Renesas R5F56609CGFM#30

Overview

R5F56609CGFM#30 from Renesas is a 32-bit RXv3 microcontroller with 120 MHz maximum operating frequency, 1 Mbyte on-chip code flash, 128 Kbytes SRAM, and integrated CAN FD, 12-bit A/D and D/A converters, RTC, and remote control signal receiver - deployed in industrial motor control and automotive body electronics requiring deterministic real-time response and IEC 60730 compliance.

For engineers reviewing the R5F56609CGFM#30 datasheet, R5F56609CGFM#30 pinout, R5F56609CGFM#30 application, or R5F56609CGFM#30 equivalent, key selection considerations include its 144-pin LFQFP (PLQP0144KA-B) package, G-grade temperature range (–40°C to +105°C), dual D/A output capability, sub-clock oscillator support for RTC, and JTAG/FINE debug interface availability.

Technical Context

The R5F56609CGFM#30 implements the RXv3 CPU core with single-precision FPU compliant with IEEE 754, supporting 709 CoreMark at 120 MHz and collective register bank save for fast interrupt handling. Its clock system integrates main (8–24 MHz crystal), sub (32.768 kHz), and on-chip oscillators (LOCO/HOCO/IWDT-dedicated), with independent PLL and fine-grained peripheral clock domain control (ICLK up to 120 MHz, PCLKA/B/D at up to 120/60/60 MHz).

It features hardware-assisted safety functions including MPU (8 regions), Trusted Memory (TM) for code protection, CRC calculator (CRCA) with selectable polynomials, clock accuracy measurement (CAC), and register write protection - all aligned with IEC 60730 Class B requirements. The ELC enables event-driven inter-module coordination without CPU intervention, critical for low-latency motor timing and sensor data acquisition.

Key Specifications

Pinout & Package

Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 × 20 mm body, 0.5 mm pitch, exposed thermal pad, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F56608CGFM#30, the R5F56609CGFM#30 provides double flash capacity and RTC support; compared with R5F56609CDFM#30, it adds high-temp operation, JTAG, and 42 additional I/O pins - making it optimal for demanding industrial and automotive designs requiring scalability and debug robustness.

Availability

R5F56609CGFM#30 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, IEC 60730-certified appliances, and smart energy metering applications requiring stable component supply across long product lifecycles.

Supply support for R5F56609CGFM#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX660 Group - including the R5F56609CGFM#30 - was designed for high-performance, safety-conscious embedded applications demanding real-time determinism, rich analog integration, and functional safety certification support.

FAQ

What is the maximum operating frequency and core architecture of the R5F56609CGFM#30?

The R5F56609CGFM#30 operates at a maximum frequency of 120 MHz using the 32-bit RXv3 CPU core with single-precision floating-point unit (FPU) compliant with IEEE 754. It achieves 709 CoreMark performance and supports collective register bank save for low-latency interrupt handling - essential for real-time motor control and safety-critical tasks executed by the R5F56609CGFM#30.

Does the R5F56609CGFM#30 support CAN FD, and what standard does it comply with?

Yes, the R5F56609CGFM#30 integrates one CAN FD module compliant with ISO 11898-1:2015, supporting both standard and extended frames at data rates up to 5 Mbps. This capability is confirmed in the official Renesas datasheet R01DS0393EJ0100 and enables high-bandwidth communication in automotive and industrial networks - a core feature of the R5F56609CGFM#30.

What package type and pin count does the R5F56609CGFM#30 use?

The R5F56609CGFM#30 uses a 144-pin Low-profile Quad Flat Package (LFQFP) designated PLQP0144KA-B, measuring 20 × 20 mm with 0.5 mm pitch and an exposed thermal pad. This package supports 130 general-purpose I/O pins (with JTAG and sub-clock oscillator enabled), 5-V tolerant inputs, and open-drain outputs - defining the physical interface of the R5F56609CGFM#30.

Is the R5F56609CGFM#30 qualified for automotive or industrial temperature ranges?

Yes, the R5F56609CGFM#30 is rated for the G-grade industrial temperature range of –40°C to +105°C, making it suitable for under-hood automotive applications, factory automation controllers, and outdoor energy infrastructure. This specification is explicitly stated in Table 1.1 of the R01DS0393EJ0100 datasheet and applies to the R5F56609CGFM#30 part number.

Does the R5F56609CGFM#30 include hardware support for IEC 60730 functional safety compliance?

Yes, the R5F56609CGFM#30 includes dedicated hardware for IEC 60730 Class B compliance: memory protection unit (MPU), Trusted Memory (TM), CRC calculator (CRCA), clock accuracy measurement circuit (CAC), independent watchdog timer (IWDT) with windowing, register write protection, and oscillation-stop detection. These features are documented in Section 1.1 and Chapter 27 of the R01DS0393EJ0100 datasheet for the R5F56609CGFM#30.