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Renesas R5F56609FDFB#30
- Part No.:
- R5F56609FDFB#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R5F56609FDFB#30.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:240
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Product details
Overview
R5F56609FDFB#30 from Renesas is a 32-bit RXv3 core MCU operating at up to 120 MHz, featuring 1 Mbyte on-chip code flash, 128 Kbytes SRAM, 32 Kbytes data flash, CAN FD interface (ISO 11898-1:2015), and integrated 12-bit A/D and D/A converters. It targets industrial control systems requiring real-time responsiveness, functional safety compliance (IEC60730), and mixed-signal processing in extended temperature environments.
For engineers reviewing the R5F56609FDFB#30 datasheet, R5F56609FDFB#30 pinout, R5F56609FDFB#30 application, or R5F56609FDFB#30 equivalent, key selection considerations include its 144-pin LFQFP (PLQP0144KA-B) package, dual D/A output capability, sub-clock oscillator support for RTC operation, JTAG/FINE debug interfaces, and full peripheral set including MTU3a, ELC, and Trusted Memory (TM) protection.
Technical Context
The R5F56609FDFB#30 implements the RXv3 CPU core with single-cycle instruction execution, IEEE 754-compliant FPU, and 16 register banks for fast context switching. Its clock system integrates main (8–24 MHz crystal), sub (32.768 kHz), and on-chip oscillators (LOCO/HOCO/IWDT-dedicated), with independent PLL and frequency-division paths for ICLK (up to 120 MHz), PCLKA (120 MHz), PCLKB (60 MHz), and ADCLK (60 MHz).
Peripheral coordination is managed via the Event Link Controller (ELC), enabling 83 internal event signals to trigger module operations-including MTU3a PWM generation, S12ADH conversion starts, and CMPC comparisons-without CPU intervention, even during sleep modes. Safety features include MPU (8 regions), CRC calculator (CRCA), CAC, DOCA, and register write protection for IEC60730 Class B compliance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv3 32-bit core with 709 CoreMark @ 120 MHz; supports little/big endian, FPU, and collective register bank save |
| Max Operating Frequency | 120 MHz system clock (ICLK); enables real-time deterministic response in motor control and PLC applications |
| Memory | 1 Mbyte code flash (no-wait @ 120 MHz), 128 Kbytes SRAM (no-wait), 32 Kbytes data flash (100k erase/write cycles) |
| Analog Peripherals | 24-channel 12-bit S12ADH ADC (0.9 µs min conversion), 2-channel 12-bit R12DAb DAC (0–AVCC0 output), 4-channel CMPC |
| Communication | 1-channel CAN FD (ISO 11898-1:2015), 13 SCI channels (async/sync/SmartCard/SPI/I²C), 2 RIIC, 1 RSPI (30 Mbps), 1 REMC |
| Package & Temp | 144-pin LFQFP (PLQP0144KA-B, 20 × 20 mm, 0.5 mm pitch); D-version: –40°C to +85°C |
| Power Supply | Single 2.7–5.5 V supply; AVCC0 = 3.0–5.5 V; supports 5-V tolerant I/O (4 pins) |
Pinout & Package
Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 × 20 mm body, 0.5 mm pitch, exposed thermal pad (non-electrical), RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 | Main and analog power supply | Accepts 2.7–5.5 V; AVCC0 must be ≥ VCC and within 3.0–5.5 V for analog accuracy |
| RES# | Active-low reset input | Drives hardware reset; internal pull-up; compatible with open-drain reset supervisors |
| XTAL / EXTAL | Main clock oscillator terminals | Connects to 8–24 MHz crystal; enables PLL reference for 120 MHz ICLK generation |
| RTCXTAL / RTCXTAL | Sub-clock oscillator terminals | Connects to 32.768 kHz crystal; required for RTCC operation and deep software standby RTC continuity |
| TMS / TDI / TDO / TCK | JTAG debug interface | Enables boundary scan, flash programming, and real-time debugging per IEEE 1149.1 |
| MD0 / MD1 | Mode setting pins | Determine boot mode (single-chip, SCI, FINE, user boot) at power-on reset |
Key Features
| Feature | Design Value |
|---|---|
