Renesas R5F56609DGFN#10

Overview

R5F56609DGFN#10 from Renesas Electronics is a 32-bit RXv3 core microcontroller operating at up to 120 MHz, delivering 709 CoreMark performance. It integrates 1 MB code flash, 128 KB SRAM, 32 KB data flash, CAN FD (ISO 11898-1:2015), 12-bit A/D and D/A converters, RTC with sub-clock support, and operates from 2.7–5.5 V in industrial temperature range (–40°C to +105°C). It targets real-time control in motor drives, industrial automation, and safety-compliant embedded systems.

For engineers reviewing the R5F56609DGFN#10 datasheet, R5F56609DGFN#10 pinout, R5F56609DGFN#10 application, or R5F56609DGFN#10 equivalent, key selection criteria include its 144-pin LFQFP (PLQP0144KA-B) package, integrated FPU, IEC60730-ready safety features (MPU, CAC, DOC, CRCA), dual 12-bit DACs usable as comparator references, and ELC-enabled event-driven low-power operation without CPU intervention.

Technical Context

The R5F56609DGFN#10 implements the RXv3 CPU core with single-cycle instruction execution, 32×32→64-bit multiplier, 32/32→32 divider, barrel shifter, and IEEE 754-compliant single-precision FPU. Its clock system supports independent domain scaling: ICLK up to 120 MHz for CPU, PCLKA up to 120 MHz for MTU3a/RSPI/SCI10–11, PCLKB up to 60 MHz for TMR/CMT/CMTW/RIIC, and PCLKD up to 60 MHz for S12ADH.

It features a hierarchical power management architecture with four low-power modes (sleep, all-module clock stop, software standby, deep software standby), module stop control, and deep software standby with RTC running on sub-clock oscillator. The ELC enables 83 internal event signals to trigger peripheral operations-including MTU3a PWM generation, A/D conversion starts, and port output state changes-without CPU involvement or interrupt latency.

Key Specifications

Pinout & Package

Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 mm × 20 mm body, 0.5 mm lead pitch, exposed pad (thermal enhancement), RoHS compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56609DGFN#10, R5F56608DGFN#10 reduces code density headroom without affecting real-time performance or safety capability, while R5F566T9DGFN#10 trades one SCI for USB-altering system-level connectivity architecture rather than computational capability.

Availability

R5F56609DGFN#10 is available at Aetrix Electronics and suitable for industrial motor control, factory automation PLCs, and automotive body electronics requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F56609DGFN#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.

The RX660 Group, including R5F56609DGFN#10, is engineered for real-time deterministic control in safety-critical industrial systems-integrating high-performance RXv3 core, comprehensive functional safety features, and rich analog/peripheral sets optimized for motor drives and automation.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F56609DGFN#10?

The R5F56609DGFN#10 operates at a maximum frequency of 120 MHz and achieves 709 CoreMark performance under benchmark conditions. This reflects its RXv3 CPU core efficiency, including single-cycle instruction execution, 32×32→64-bit multiplier, and IEEE 754-compliant FPU-all confirmed in the official R01DS0393EJ0100 datasheet Rev.1.00.

Does the R5F56609DGFN#10 support CAN FD, and what standard does it comply with?

Yes, the R5F56609DGFN#10 includes one CAN FD module compliant with ISO 11898-1:2015 for both standard and extended frames. It supports data rates up to 5 Mbps in FD mode and maintains full backward compatibility with classical CAN 2.0B, as specified in the RX660 Group datasheet section 1.1 and Table 1.1.

What package type and pin count does the R5F56609DGFN#10 use?

The R5F56609DGFN#10 uses a 144-pin LFQFP package designated PLQP0144KA-B: 20 mm × 20 mm body, 0.5 mm lead pitch, with exposed thermal pad. It provides 130 general-purpose I/O pins, including 4 with 5-V tolerance, as documented in Table 1.2 and package outline diagrams in R01DS0393EJ0100 Rev.1.00.

How many channels of 12-bit A/D and D/A converters does the R5F56609DGFN#10 integrate?

The R5F56609DGFN#10 integrates one 12-bit A/D converter (S12ADH) with 24 input channels and two 12-bit D/A converter channels (R12DAb). Both DAC outputs can serve as reference voltages for the 4-channel analog comparator (CMPC), as confirmed in the "Analog" section of Table 1.1 and footnote 2 on page 9 of R01DS0393EJ0100.

Is the R5F56609DGFN#10 qualified for extended temperature operation, and what is its grade?

Yes, the R5F56609DGFN#10 is the G-version device, rated for operation from –40°C to +105°C. This extended temperature qualification is explicitly stated in Table 1.1 (page 9) and applies to all RX660 Group devices with part numbers ending in "G", ensuring reliability in demanding industrial and automotive under-hood environments.