Renesas R5F56609DDFP#30

Overview

R5F56609DDFP#30 from Renesas is a 32-bit RXv3 microcontroller designed for industrial and automotive control applications requiring high reliability, real-time responsiveness, and functional safety support. It operates at up to 120 MHz, integrates 1 Mbyte of code flash memory, 128 Kbytes of SRAM, 32 Kbytes of data flash, a 12-bit A/D converter (24 channels), CAN FD interface, and supports IEC60730-compliant self-diagnostic functions.

For engineers reviewing the R5F56609DDFP#30 datasheet, R5F56609DDFP#30 pinout, R5F56609DDFP#30 application, or R5F56609DDFP#30 equivalent, key selection considerations include its 144-pin LFQFP package (PLQP0144KA-B), D-version temperature range (–40°C to +85°C), integrated FPU, ELC event-linking capability, and dual-channel 12-bit D/A converter usable as comparator reference voltage.

Technical Context

The R5F56609DDFP#30 implements the RXv3 CPU core with single-precision IEEE 754 floating-point unit, collective register bank save, and MPU-based memory protection. Its clock system combines an 8–24 MHz external main oscillator, 32.768 kHz sub-clock, and selectable on-chip oscillators (LOCO/HOCO/IWDT-dedicated), enabling precise timing control across multiple domains (ICLK up to 120 MHz, PCLKA up to 120 MHz, PCLKB up to 60 MHz, ADCLK up to 60 MHz).

Peripheral integration includes MTU3a (9-channel 16/32-bit timer with complementary PWM), DMACAa (8-channel DMA), DTCb (1-channel data transfer controller), ELC (83 internal event signals), and safety-critical modules: CAC for clock accuracy monitoring, CRCA for CRC generation, DOCA for data operation integrity, and register write protection - all supporting IEC60730 Class B compliance.

Key Specifications

Pinout & Package

Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 × 20 mm body, 0.5 mm lead pitch, exposed thermal pad, RoHS compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F56609DDFP#30, R5F56608DDFP#30 reduces flash capacity without altering peripheral count or performance, while R5F56609GDFP#30 maintains full functionality at higher junction temperatures - both share identical pinout, debug interface, and safety module implementation.

Availability

R5F56609DDFP#30 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, smart energy metering, and factory automation I/O modules requiring stable component supply across multi-year production cycles.

Supply support for R5F56609DDFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX660 Group, including R5F56609DDFP#30, was designed for real-time industrial control and automotive body applications demanding functional safety, high analog integration, and deterministic event-driven operation - with emphasis on IEC60730 compliance and CAN FD connectivity.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F56609DDFP#30?

The R5F56609DDFP#30 operates at a maximum frequency of 120 MHz and achieves 709 CoreMark in benchmark testing. This performance stems from the RXv3 CPU core's optimized pipeline, single-cycle instruction execution, and integrated 32-bit multiplier/divider - enabling real-time deterministic response in motor control and industrial automation applications where R5F56609DDFP#30 serves as the primary computation engine.

Does the R5F56609DDFP#30 support CAN FD, and what standard does it comply with?

Yes, the R5F56609DDFP#30 includes one CAN FD module compliant with ISO 11898-1:2015 for both standard and extended frames. It supports data rates up to 5 Mbps in the data phase and includes built-in message filtering, FIFO buffering, and error handling - making R5F56609DDFP#30 suitable for modern automotive networks and high-speed industrial fieldbus replacements requiring greater bandwidth than classical CAN.

What safety features does the R5F56609DDFP#30 include for IEC60730 compliance?

The R5F56609DDFP#30 integrates multiple hardware safety features for IEC60730 Class B compliance: oscillation-stoppage detection, A/D converter self-diagnosis and analog input disconnection detection, clock frequency accuracy measurement circuit (CAC), CRC calculator (CRCA), data operation circuit (DOCA), and register write protection. These features are implemented in silicon and require no external components - allowing R5F56609DDFP#30 to meet safety requirements in white goods, industrial controls, and medical auxiliary systems.

What is the package type and thermal specification of the R5F56609DDFP#30?

The R5F56609DDFP#30 uses a 144-pin LFQFP package designated PLQP0144KA-B: 20 × 20 mm body, 0.5 mm lead pitch, with exposed thermal pad. It is rated for the D-version operating temperature range of –40°C to +85°C, making it suitable for industrial control cabinets and automotive cabin applications. The package supports reflow soldering per JEDEC J-STD-020 and provides adequate thermal dissipation for continuous 120 MHz operation under typical board layout conditions.

How does the Event Link Controller (ELC) function in the R5F56609DDFP#30?

The Event Link Controller (ELC) in the R5F56609DDFP#30 enables 83 internal peripheral events (e.g., timer overflow, A/D completion, CAN message reception) to directly trigger actions in other modules - such as starting an A/D conversion upon MTU compare match or capturing a timer value on an external interrupt - without CPU involvement. This hardware interconnect reduces interrupt latency, lowers CPU load, and allows R5F56609DDFP#30 to maintain real-time determinism even in low-power sleep modes.