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Renesas R5F56609FGFB#30

Part No.:
R5F56609FGFB#30
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixR5F56609FGFB#30.pdf
Description:
IC MCU 32BIT 1MB FLASH 144LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:178

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Product details

Overview

R5F56609FGFB#30 from Renesas is a 32-bit RXv3 core microcontroller operating at up to 120 MHz, delivering 709 CoreMark performance. It integrates 1 Mbyte of on-chip code flash memory with zero-wait-state access, 128 Kbytes of SRAM, 32 Kbytes of reprogrammable data flash (100,000 write cycles), and supports CAN FD, 12-bit A/D and D/A converters, RTC, and remote control signal reception. It targets industrial control systems requiring functional safety compliance per IEC 60730.

For engineers reviewing the R5F56609FGFB#30 datasheet, R5F56609FGFB#30 pinout, R5F56609FGFB#30 application, or R5F56609FGFB#30 equivalent, key selection criteria include its G-grade temperature range (–40°C to +105°C), 144-pin LFQFP package (PLQP0144KA-B), integrated FPU for single-precision IEEE 754 operations, ELC-based event-driven peripheral coordination, and hardware support for self-diagnostic functions including oscillation-stop detection and RAM test assistance.

Technical Context

The R5F56609FGFB#30 implements the RXv3 CPU core with 113 instructions, including 11 single-precision floating-point and 23 DSP instructions, and features a collective register bank save function across 16 banks. Its clock system includes a PLL with external 8–24 MHz crystal reference, sub-clock oscillator for RTC, and dedicated 120 kHz IWDT oscillator.

Peripheral integration centers on event-driven operation via the Event Link Controller (ELC), supporting 83 internal event signals for inter-module triggering without CPU intervention. The MCU provides dual-domain clocking: PCLKA (up to 120 MHz) for MTU3a and RSPI, PCLKB (up to 60 MHz) for TMRb/CMT/CMTW/SCI, and PCLKD (up to 60 MHz) for S12ADH - enabling precise timing isolation for mixed-criticality tasks.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreRXv3 32-bit core with 120 MHz max frequency and 709 CoreMark score
Memory1 Mbyte code flash (no-wait at 120 MHz), 128 Kbytes SRAM, 32 Kbytes data flash (100k erase/write cycles)
Analog Peripherals24-channel 12-bit A/D converter (0.9 µs min conversion), 2-channel 12-bit D/A converter, 4-channel analog comparator
CommunicationCAN FD (ISO 11898-1:2015), 13 SCI channels (async/sync/smart-card/SPI/I²C modes), 2 RIIC (400 kbps), 1 RSPI (30 Mbps), 1 REMC
Timers & ControlMTU3a (9 channels), TMRb (4×8-bit), CMT (4×16-bit), CMTW (2×32-bit), IWDT with window function, RTCC with time capture
Safety & DebugMPU (8 regions), Trusted Memory (TM), CRC calculator (CRCA), DOCA, CAC, JTAG/FINE interfaces, IEC 60730 self-test functions
Supply & Temp2.7–5.5 V VCC, AVCC0 = 3.0–5.5 V; G-version operating range: –40°C to +105°C

Pinout & Package

Package: 144-pin Low-profile Quad Flat Package (LFQFP), PLQP0144KA-B, 20 × 20 mm, 0.5 mm pitch, with 130 general-purpose I/O pins (including 4×5-V tolerant), JTAG interface, and sub-clock oscillator support.

Pin/TerminalCircuit RoleDesign Meaning
VCC / AVCC0Power supply inputsCore/analog supply (2.7–5.5 V); AVCC0 must be ≥ VCC and within 3.0–5.5 V for A/D/D/A operation
RES#Active-low reset inputHardware reset assertion; triggers nine distinct reset sources including POR, LVD, and deep software standby release
XTAL / EXTALMain clock oscillator terminalsConnects to 8–24 MHz crystal; enables PLL reference for 120 MHz system clock generation
RTCXTAL / RTCXTALSub-clock oscillator terminalsConnects to 32.768 kHz crystal; supplies clock to RTCC and enables calendar/time-capture functionality
TMS / TDI / TDO / TCKJTAG debug interfaceStandard 4-pin boundary-scan interface for full-speed debugging, programming, and trace; supports IEEE 1149.1
MTIOC0A / MTIOC0BMTU3a waveform outputComplementary PWM outputs with programmable dead-time insertion for 3-phase inverter control
ADTRG0 / ADTRG1A/D conversion trigger inputsAccept external or ELC-generated pulses to initiate S12ADH conversions without CPU involvement
REMC_INRemote control signal inputDedicated pin for NEC/RC-5 protocol reception; supports header/data pattern matching and 8-byte FIFO buffering

