Renesas R5F56609DGFP#30

Overview

R5F56609DGFP#30 from Renesas is a 32-bit RXv3 core microcontroller operating at up to 120 MHz, featuring 1 Mbyte on-chip code flash, 128 Kbytes SRAM, 32 Kbytes data flash, CAN FD interface, 12-bit A/D and D/A converters, RTC with sub-clock oscillator support, and 134 general-purpose I/O pins in a 144-pin LFQFP package. It targets industrial control, motor drive, and safety-critical embedded systems requiring IEC60730 compliance.

For engineers reviewing the R5F56609DGFP#30 datasheet, R5F56609DGFP#30 pinout, R5F56609DGFP#30 application, or R5F56609DGFP#30 equivalent, key selection considerations include its 120-MHz RXv3 CPU with FPU, dual 12-bit DAC outputs usable as comparator references, 24-channel 12-bit ADC with self-diagnosis, CAN FD channel compliant with ISO 11898-1:2015, and deep software standby mode with RTC persistence.

Technical Context

The R5F56609DGFP#30 implements the RXv3 CPU core with single-precision IEEE 754 FPU, 16 register banks for fast context switching, and memory protection unit (MPU) supporting eight configurable protection areas down to 16-byte granularity. Its clock system integrates main (8–24 MHz crystal), sub-clock (32.768 kHz), and on-chip oscillators (LOCO/HOCO/IWDT-dedicated), with independent PLL and frequency-division paths for ICLK (up to 120 MHz), PCLKA (120 MHz), PCLKB (60 MHz), and ADCLK (60 MHz).

Peripheral integration includes DMACAa (8-channel DMA), ELC for interrupt-free inter-module event linking (83 internal signals), MTU3a (9-channel multifunction timer with complementary PWM and dead-time control), and RIICa (2-channel I²C up to 400 kbps). The device supports off-board parallel programming and on-board BGO flash/data flash operations, with Trusted Memory (TM) enabling secure code execution from protected flash regions.

Key Specifications

Pinout & Package

Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 × 20 mm body, 0.5 mm pitch, exposed pad, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56609DGFP#30, R5F56608DGFP#30 offers identical performance and peripheral set at lower flash capacity and cost, while R5F56609DGFN#30 trades package size and debug capability for board space savings-neither is pin-compatible, requiring layout revision for substitution.

Availability

R5F56609DGFP#30 is available at Aetrix Electronics and suitable for industrial automation, motor control, and smart energy metering requiring stable component supply, long-term lifecycle assurance, and automotive-grade temperature range (–40°C to +105°C).

Supply support for R5F56609DGFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications, with over 40 years of microcontroller innovation.

The RX660 Group, including R5F56609DGFP#30, is engineered for high-reliability industrial control systems demanding real-time performance, functional safety (IEC60730), and rich analog/motor control peripherals in a single-chip solution.

FAQ

What is the maximum operating frequency and CPU architecture of the R5F56609DGFP#30?

The R5F56609DGFP#30 features a 32-bit RXv3 CPU core with hardware FPU, operating at a maximum frequency of 120 MHz. It achieves 709 CoreMark performance at this speed and supports little-endian or big-endian data arrangement. The core includes 16 general-purpose 32-bit registers, two 72-bit accumulators, and 113 instructions including DSP and floating-point operations-all confirmed in the R01DS0393EJ0100 datasheet Rev.1.00.

Does the R5F56609DGFP#30 support CAN FD, and what standard does it comply with?

Yes, the R5F56609DGFP#30 integrates one CAN FD module compliant with ISO 11898-1:2015, supporting both standard and extended frames at data rates up to 5 Mbps. This is explicitly stated in the "Features" section and Table 1.1 of the R01DS0393EJ0100 datasheet, and applies to all RX660 Group devices with CANFD in the part number suffix-including R5F56609DGFP#30.

What package type and pin count does the R5F56609DGFP#30 use?

The R5F56609DGFP#30 uses a 144-pin Low-profile Quad Flat Package (LFQFP) designated PLQP0144KA-B, measuring 20 × 20 mm with 0.5 mm pitch and an exposed thermal pad. This is confirmed in Table 1.1 (Page 9) and Table 1.2 (Page 10) of the R01DS0393EJ0100 datasheet, and distinguishes it from smaller-footprint variants like the 100-pin or 64-pin RX660 options.

How much on-chip memory does the R5F56609DGFP#30 include, and what are its access characteristics?

The R5F56609DGFP#30 includes 1 Mbyte of on-chip code flash memory with zero-wait-state access at 120 MHz, 128 Kbytes of SRAM (also zero-wait-state), and 32 Kbytes of data flash rated for 100,000 program/erase cycles. All memory blocks support background operation (BGO), enabling concurrent execution and reprogramming-details verified in Sections 1.1 and Table 1.1 of the R01DS0393EJ0100 datasheet.

Is the R5F56609DGFP#30 qualified for industrial temperature range, and what is its supply voltage range?

Yes, the R5F56609DGFP#30 is the G-version device, qualified for operation from –40°C to +105°C. Its supply voltage range is VCC = 2.7–5.5 V, with AVCC0 = 3.0–5.5 V (and AVCC0 ≥ VCC). Four I/O pins are 5-V tolerant, easing interface with legacy industrial sensors and actuators-specifications confirmed in Table 1.1 (Page 9) and Section 1.1 of the R01DS0393EJ0100 datasheet.