Renesas R5F56609EGFP#10
- Part No.:
- R5F56609EGFP#10
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
R5F56609EGFP#10.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 100LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,664
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R5F56609EGFP#10 from Renesas Electronics is a 32-bit RXv3 core microcontroller operating at up to 120 MHz, delivering 709 CoreMark performance. It integrates 1 Mbyte of on-chip code flash (no-wait access), 128 Kbytes of SRAM, 32 Kbytes of reprogrammable data flash, CAN FD interface compliant with ISO 11898-1:2015, and a 12-bit A/D converter with 24 channels - deployed in industrial motor control and automotive body electronics requiring deterministic real-time response and functional safety support.
For engineers reviewing the R5F56609EGFP#10 datasheet, R5F56609EGFP#10 pinout, R5F56609EGFP#10 application, or R5F56609EGFP#10 equivalent, key selection considerations include its G-grade temperature range (–40°C to +105°C), 144-pin LFQFP package with 130 general-purpose I/O pins (4 with 5-V tolerance), integrated FPU for floating-point math, and hardware-accelerated safety features including MPU, CRC calculator (CRCA), and clock frequency accuracy measurement (CAC) for IEC 60730 compliance.
Technical Context
The R5F56609EGFP#10 implements the RXv3 CPU core with 113 instructions, including single-precision IEEE 754-compliant FPU, barrel shifter, and 32×32→64-bit multiplier. Its clock system supports independent domain scaling: ICLK up to 120 MHz for CPU execution, PCLKA up to 120 MHz for high-speed peripherals (MTU3a, RSPI), PCLKB up to 60 MHz for timers and communication interfaces, and ADCLK up to 60 MHz for the S12ADH A/D converter.
Peripheral integration centers on event-driven architecture via the Event Link Controller (ELC), enabling 83 internal event signals to trigger module operations (e.g., MTU3a PWM start, A/D conversion trigger, RTC time capture) without CPU intervention - critical for low-latency deterministic control in deep software standby mode, where selected modules remain active while CPU clocks are halted.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv3 32-bit, 120 MHz max, 709 CoreMark, IEEE 754 FPU, 16 register banks |
| Memory | 1 Mbyte code flash (no-wait @120 MHz), 128 Kbyte SRAM (no-wait), 32 Kbyte data flash (100k erase cycles) |
| Analog Peripherals | 12-bit S12ADH A/D converter (24 channels, 0.9 µs min conversion), 12-bit R12DAb D/A (2 channels), 4-channel CMPC comparator |
| Communication | CAN FD (1 channel, ISO 11898-1:2015), 13 SCI channels (asynchronous/smart-card/SPI/I²C modes), 2 RIIC (400 kbps), 1 RSPI (30 Mbps) |
| Timers & Control | MTU3a (9 channels, complementary PWM, dead-time control), TMRb (4×8-bit), CMT/CMTW (8×16/2×32-bit), IWDT with window function |
| Package & Environment | 144-pin LFQFP (PLQP0144KA-B, 20×20 mm, 0.5 mm pitch), G-grade (–40°C to +105°C), 2.7–5.5 V supply |
| Safety Features | MPU (8 regions), Trusted Memory (TM), CRCA (8/32-bit CRC), CAC, DOCA, register write protection, oscillation-stop detection |
Pinout & Package
Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 mm × 20 mm, 0.5 mm pitch, exposed thermal pad, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 | Power supply input | Core/analog supply (2.7–5.5 V); AVCC0 must be ≥ VCC and within 3.0–5.5 V for A/D/D/A operation |
| RES# | Active-low reset input | Asynchronous hardware reset; drives internal POR/LVD logic when pulled low |
| XTAL / EXTAL | Main clock oscillator terminals | Connects to 8–24 MHz crystal; enables PLL reference for 120 MHz system clock |
| RTCXTAL / RTCXTAL | Sub-clock oscillator terminals | Connects to 32.768 kHz crystal; required for RTCC operation and deep software standby RTC continuity |
| TXD0 / RXD0 | SCI0 asynchronous serial I/O | Full-duplex UART interface; supports LIN protocol and auto-baud detection via ELC-linked TMR |
| CTX0 / CRX0 | CAN FD channel 0 differential I/O | Compliant with ISO 11898-1:2015 physical layer; supports FD frames up to 5 Mbps |
| AD00–AD23 | Analog input channels | 24 dedicated pins for S12ADH; each configurable for scan/group priority and sampling time |
| DA0 / DA1 | D/A converter outputs | 2×12-bit voltage outputs (0–AVCC0); usable as reference inputs for CMPC comparators |
| POE0#–POE11# | Port output enable controls | Five dedicated pins (POE0#, POE4#, POE8#, POE10#, POE11#) initiate MTU3a waveform pin high-Z state on fault |