Key Features

FeatureDesign Value
Floating-point unit (FPU)IEEE 754-compliant single-precision arithmetic accelerates motor control and sensor fusion algorithms
Event Link Controller (ELC)Enables 83 internal event signals to trigger peripheral actions (e.g., timer start, A/D conversion) without CPU wake-up or ISR overhead
Trusted Memory (TM)Prevents unauthorized read-out of firmware stored in designated code flash areas while allowing CPU instruction fetch only
IEC 60730 Safety SupportIncludes hardware-assisted RAM test (via DOC), clock accuracy monitoring (CAC), oscillation-stop detection, and register write protection
Multi-domain clockingIndependent PCLKA/PCLKB/PCLKD domains allow concurrent high-speed (120 MHz) and low-jitter (60 MHz) peripheral operation

Applications

Industrial Motor DriveBuilding Automation Controller

Use Scenario: Closed-loop control of 3-phase BLDC/PMSM motors in HVAC compressors and pumps.

IC Role / Device Role / Timing Role: Main controller executing field-oriented control (FOC) using FPU-accelerated trigonometric calculations and synchronized PWM generation via MTU3a.

Use Value: Complementary PWM with automatic dead-time insertion and ELC-triggered A/D sampling ensure precise current sensing and torque ripple reduction.

Use Scenario: Centralized HVAC zone controller managing temperature, airflow, and damper actuation across multi-floor buildings.

IC Role / Device Role / Timing Role: System-on-chip integrating sensor acquisition (S12ADH), actuator control (R12DAb, MTU3a), CAN FD networking, and real-time scheduling (RTCC).

Use Value: Integrated 12-bit D/A outputs serve as precision reference voltages for analog comparators monitoring thermistor and CO₂ sensor signals.

Smart Energy MeterFactory Automation I/O Module

Use Scenario: DIN-rail mounted meter performing energy calculation, tamper detection, and secure communication over CAN FD or RS485.

IC Role / Device Role / Timing Role: Safety-certified host MCU handling metrology processing, cryptographic acceleration (via CRCA/DOCA), and secure firmware updates.

Use Value: Hardware CRC calculator (CRCA) and memory protection unit (MPU) enable certified IEC 61508 SIL2 compliance for fault detection and memory integrity.

Use Scenario: Distributed digital I/O module collecting sensor data and driving solenoids/relays in PLC-connected machinery.

IC Role / Device Role / Timing Role: Real-time I/O coordinator using ELC to synchronize 12-bit A/D sampling with CAN FD message transmission and GPIO state changes.

Use Value: Deep software standby mode maintains RTC operation while reducing power to 1.2 µA, enabling battery-backed logging during main power loss.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F56608FGFB#30Same RX660 Group, identical 144-pin LFQFP package and G-grade temp range, but with 512 Kbyte code flash instead of 1 MbyteLower firmware footprint requirements; suitable when application code size remains under 512 KB and cost optimization is prioritizedSelect when full 1 Mbyte flash is unnecessary and BOM cost sensitivity outweighs future firmware scalability needs
R5F566T9FGFB#30Same package and flash capacity, but adds TrustZone-based secure boot and cryptographic acceleration (AES/SHA/RSA) not present in R5F56609FGFB#30Required for applications needing secure firmware authentication, encrypted OTA updates, or TLS offload in edge gatewaysChoose when end-product security certification (e.g., PSA Level 2, SESIP) mandates hardware-enforced root-of-trust

Compared with R5F56609FGFB#30, R5F56608FGFB#30 reduces flash capacity by 50% without altering peripheral count or speed, while R5F566T9FGFB#30 extends security capabilities at the expense of higher unit cost and no additional real-time performance - making R5F56609FGFB#30 optimal for cost-sensitive, safety-critical industrial control where deterministic timing and IEC 60730 compliance are primary drivers.

