static firmware deployments and the latter essential for connected, updateable systems.

Availability

R5F56609BGFN#30 is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, human-machine interfaces, and automotive body control modules requiring stable component supply across extended product lifecycles.

Supply support for R5F56609BGFN#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and IoT markets.

The RX660 Group - including R5F56609BGFN#30 - was designed for high-performance, safety-aware embedded applications demanding real-time determinism, rich analog integration, and long-term reliability in harsh environments.

FAQ

What is the maximum operating frequency and core type of the R5F56609BGFN#30?

The R5F56609BGFN#30 features a 32-bit RXv3 CPU core with single-precision floating-point unit (FPU), operating at a maximum frequency of 120 MHz. It achieves 709 CoreMark score at this speed and supports IEEE 754-compliant arithmetic. The R5F56609BGFN#30 also includes collective register bank save across 16 banks and a 113-instruction set with DSP extensions, enabling efficient real-time control in motor and sensor applications.

Does the R5F56609BGFN#30 support CAN FD, and what standard does it comply with?

Yes, the R5F56609BGFN#30 integrates one CAN FD module compliant with ISO 11898-1:2015, supporting both standard and extended frame formats. It operates at data rates up to 5 Mbps in FD mode and maintains backward compatibility with classical CAN 2.0B. The R5F56609BGFN#30's CAN FD peripheral includes message RAM with configurable TX/RX buffers, error counters, and loopback self-test capability - validated in Renesas' R01DS0393EJ0100 datasheet.

What are the memory resources available on the R5F56609BGFN#30?

The R5F56609BGFN#30 provides 1 Mbyte of on-chip code flash memory with zero-wait-state access at 120 MHz, 128 Kbytes of SRAM (also zero-wait-state), and 32 Kbytes of reprogrammable data flash rated for 100,000 erase/write cycles. It also includes a 12-byte unique ID and supports Trusted Memory (TM) for firmware protection. All memory blocks are accessible via the 4-Gbyte linear address space of the RXv3 core.

What analog peripherals are integrated into the R5F56609BGFN#30?

The R5F56609BGFN#30 integrates a 24-channel 12-bit A/D converter (S12ADH) with 0.9 µs minimum conversion time at 60 MHz ADCLK, two 12-bit D/A converters (R12DAb) with 0–AVCC0 output range, four analog comparators (CMPC), and an on-die temperature sensor with ±1.0°C relative precision. These peripherals are linked via the Event Link Controller (ELC) and support self-diagnostic and disconnection detection per IEC 60730 requirements.

What package and temperature grade does the R5F56609BGFN#30 use?

The R5F56609BGFN#30 is housed in a 144-pin Low-profile Quad Flat Package (LFQFP) with part code PLQP0144KA-B - measuring 20 × 20 mm with 0.5 mm pitch. It is rated for the G-version industrial temperature range of –40°C to +105°C, and supports 5-V tolerant I/O on four pins. This package variant includes both JTAG and sub-clock oscillator (SOSC) functionality, as confirmed in Table 1.2 of the R01DS0393EJ0100 datasheet.