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Renesas R5F56609BGFP#30
- Part No.:
- R5F56609BGFP#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- -
- Datasheet:
-
R5F56609BGFP#30.pdf
- Description:
- RX660-5V-040
- Quantity:
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Inventory:345
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Product details
Overview
R5F56609BGFP#30 from Renesas is a 32-bit RXv3 core MCU operating at up to 120 MHz, delivering 709 CoreMark performance, with 1 MB on-chip code flash, 128 KB SRAM, and 32 KB data flash. It integrates CAN FD (ISO 11898-1:2015), dual 12-bit DACs, 24-channel 12-bit ADC, RTC with sub-clock support, and operates across –40°C to +105°C for industrial motor control and embedded gateway applications.
For engineers reviewing the R5F56609BGFP#30 datasheet, R5F56609BGFP#30 pinout, R5F56609BGFP#30 application, or R5F56609BGFP#30 equivalent, key selection criteria include its 144-pin LFQFP (PLQP0144KA-B) package, G-version temperature rating, integrated FPU, ELC-based event-driven peripheral coordination, and CAN FD compliance with extended frame support.
Technical Context
The R5F56609BGFP#30 implements the RXv3 CPU core with single-cycle instruction execution, IEEE 754-compliant single-precision FPU, and 16-register bank save for fast context switching. Its clock system combines an 8–24 MHz main oscillator (PLL-referenced), 32.768 kHz sub-clock, and selectable on-chip oscillators (LOCO/HOCO/IWDT-dedicated), enabling independent domain clocking: ICLK up to 120 MHz, PCLKA up to 120 MHz, PCLKB up to 60 MHz, and ADCLK up to 60 MHz.
Peripheral coordination is managed via the Event Link Controller (ELC), supporting 83 internal event signals for interrupt-free inter-module triggering - e.g., MTU3a PWM edge events initiating S12ADH conversion or REMCa pattern matches activating GPIO state changes on ports B/E. Safety features include MPU (8 regions, 16-byte granularity), Trusted Memory (TM) for code flash protection, and hardware CRC (CRCA) with configurable polynomials for 8-/32-bit data.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv3 32-bit, 120 MHz max, 709 CoreMark, IEEE 754 FPU, 113 instructions including DSP ops |
| Memory | 1 MB code flash (no-wait @120 MHz), 32 KB data flash (100k write cycles), 128 KB SRAM (no-wait) |
| ADC/DAC | 24-channel 12-bit S12ADH (0.9 µs min conv.), dual 12-bit R12DAb (0–AVCC0 output, comparator reference capable) |
| Timers & PWM | MTU3a (9 channels, complementary PWM w/ dead-time auto-insertion), TMRb (4×8-bit), CMT/CMTW (8×16/32-bit) |
| Communication | CAN FD (1 ch, ISO 11898-1:2015), 13× SCI (async/sync/SmartCard/SPI/I²C), 2× RIIC (400 kbps), 1× RSPId (30 Mbps), 1× REMCa |
| Package & Temp | 144-pin LFQFP (PLQP0144KA-B, 20×20 mm, 0.5 mm pitch), G-version: –40°C to +105°C |
| Power & Safety | 2.7–5.5 V supply, 4 low-power modes, MPU, TM, CRCA, CAC, DOCA, register write protection, IEC60730 support |
Pinout & Package
Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 × 20 mm body, 0.5 mm lead pitch, exposed thermal pad, RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, AVCC0 | Core & analog power supply | 2.7–5.5 V digital supply; AVCC0 = 3.0–5.5 V analog reference, must be ≥ VCC |
| VSS, AVSS | Digital & analog ground | Separate grounding required for noise-sensitive analog circuits (ADC/DAC/RTC) |
| XTAL, EXTAL | Main clock oscillator interface | Connects to 8–24 MHz crystal; enables PLL for 120 MHz system clock generation |
| XT1, XT2 | Sub-clock oscillator interface | Connects to 32.768 kHz crystal; required for RTC operation in R5F56609BGFP#30 |
| RES# | Active-low reset input | Asynchronous hardware reset; drives internal POR/LVD logic when pulled low |
| MD0, MD1 | Mode setting pins | Select boot mode (single-chip, SCI/FINE boot, user boot) at power-on reset release |
| PE0–PE15, PF0–PF15, etc. | General-purpose I/O ports | 130 GPIOs total; 4 pins 5-V tolerant; all support pull-up, open-drain, and programmable drive strength |
| TXD0, RXD0, etc. | SCI serial interface | Up to 13 SCI channels; SCIk supports async/sync/SmartCard/SPI/I²C; SCIm includes 16-byte FIFOs |
| CANFD_TX, CANFD_RX | CAN FD physical layer interface | Differential pair for ISO 11898-1:2015 compliant CAN FD communication (standard/extended frames) |
| AD00–AD23 | Analog input channels | 24 dedicated ADC inputs; support self-diagnosis and analog disconnection detection |
