Renesas R5F56609DDFN#30

Overview

R5F56609DDFN#30 from Renesas is a 32-bit RXv3 core microcontroller operating at up to 120 MHz, delivering 709 CoreMark performance. It integrates 1 Mbyte of on-chip code flash memory with zero-wait-state access, 128 Kbytes of SRAM, 32 Kbytes of reprogrammable data flash (100,000 erase/write cycles), and supports CAN FD, 12-bit A/D and D/A converters, RTC, and hardware FPU for embedded industrial control applications.

For engineers reviewing the R5F56609DDFN#30 datasheet, R5F56609DDFN#30 pinout, R5F56609DDFN#30 application, or R5F56609DDFN#30 equivalent, key selection considerations include its 144-pin LFQFP package (PLQP0144KA-B), 2.7–5.5 V single-supply operation, –40°C to +85°C temperature grade (D-version), and integrated safety features for IEC60730 compliance including MPU, Trusted Memory, and independent watchdog timer.

Technical Context

The R5F56609DDFN#30 implements the RXv3 CPU core with 32-bit architecture, IEEE 754-compliant single-precision FPU, and collective register bank save for fast context switching. Its clock system combines an 8–24 MHz external main oscillator, 32.768 kHz sub-clock, and selectable internal oscillators (LOCO/HOCO/IWDT-dedicated) with PLL multiplication to achieve 120 MHz ICLK.

Peripheral integration includes a 1-channel CAN FD controller compliant with ISO 11898-1:2015, 13 SCI channels supporting asynchronous, SPI/I²C emulation, 2 RIIC interfaces (400 kbps Fast Mode), 1 RSPI (30 Mbps), 24-channel 12-bit S12ADH ADC with self-diagnosis, and 2-channel 12-bit R12DAb DAC usable as comparator reference voltage.

Key Specifications

Pinout & Package

Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 × 20 mm body, 0.5 mm pitch, exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56608DDFK#30 and R5F56607DDFK#30, the R5F56609DDFN#30 offers maximum peripheral integration-including dual DAC, full JTAG debug, sub-clock oscillator for RTC, and 1 Mbyte flash-making it optimal for feature-rich industrial controllers where board space permits the 144-pin LFQFP.

Availability

R5F56609DDFN#30 is available at Aetrix Electronics and suitable for industrial automation, smart metering, and automotive body electronics requiring stable component supply, long lifecycle assurance, and IEC60730-certifiable firmware execution.

Supply support for R5F56609DDFN#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.

The RX660 Group, including R5F56609DDFN#30, is engineered for high-reliability industrial control applications demanding real-time performance, functional safety support (IEC60730), and rich analog/motor control peripherals in a single chip.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F56609DDFN#30?

The R5F56609DDFN#30 operates at a maximum system clock frequency of 120 MHz and achieves 709 CoreMark performance under benchmark conditions. This reflects deterministic real-time execution capability enabled by the RXv3 CPU core's 113-instruction set, collective register bank save, and zero-wait-state 1 Mbyte flash memory-critical for time-critical industrial control loops and motor drive algorithms executed on the R5F56609DDFN#30.

Does the R5F56609DDFN#30 support CAN FD, and what standard does it comply with?

Yes, the R5F56609DDFN#30 integrates one CAN FD module compliant with ISO 11898-1:2015, supporting both standard and extended frames with bit rates up to 5 Mbps in FD mode. The module includes dedicated message RAM, error counters, and loopback/self-test modes-enabling robust fieldbus communication in industrial automation and automotive subsystems built around the R5F56609DDFN#30.

What are the memory resources available on the R5F56609DDFN#30?

The R5F56609DDFN#30 provides 1 Mbyte of on-chip code flash memory with no-wait-state access at 120 MHz, 128 Kbytes of SRAM (also no-wait), and 32 Kbytes of data flash memory rated for 100,000 program/erase cycles. These resources support complex firmware with real-time OS, secure boot, and field-upgradable parameters-all implemented directly on the R5F56609DDFN#30 without external memory.

Is the R5F56609DDFN#30 qualified for industrial temperature range and what package does it use?

Yes, the R5F56609DDFN#30 is rated for the industrial temperature range of –40°C to +85°C (D-version) and uses the 144-pin LFQFP package designated PLQP0144KA-B (20 × 20 mm, 0.5 mm pitch). This package includes an exposed thermal pad and supports high-density PCB layouts common in programmable logic controllers and factory automation equipment where the R5F56609DDFN#30 is deployed.

What safety and reliability features does the R5F56609DDFN#30 include for IEC60730 compliance?

The R5F56609DDFN#30 includes MPU (8-region memory protection), Trusted Memory (TM) for flash code protection, CRC calculator (CRCA), clock accuracy measurement circuit (CAC), data operation circuit (DOCA), register write protection, and independent watchdog timer (IWDT) with window function-all documented in Renesas' IEC60730 compliance guidance. These features collectively enable self-test, fault detection, and safe state recovery required for Class B certification, making the R5F56609DDFN#30 suitable for safety-critical firmware execution.