| TCK / TDI / TDO / TMS | JTAG debug interface | IEEE 1149.1-compliant boundary-scan and emulation; supports full-speed debugging at 120 MHz |
Key Features
| Feature | Design Value |
|---|---|
| Event Link Controller (ELC) | Enables 83 internal event sources (e.g., timer overflow, A/D completion, CAN message reception) to directly trigger peripheral actions without CPU ISR overhead - reducing latency and power in sleep modes |
| Trusted Memory (TM) | Locks instruction fetch from designated code flash regions (TM target area), preventing external read-out while allowing CPU execution - essential for secure firmware IP protection |
| Complementary PWM with Dead-Time Control | MTU3a generates non-overlapping gate drive waveforms for 3-phase inverters with programmable dead-time insertion and automatic synchronization across multiple channels |
| IEC 60730 Safety Support | Integrated hardware blocks (CAC, CRCA, DOCA, oscillation-stop detection, RAM test assist) reduce software certification burden for Class B appliance control applications |
| Background Operation (BGO) | Code/data flash programming and erasing occur concurrently with CPU execution - enabling field firmware updates without halting real-time control tasks |
Applications
| Industrial Motor Drive | Automotive Body Control Module |
|---|---|
Use Scenario: Closed-loop vector control of 3-phase BLDC/PMSM motors in HVAC compressors and industrial pumps. IC Role / Device Role / Timing Role: Main controller executing FOC algorithm, generating synchronized PWM via MTU3a, sampling current/voltage via S12ADH, and managing CAN FD diagnostics. Use Value: 120 MHz RXv3 core with FPU delivers real-time torque calculation; complementary PWM with hardware dead-time ensures safe inverter switching; 105°C rating supports under-hood deployment. | Use Scenario: Centralized lighting, wiper, door lock, and seat position control in passenger vehicles. IC Role / Device Role / Timing Role: System-on-chip managing LIN slave nodes, CAN FD communication with gateway, analog sensor inputs (temperature, position), and PWM dimming drivers. Use Value: Integrated CAN FD and 13 SCI channels eliminate external transceivers; 5-V tolerant I/O interfaces directly with legacy automotive sensors; G-grade temp range meets OEM requirements. |
| Smart Energy Metering | Factory Automation PLC I/O Module |
Use Scenario: DIN-rail mounted electricity meter with harmonic analysis, tamper detection, and HES communication. IC Role / Device Role / Timing Role: High-accuracy metrology processor acquiring voltage/current via S12ADH, computing RMS/power via TFU, and reporting via RSPI-connected RF modem. Use Value: 12-bit A/D with self-diagnostic and disconnection detection ensures metrology reliability; CRCA and CAC validate clock integrity for time-stamped billing data; 1 Mbyte flash stores dual firmware images. | Use Scenario: Distributed I/O terminal collecting digital/analog sensor data and driving solenoids/valves in modular PLC systems. IC Role / Device Role / Timing Role: Real-time I/O coordinator using ELC to link A/D triggers to MTU3a timestamping, RSPI to backplane bus, and DTC for high-speed sensor data transfer. Use Value: Deep software standby with RTC running enables wake-on-event; 130 GPIO pins support mixed 24 V DC and 5 V logic interfaces; data flash stores calibration coefficients with 100k-cycle endurance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F56608EGFP#10 | Same RX660 Group, identical 144-pin LFQFP package and peripheral set, but with 512 Kbyte code flash instead of 1 Mbyte | Suitable for cost-sensitive designs with smaller firmware footprint; retains all safety and timing features | Select when application firmware fits within 512 Kbyte and BOM cost optimization is prioritized over future scalability |
| R5F566T9ADFP#30 | Same RX660 Group, 100-pin LFQFP (PLQP0100KB-B), 1 Mbyte flash, but only 88 GPIO, no JTAG, and single D/A channel | Targeted for space-constrained, lower-I/O-count applications where JTAG debug is not required | Choose for compact PCB layouts where 100-pin footprint and reduced debug capability are acceptable trade-offs |
Compared with R5F56609EGFP#10, R5F56608EGFP#10 offers identical performance and safety features at lower memory capacity, while R5F566T9ADFP#30 reduces pin count and debug interface to shrink form factor - neither is pin-compatible, but both share the same RXv3 toolchain, peripheral register map, and safety certification baseline.