| DA0, DA1 | Digital-to-analog outputs | Two 12-bit voltage outputs (0–AVCC0); usable as precision reference for CMPC comparators |
| RTC_CLK, RTC_ALM | Real-time clock interface | RTC_CLK connects to sub-clock oscillator; RTC_ALM provides alarm output signal |
Key Features
| Feature | Design Value |
|---|---|
| Event Link Controller (ELC) | Enables 83 internal event sources to trigger peripheral actions (e.g., MTU edge → ADC start) without CPU intervention or ISR overhead |
| Complementary PWM with Dead-Time Control | MTU3a hardware auto-inserts non-overlapping dead times for 3-phase inverter gate driving, eliminating software timing risks |
| Trusted Memory (TM) Protection | Prevents external read-out of critical firmware in designated code flash regions while allowing CPU instruction fetch only |
| IEC60730 Class B Support | Includes oscillation-stop detection, RAM test assist (DOC), CRC calculator (CRCA), clock accuracy monitor (CAC), and register write protection |
| Background Operation (BGO) | Permits concurrent flash programming/erasing (code/data flash) while CPU executes application code from other memory regions |
Applications
| Industrial Motor Control | Automotive Body Electronics |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC/PMSM motors in HVAC compressors or industrial pumps. IC Role / Device Role / Timing Role: Main controller executing FOC algorithms via RXv3+FPU, generating synchronized complementary PWM via MTU3a, sampling current/voltage via S12ADH, and managing CAN FD diagnostics. Use Value: Hardware dead-time insertion and ELC-triggered ADC sampling ensure precise, jitter-free commutation timing at 120 MHz system clock speed. | Use Scenario: Central body control module managing door locks, lighting, window lifts, and sensor fusion in 12 V automotive systems. IC Role / Device Role / Timing Role: System host MCU interfacing with LIN slaves (via SCIh), CAN FD network (body domain), analog sensors (temp, position), and PWM-controlled LED drivers. Use Value: Dual 12-bit DACs provide stable reference voltages for analog comparators monitoring battery voltage and cabin temperature thresholds. |
| Smart Energy Gateway | Factory Automation PLC I/O Module |
Use Scenario: Edge gateway aggregating data from smart meters (via RSPI/SCI), running TLS stack, and reporting over cellular/Wi-Fi via external host. IC Role / Device Role / Timing Role: Secure host processor with TM-protected bootloader, CRCA-accelerated packet integrity, RTC-timestamped logging, and REMCa IR remote interface for local commissioning. Use Value: 128 KB SRAM enables concurrent protocol stacks (Modbus TCP, MQTT), while 1 MB flash accommodates field-upgradable firmware images. | Use Scenario: Distributed I/O terminal with analog input conditioning, digital isolation, and real-time EtherCAT slave communication. IC Role / Device Role / Timing Role: Real-time peripheral coordinator using ELC to synchronize S12ADH sampling with EtherCAT cycle timing, while MTU3a generates precise PWM for valve actuation. Use Value: PCLKB-synchronized 60 MHz ADC clock ensures deterministic sampling aligned to EtherCAT distributed clocks, meeting <1 µs jitter requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F56608BDFP#30 | Same RX660 Group, 100-pin LFQFP (PLQP0100KB-B), 512 KB code flash, 17-channel ADC, single DAC channel, no sub-clock oscillator | Lacks RTC and sub-clock support; reduced I/O count (90 pins) and peripheral channel count (e.g., fewer SCI/MTU channels) | Select when board space is constrained and RTC/CAN FD + dual DAC are not required; lower cost for simpler control tasks. |
| R5F566T9BDFP#30 | Same 144-pin package and flash/SRAM capacity, but D-version (–40°C to +85°C), no CAN FD module, includes JTAG interface | Missing CAN FD PHY support; targets non-automotive industrial applications where extended temp and CAN FD are unnecessary | Choose for cost-sensitive, non-automotive designs needing full peripheral set except CAN FD; JTAG simplifies debug in development. |
Compared with R5F56608BDFP#30 and R5F566T9BDFP#30, the R5F56609BGFP#30 uniquely delivers CAN FD + RTC + dual DAC + extended temperature in a single 144-pin package - essential for automotive-grade gateways and high-integrity motor controllers requiring time-stamped diagnostics and analog reference stability.