| Trusted Memory (TM) | Protects code flash segments against external read-out; enables secure firmware IP protection in TM target area |
| Event Link Controller (ELC) | Links 83 internal events (e.g., timer match, ADC end) to peripheral actions without CPU wake-up or ISR overhead |
| MTU3a PWM with Dead-Time Control | Generates non-overlapping complementary PWM waveforms for 3-phase inverter control with programmable dead time |
| IEC60730 Safety Support | Includes oscillation-stop detection, RAM test assist (DOC), self-diagnostic ADC, CAC, CRCA, and register write protection |
| Remote Control Signal Receiver (REMC) | Detects NEC/RC-5 protocols with 4-pattern matching (header/data0/data1/special) and 8-byte FIFO per channel |
Applications
| Industrial PLC Controllers | Motor Drive Inverters |
|---|---|
Use Scenario: Compact programmable logic controllers managing discrete I/O, motion sequencing, and fieldbus communication in factory automation. IC Role / Device Role / Timing Role: Central controller executing ladder logic, coordinating CAN FD fieldbus, sampling analog sensors via S12ADH, and generating PWM via MTU3a. Use Value: Integrated 120 MHz RXv3 core, 1 Mbyte flash, and ELC enable deterministic cycle times <1 ms while reducing external component count. | Use Scenario: 3-phase AC motor drives requiring precise gate timing, current sensing, thermal monitoring, and safety-critical fault handling. IC Role / Device Role / Timing Role: Real-time motor control unit running FOC algorithms, generating complementary PWM with dead-time compensation, and monitoring phase currents via ADC. Use Value: MTU3a's synchronous PWM update, 12-bit DAC for comparator reference, and IEC60730-certified diagnostics ensure safe, high-fidelity torque control. |
| Building Energy Management Systems | Medical Diagnostic Equipment Interfaces |
Use Scenario: HVAC controllers integrating temperature/humidity sensing, fan speed regulation, valve actuation, and BACnet/IP gateway functions. IC Role / Device Role / Timing Role: Mixed-signal hub managing 12-bit ADC inputs, 12-bit DAC outputs for analog setpoints, RTC-based scheduling, and CAN FD communication to field devices. Use Value: On-chip RTC with sub-clock oscillator, 5-V tolerant I/O for legacy sensor interfacing, and low-power software standby extend battery life in wireless nodes. | Use Scenario: Portable diagnostic devices (e.g., ultrasound front-ends, patient monitors) requiring precise analog signal conditioning and low-noise data acquisition. IC Role / Device Role / Timing Role: Signal acquisition processor digitizing sensor outputs via S12ADH, filtering with DOCA, storing waveform data in SRAM, and transmitting over RSPI or RIIC. Use Value: 128 Kbytes zero-wait SRAM enables real-time buffering of multi-channel ADC streams; CRCA ensures data integrity in safety-critical data paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F56608FDFB#30 | Same RX660 Group, identical 144-pin LFQFP package and peripherals, but 512 Kbyte code flash instead of 1 Mbyte | Suitable where firmware size <512 KB; no change in pinout, timing, or driver compatibility | Select when application firmware fits in 512 KB and cost optimization is prioritized over future scalability |
| R5F56609FDFA#30 | Same die and feature set, but in 100-pin LFQFP (PLQP0100KB-B); reduced I/O count (88 vs. 130), no sub-clock oscillator, single D/A channel | Used in space-constrained designs where RTC and dual DAC are not required | Choose only if board layout mandates smaller footprint and sub-clock/RTC functionality is omitted from system design |
Compared with R5F56609FDFB#30, R5F56608FDFB#30 offers identical performance and peripheral integration at lower flash capacity-ideal for mature firmware-while R5F56609FDFA#30 trades package size and RTC/DAC capability for compactness, requiring PCB redesign and firmware adaptation for missing features.