Availability
R5F56609EGFP#10 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, and smart energy metering requiring stable component supply, long-term lifecycle assurance, and functional safety qualification.
Supply support for R5F56609EGFP#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX660 Group, including R5F56609EGFP#10, is engineered for real-time deterministic control in safety-critical applications - integrating hardware safety accelerators, high-precision analog, and flexible connectivity to meet IEC 60730 Class B and ISO 26262 ASIL-B readiness requirements.
FAQ
What is the maximum operating frequency and CoreMark score of the R5F56609EGFP#10?
The R5F56609EGFP#10 operates at a maximum frequency of 120 MHz and achieves 709 CoreMark performance. This benchmark reflects its RXv3 CPU core efficiency with single-cycle instruction execution, 32×32→64-bit hardware multiplier, and integrated FPU - validated per R01DS0393EJ0100 Rev.1.00. The R5F56609EGFP#10 sustains this speed with zero wait states on both 1 Mbyte code flash and 128 Kbyte SRAM.
Does the R5F56609EGFP#10 support CAN FD, and what standard does it comply with?
Yes, the R5F56609EGFP#10 integrates one CAN FD module compliant with ISO 11898-1:2015, supporting both standard and extended frames at data rates up to 5 Mbps. It includes hardware message filtering, FIFO buffering, and error counters - fully documented in Section 38 of the R01DS0393EJ0100 datasheet. The R5F56609EGFP#10 requires external CAN transceivers for physical layer interfacing.
What is the operating temperature range and package type of the R5F56609EGFP#10?
The R5F56609EGFP#10 is rated for –40°C to +105°C (G-version) and housed in a 144-pin LFQFP package designated PLQP0144KA-B - 20 mm × 20 mm, 0.5 mm pitch, with exposed thermal pad. This package supports 130 general-purpose I/O pins, four of which are 5-V tolerant, and includes dedicated JTAG and FINE debug interfaces as confirmed in Table 1.2 of R01DS0393EJ0100.
How many A/D and D/A converter channels does the R5F56609EGFP#10 provide?
The R5F56609EGFP#10 features a single 12-bit S12ADH A/D converter with 24 input channels and two independent 12-bit R12DAb D/A converter channels. Both analog peripherals operate with hardware self-diagnostic capabilities and support background operation triggered by ELC events. The R5F56609EGFP#10's D/A outputs can serve as reference voltages for its four-channel CMPC analog comparators.
What safety features does the R5F56609EGFP#10 include for IEC 60730 compliance?
The R5F56609EGFP#10 includes hardware-accelerated safety features for IEC 60730 Class B: memory protection unit (MPU), Trusted Memory (TM), CRC calculator (CRCA), clock frequency accuracy measurement circuit (CAC), data operation circuit (DOCA), oscillation-stoppage detection, and register write protection. These are explicitly listed in Section 1.1 "Useful functions for IEC60730 compliance" of R01DS0393EJ0100, enabling reduced software certification effort for R5F56609EGFP#10-based appliances.
R5F56609EGFP#10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-LQFP
- Series:
- RX600
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv3
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 90
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b; D/A 2x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56609EGFP#10 FAQ
1.How can I place an order for R5F56609EGFP#10 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56609EGFP#10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56609EGFP#10 reliable?
The price and inventory of R5F56609EGFP#10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56609EGFP#10 is usually 5 days.
3.What payment methods are accepted for R5F56609EGFP#10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56609EGFP#10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F56609EGFP#10?
R5F56609EGFP#10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56609EGFP#10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56609EGFP#10?
For technical support, including R5F56609EGFP#10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56609EGFP#10 requirements.
6.How does Aetrix verify that R5F56609EGFP#10 is sourced from the original manufacturer or authorized distributors?
All R5F56609EGFP#10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56609EGFP#10 meets industry standards.
7.What is the process for return or replacement of R5F56609EGFP#10?
All R5F56609EGFP#10 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56609EGFP#10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56609EGFP#10 part is unused and in its original packaging.
Return procedure for R5F56609EGFP#10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R5F56609EGFP#10 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