Availability
R5F56609BGFP#30 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, smart energy gateways, and factory automation PLC I/O modules requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for R5F56609BGFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX660 Group, including R5F56609BGFP#30, was designed for high-performance, functional-safety-aware embedded control in demanding industrial and automotive applications - emphasizing real-time determinism, security, and mixed-signal integration.
FAQ
What is the maximum operating frequency and CoreMark score of the R5F56609BGFP#30?
The R5F56609BGFP#30 operates at a maximum frequency of 120 MHz and achieves 709 CoreMark performance under benchmark conditions. This reflects the efficiency of its RXv3 CPU core with single-cycle instruction execution, on-chip FPU, and optimized memory subsystem enabling zero-wait-state access to both 1 MB code flash and 128 KB SRAM at full speed.
Does the R5F56609BGFP#30 support CAN FD, and what standard does it comply with?
Yes, the R5F56609BGFP#30 integrates a CAN FD module compliant with ISO 11898-1:2015, supporting both standard and extended frame formats. It enables data rates up to 5 Mbps in the FD data phase, with built-in message filtering, TX/RX FIFOs, and error handling - making it suitable for automotive diagnostic and high-bandwidth industrial networks.
What package type and thermal specifications apply to the R5F56609BGFP#30?
The R5F56609BGFP#30 uses the PLQP0144KA-B package: a 144-pin LFQFP with 20 × 20 mm body, 0.5 mm pitch, and exposed thermal pad. It is rated for the G-version operating temperature range of –40°C to +105°C, validated for use in under-hood automotive and industrial environments with high ambient thermal stress.
How many ADC and DAC channels does the R5F56609BGFP#30 include, and what are their key specs?
The R5F56609BGFP#30 includes one 12-bit S12ADH ADC with 24 input channels (0.9 µs minimum conversion time at 60 MHz ADCLK) and two 12-bit R12DAb DAC channels (0–AVCC0 output). Both DAC outputs can serve as precision reference voltages for the four-channel CMPC analog comparators, enabling threshold monitoring without external components.
Is the real-time clock (RTC) functional on the R5F56609BGFP#30, and what oscillator does it require?
Yes, the RTC is fully functional on the R5F56609BGFP#30 and requires the 32.768 kHz sub-clock oscillator (SOSC), connected via XT1/XT2 pins. The device includes RTC alarm, periodic, and carry interrupts, time-capture on up to three pins, and calendar/binary counting modes - all supported by the G-version temperature rating for reliable long-term timekeeping in industrial gateways.
R5F56609BGFP#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- -
- Series:
- *
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- -
- Core Size:
- -
- Speed:
- -
- Connectivity:
- -
- Peripherals:
- -
- Number of I/O:
- -
- Program Memory Size:
- -
- Program Memory Type:
- -
- EEPROM Size:
- -
- RAM Size:
- -
- Voltage - Supply (Vcc/Vdd):
- -
- Data Converters:
- -
- Oscillator Type:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
R5F56609BGFP#30 FAQ
1.How can I place an order for R5F56609BGFP#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56609BGFP#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56609BGFP#30 reliable?
The price and inventory of R5F56609BGFP#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56609BGFP#30 is usually 5 days.
3.What payment methods are accepted for R5F56609BGFP#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56609BGFP#30 transactions.
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R5F56609BGFP#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56609BGFP#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56609BGFP#30?
For technical support, including R5F56609BGFP#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56609BGFP#30 requirements.
6.How does Aetrix verify that R5F56609BGFP#30 is sourced from the original manufacturer or authorized distributors?
All R5F56609BGFP#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56609BGFP#30 meets industry standards.
7.What is the process for return or replacement of R5F56609BGFP#30?
All R5F56609BGFP#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56609BGFP#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56609BGFP#30 part is unused and in its original packaging.
Return procedure for R5F56609BGFP#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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