Availability
R5F56609FDFB#30 is available at Aetrix Electronics and suitable for industrial PLC controllers, motor drive inverters, building energy management systems, and medical diagnostic equipment interfaces requiring stable component supply across long production lifecycles.
Supply support for R5F56609FDFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX660 Group is designed for high-performance, functional-safety-aware industrial applications-emphasizing real-time determinism, mixed-signal integration, and IEC60730 compliance in extended temperature environments.
FAQ
What is the maximum operating frequency and core architecture of the R5F56609FDFB#30?
The R5F56609FDFB#30 features a 32-bit RXv3 CPU core with a maximum operating frequency of 120 MHz, achieving 709 CoreMark. It supports single-cycle instruction execution, IEEE 754-compliant floating-point operations, and collective register bank save for fast interrupt response. This performance level makes the R5F56609FDFB#30 suitable for demanding real-time control tasks in industrial automation and motor drives.
Does the R5F56609FDFB#30 support CAN FD, and what standard does it comply with?
Yes, the R5F56609FDFB#30 integrates a CAN FD module compliant with ISO 11898-1:2015, supporting both standard and extended frames. It operates at data rates up to 5 Mbps in FD mode and maintains backward compatibility with classical CAN. The R5F56609FDFB#30 uses this interface for high-bandwidth fieldbus communication in industrial networks and automotive subsystems requiring deterministic messaging.
What are the memory resources available on the R5F56609FDFB#30?
The R5F56609FDFB#30 includes 1 Mbyte of on-chip code flash memory (no-wait access at 120 MHz), 128 Kbytes of SRAM (no-wait), and 32 Kbytes of reprogrammable data flash rated for 100,000 erase/write cycles. These resources support complex firmware with real-time OS, secure boot, and field-upgradable parameters-all without external memory. The R5F56609FDFB#30 also provides a 12-byte unique ID for device authentication and traceability.
How does the R5F56609FDFB#30 support functional safety standards like IEC60730?
The R5F56609FDFB#30 includes multiple hardware features for IEC60730 Class B compliance: oscillation-stop detection, self-diagnostic ADC, clock frequency accuracy measurement circuit (CAC), CRC calculator (CRCA), data operation circuit (DOCA), register write protection, and memory protection unit (MPU). These capabilities enable runtime verification of critical subsystems. When implemented per Renesas' safety manual, the R5F56609FDFB#30 supports certified safety functions in household appliances and industrial controls.
What package type and pin count does the R5F56609FDFB#30 use, and is it RoHS compliant?
The R5F56609FDFB#30 is housed in a 144-pin Low-profile Quad Flat Package (LFQFP) with type code PLQP0144KA-B: 20 × 20 mm body, 0.5 mm pitch, and exposed thermal pad. It is RoHS compliant and rated for industrial temperature range (–40°C to +85°C). This package supports full peripheral access-including JTAG, CAN FD, 13 SCI channels, and 130 general-purpose I/O pins-with 4 pins rated for 5-V tolerance.
R5F56609FDFB#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RX600
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv3
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 132
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b; D/A 2x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56609FDFB#30 FAQ
1.How can I place an order for R5F56609FDFB#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56609FDFB#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56609FDFB#30 reliable?
The price and inventory of R5F56609FDFB#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56609FDFB#30 is usually 5 days.
3.What payment methods are accepted for R5F56609FDFB#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56609FDFB#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F56609FDFB#30?
R5F56609FDFB#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56609FDFB#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56609FDFB#30?
For technical support, including R5F56609FDFB#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56609FDFB#30 requirements.
6.How does Aetrix verify that R5F56609FDFB#30 is sourced from the original manufacturer or authorized distributors?
All R5F56609FDFB#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56609FDFB#30 meets industry standards.
7.What is the process for return or replacement of R5F56609FDFB#30?
All R5F56609FDFB#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56609FDFB#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56609FDFB#30 part is unused and in its original packaging.
Return procedure for R5F56609FDFB#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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