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Renesas R5F56609EDFP#30

Part No.:
R5F56609EDFP#30
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixR5F56609EDFP#30.pdf
Description:
IC MCU 32BIT 1MB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:270

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Product details

Overview

R5F56609EDFP#30 from Renesas is a 32-bit RXv3 microcontroller with 120 MHz maximum operating frequency, 1 MB on-chip code flash, 128 KB SRAM, and integrated CAN FD, 12-bit A/D and D/A converters, RTC, and remote control signal receiver - deployed in industrial HMI, motor control, and smart sensor nodes requiring deterministic real-time response and IEC 60730 compliance.

For engineers reviewing the R5F56609EDFP#30 datasheet, R5F56609EDFP#30 pinout, R5F56609EDFP#30 application, or R5F56609EDFP#30 equivalent, this page delivers verified specifications, package mapping to PLQP0144KA-B (144-pin LFQFP), functional pin roles, IEC60730-ready safety features, and validated alternative MCUs for migration or second-sourcing.

Technical Context

The R5F56609EDFP#30 implements the RXv3 CPU core with single-cycle instruction execution, IEEE 754-compliant FPU, 16 register banks for fast context switching, and MPU-based memory protection. It supports little- or big-endian data arrangement and executes 113 instructions including DSP and floating-point operations.

Its clock system integrates a 8–24 MHz main oscillator, 32.768 kHz sub-clock, and selectable on-chip oscillators (LOCO/HOCO/IWDT-dedicated), with independent PLL and frequency-division paths for ICLK (up to 120 MHz), PCLKA (120 MHz), PCLKB (60 MHz), PCLKD (60 MHz), FCLK (60 MHz), and BCLK (40 MHz) domains - enabling precise peripheral timing isolation.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core RXv3 32-bit, 120 MHz max, 709 CoreMark, IEEE 754 FPU, 16 register banks
Memory 1 MB code flash (no-wait @120 MHz), 32 KB data flash (100k erase cycles), 128 KB SRAM (no-wait)
Operating Voltage 2.7–5.5 V supply (VCC), 3.0–5.5 V analog (AVCC0), 5-V-tolerant I/O on 4 pins
Peripherals CAN FD (ISO 11898-1:2015), 13 SCI channels, 2 RIIC, 1 RSPI (30 Mbps), 24-channel 12-bit S12ADH, 2-channel 12-bit R12DAb
Timing & Safety RTC with sub-clock support, IWDT with window function, MPU (8 regions), Trusted Memory (TM), CAC, CRCA, DOCA, ELC
Package & Temp PLQP0144KA-B (144-pin LFQFP, 20 × 20 mm, 0.5 mm pitch), D-version (–40°C to +85°C)

Pinout & Package

Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 × 20 mm body, 0.5 mm pitch, exposed thermal pad, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
VCC, AVCC0 Power supply inputs Core/analog supply (2.7–5.5 V / 3.0–5.5 V); AVCC0 must be ≥ VCC for analog accuracy
RES#, RESET Reset input/output Active-low asynchronous reset; internal POR/LVD triggers release from reset state
MOSCXT1/2 Main crystal oscillator terminals Connects 8–24 MHz external crystal; enables PLL reference for 120 MHz system clock
SOSCIN/SOSCOUT Sub-clock oscillator terminals Connects 32.768 kHz crystal; required for RTC operation and low-power wake-up
TXD0/RXD0 SCI0 serial interface Asynchronous UART mode; supports LIN, smart-card, SPI/I²C emulation; ELC-triggerable
CTX0/CRX0 CAN FD channel 0 Differential CAN FD transceiver interface (ISO 11898-1:2015); supports standard/extended frames up to 5 Mbps

Key Features

Feature Design Value
IEC 60730 Class B Support Oscillation-stop detection, A/D self-diagnosis, RAM test assist (DOC), CRC calculator (CRCA), register write protection
Event Link Controller (ELC) 83 internal event signals; enables interrupt-free inter-module triggering (e.g., MTU → S12ADH start) in sleep modes
Low-Power Operation Four modes: Sleep, All-module clock stop, Software standby, Deep software standby (RTC active)
Background Programming Code/data flash programming/erasing during CPU operation (BGO); no code execution stall
Trusted Memory (TM) Hardware-enforced read protection for designated code flash region; only CPU fetch allowed when enabled

Applications

Industrial Motor Control Smart Sensor Node

Use Scenario: Closed-loop control of BLDC/PMSM motors with field-oriented control (FOC) and real-time current/voltage sensing.

IC Role / Device Role / Timing Role: Main controller executing FOC algorithm via FPU, synchronizing PWM (MTU3a), ADC sampling (S12ADH), and CAN FD feedback at ≤10 µs jitter.

Use Value: 120 MHz RXv3 core + 24-channel ADC + complementary PWM + dead-time compensation enables single-chip FOC without external co-processors.

Use Scenario: Battery-powered environmental sensor hub aggregating temperature, humidity, and vibration data with local edge analytics.

IC Role / Device Role / Timing Role: System-on-chip managing multi-sensor acquisition (S12ADH, CMPC, internal temp sensor), secure data logging (data flash), and CAN FD telemetry transmission.

Use Value: Deep software standby mode with RTC wake-up and 32 KB reprogrammable data flash allows >5-year battery life with periodic measurement bursts.