Availability

R5F56609FGFB#30 is available at Aetrix Electronics and suitable for industrial motor drives, building automation controllers, smart energy meters, and factory automation I/O modules requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for R5F56609FGFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor manufacturer headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX660 Group, including R5F56609FGFB#30, was designed specifically for industrial automation applications demanding high computational throughput, functional safety certification (IEC 60730), and robust real-time peripheral coordination - with emphasis on motor control, sensor fusion, and deterministic communication.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F56609FGFB#30?

The R5F56609FGFB#30 operates at a maximum frequency of 120 MHz and achieves 709 CoreMark performance. This score reflects its RXv3 CPU core efficiency, including optimized instruction pipeline, collective register bank save, and integrated 32-bit multiplier/divider. The R5F56609FGFB#30 sustains this performance with zero-wait-state access to both 1 Mbyte code flash and 128 Kbytes SRAM at full speed.

Does the R5F56609FGFB#30 support CAN FD, and what standard does it comply with?

Yes, the R5F56609FGFB#30 includes one CAN FD module compliant with ISO 11898-1:2015, supporting both standard and extended frame formats. It enables data rates up to 5 Mbps in the FD data phase while maintaining backward compatibility with classical CAN networks. The R5F56609FGFB#30 implements hardware-based bit-rate switching and error confinement, essential for real-time industrial communication.

What are the analog capabilities of the R5F56609FGFB#30, particularly regarding A/D and D/A converters?

The R5F56609FGFB#30 integrates a 24-channel 12-bit A/D converter (S12ADH) with minimum 0.9 µs conversion time at 60 MHz ADCLK, and two independent 12-bit D/A converter channels (R12DAb) with output range 0 V to AVCC0. Critically, the R5F56609FGFB#30 allows either D/A channel to serve as a programmable reference voltage for its four-channel analog comparator (CMPC), enabling adaptive threshold detection in sensor interfaces.

How does the R5F56609FGFB#30 support functional safety standards like IEC 60730?

The R5F56609FGFB#30 provides hardware-level support for IEC 60730 Class B compliance, including oscillation-stoppage detection, self-diagnostic A/D input disconnection detection, clock frequency accuracy measurement (CAC), independent watchdog timer (IWDT) with window function, RAM test assistance via DOC, and register write protection. These features are documented in the R5F56609FGFB#30 datasheet and enable certified safety routines without requiring external components.

What package type and pin count does the R5F56609FGFB#30 use, and does it include JTAG debugging?

The R5F56609FGFB#30 uses a 144-pin Low-profile Quad Flat Package (LFQFP), designated PLQP0144KA-B (20 × 20 mm, 0.5 mm pitch), and includes full JTAG debugging support alongside the FINE one-wire interface. This package variant provides 130 general-purpose I/O pins, 4×5-V tolerant inputs, integrated sub-clock oscillator terminals, and all required JTAG signals (TMS, TDI, TDO, TCK) for boundary-scan and real-time trace.

R5F56609FGFB#30 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
144-LQFP
Series:
RX600
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
RXv3
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
132
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 24x12b; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F56609FGFB#30 FAQ

1.How can I place an order for R5F56609FGFB#30 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F56609FGFB#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F56609FGFB#30 reliable?

The price and inventory of R5F56609FGFB#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56609FGFB#30 is usually 5 days.

3.What payment methods are accepted for R5F56609FGFB#30?

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4.How is shipping managed for R5F56609FGFB#30?

R5F56609FGFB#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F56609FGFB#30 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F56609FGFB#30?

For technical support, including R5F56609FGFB#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56609FGFB#30 requirements.

6.How does Aetrix verify that R5F56609FGFB#30 is sourced from the original manufacturer or authorized distributors?

All R5F56609FGFB#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56609FGFB#30 meets industry standards.

7.What is the process for return or replacement of R5F56609FGFB#30?

All R5F56609FGFB#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56609FGFB#30, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F56609FGFB#30 part is unused and in its original packaging.

Return procedure for R5F56609FGFB#30:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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