Human-Machine Interface (HMI) IEC 60730-Certified Appliance Control

Use Scenario: Touch-enabled front-panel controller for HVAC or kitchen appliances with display driver interface and button/keypad scanning.

IC Role / Device Role / Timing Role: Real-time UI processor handling capacitive touch (via S12ADH), LED/backlight PWM (MTU3a), serial display comms (RSPI/RIIC), and user input decoding.

Use Value: 134 GPIOs with 5-V tolerance, programmable pull-ups/opens-drain, and 16-byte FIFO SCIm simplify direct connection to diverse HMI peripherals without level shifters.

Use Scenario: Safety-critical control unit in washing machines or refrigerators requiring runtime self-test and fault recovery per IEC 60730 Class B.

IC Role / Device Role / Timing Role: Certified safety monitor executing RAM tests (DOC), clock accuracy checks (CAC), A/D disconnection detection, and IWDT windowed refresh.

Use Value: Integrated MPU, TM, CRCA, and register write protection eliminate need for external safety monitors - reducing BOM and certification effort.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
R5F56608EDFP#30 Same RX660 Group, identical package and pinout, but 512 KB code flash (vs. 1 MB) and no CAN FD module Suitable for cost-sensitive applications omitting CAN FD and requiring <512 KB firmware footprint Select when CAN FD is unnecessary and flash budget is ≤512 KB; retains all other peripherals and safety features
R5F56519EDFP#30 RX650 Group MCU, same 144-pin LFQFP package, 100 MHz max, no FPU, no CAN FD, 768 KB flash, 96 KB SRAM Lower performance tier targeting non-FPU, non-CAN FD industrial control where 120 MHz and floating-point are not required Choose for legacy RX650 ecosystem compatibility or where reduced cost outweighs 120 MHz/FPU/CAN FD benefits

Compared with R5F56609EDFP#30, R5F56608EDFP#30 offers identical real-time capability and safety features at lower flash capacity and no CAN FD, while R5F56519EDFP#30 trades 20 MHz speed, FPU, and CAN FD for lower cost and mature RX650 toolchain support - making each viable for distinct design constraints.

Availability

R5F56609EDFP#30 is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, and IEC 60730-certified appliance designs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F56609EDFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX660 Group - including R5F56609EDFP#30 - is engineered for high-reliability industrial automation and appliance control, integrating real-time performance, functional safety features, and mixed-signal integration to reduce system complexity.

FAQ

What is the maximum operating frequency and core architecture of the R5F56609EDFP#30?

The R5F56609EDFP#30 operates at up to 120 MHz using the 32-bit RXv3 CPU core, delivering 709 CoreMark performance. It includes a single-precision IEEE 754 FPU, 16 register banks for fast context save/restore, and support for both little- and big-endian data arrangement - enabling deterministic real-time execution in demanding control applications.

Does the R5F56609EDFP#30 support CAN FD, and what standard does it comply with?

Yes, the R5F56609EDFP#30 integrates a CAN FD module compliant with ISO 11898-1:2015, supporting both standard and extended frames at data rates up to 5 Mbps. This enables high-bandwidth, deterministic communication in industrial networks and automotive subsystems where legacy CAN 2.0B is insufficient.

What package type and pin count does the R5F56609EDFP#30 use?

The R5F56609EDFP#30 uses the PLQP0144KA-B package: a 144-pin Low-profile Quad Flat Package with 20 × 20 mm body size, 0.5 mm pitch, and exposed thermal pad. It provides 130 general-purpose I/O pins (with JTAG and sub-clock oscillator enabled), 4 of which are 5-V tolerant.

How does the R5F56609EDFP#30 support IEC 60730 Class B compliance?

The R5F56609EDFP#30 includes hardware features essential for IEC 60730 Class B: oscillation-stop detection, A/D converter self-diagnosis and disconnection detection, clock frequency accuracy measurement (CAC), CRC calculator (CRCA), RAM test assist (DOC), and register write protection - all documented in Renesas' functional safety manual R01US0424EJ0100.

What are the key low-power modes supported by the R5F56609EDFP#30?

The R5F56609EDFP#30 supports four low-power modes: Sleep mode (CPU stopped, peripherals active), All-module clock stop mode (all clocks halted except LSI), Software standby mode (main clock stopped, sub-clock running), and Deep software standby mode (only RTC and LSI active) - enabling ultra-low quiescent current for battery-operated systems.

R5F56609EDFP#30 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
100-LQFP
Series:
RX600
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
RXv3
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
90
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 24x12b; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F56609EDFP#30 FAQ

1.How can I place an order for R5F56609EDFP#30 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F56609EDFP#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F56609EDFP#30 reliable?

The price and inventory of R5F56609EDFP#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56609EDFP#30 is usually 5 days.

3.What payment methods are accepted for R5F56609EDFP#30?

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4.How is shipping managed for R5F56609EDFP#30?

R5F56609EDFP#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F56609EDFP#30 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F56609EDFP#30?

For technical support, including R5F56609EDFP#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56609EDFP#30 requirements.

6.How does Aetrix verify that R5F56609EDFP#30 is sourced from the original manufacturer or authorized distributors?

All R5F56609EDFP#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56609EDFP#30 meets industry standards.

7.What is the process for return or replacement of R5F56609EDFP#30?

All R5F56609EDFP#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56609EDFP#30, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F56609EDFP#30 part is unused and in its original packaging.

Return procedure for R5F56609EDFP#30:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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