Renesas R5F56609FGFP#30
- Part No.:
- R5F56609FGFP#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
R5F56609FGFP#30.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 100LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:267
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R5F56609FGFP#30 from Renesas is a 32-bit RXv3 core microcontroller operating at up to 120 MHz, delivering 709 CoreMark performance. It integrates 1 Mbyte of on-chip code flash (no-wait access), 128 Kbytes of SRAM, 32 Kbytes of reprogrammable data flash, and supports CAN FD, 12-bit A/D and D/A converters, RTC with sub-clock oscillator, and hardware-accelerated trigonometric functions. It targets industrial control systems requiring functional safety compliance (IEC60730) and deterministic real-time response.
For engineers reviewing the R5F56609FGFP#30 datasheet, R5F56609FGFP#30 pinout, R5F56609FGFP#30 application, or R5F56609FGFP#30 equivalent, key selection considerations include its 144-pin LFQFP package with 130 general-purpose I/O pins (4× 5-V tolerant), integrated memory protection unit (MPU), Trusted Memory (TM) support, and dual debugging interfaces (JTAG + FINE).
Technical Context
The R5F56609FGFP#30 implements the RXv3 CPU core with single-precision FPU compliant with IEEE 754, supporting little-endian or big-endian data arrangement and 113 instructions including DSP and floating-point operations. Its clock system combines an 8–24 MHz external main oscillator, 32.768 kHz sub-clock oscillator, and internal HOCO/LOCO oscillators, with independent PLL for system clock generation up to 120 MHz.
Peripheral integration includes a 1-channel CAN FD controller (ISO 11898-1:2015), 13 SCI channels (with FIFOs), 2 RIIC interfaces (400 kbps fast-mode), 1 RSPI (30 Mbps), 24-channel 12-bit S12ADH ADC with self-diagnosis, 4-channel CMPC analog comparators, and ELC-driven event-triggered operation across timers, ADC, and communication modules - enabling low-CPU-overhead deterministic execution in safety-critical environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv3 32-bit core with single-precision FPU, IEEE 754 compliant; enables real-time floating-point math without software emulation. |
| Max Operating Frequency | 120 MHz with no-wait code flash access; sustains full CoreMark throughput without pipeline stalls. |
| Memory | 1 Mbyte code flash, 128 Kbytes SRAM, 32 Kbytes data flash (100,000 write/erase cycles); supports background programming and Trusted Memory protection. |
| Analog Peripherals | 24-channel 12-bit ADC (0.9 µs conversion), 2-channel 12-bit DAC (0–AVCC0 output), 4-channel analog comparator with digital filtering. |
| Communication Interfaces | 1× CAN FD (ISO 11898-1:2015), 13× SCI (including FIFO-equipped SCIm), 2× RIIC (SMBus-capable), 1× RSPI (30 Mbps), 1× REMC remote control receiver. |
| Real-Time & Safety | RTC with sub-clock oscillator support, independent watchdog timer (IWDT) with window function, MPU (8 regions), CRCA, CAC, DOCA, and register write protection for IEC60730 Class B compliance. |
| Package & I/O | 144-pin LFQFP (PLQP0144KA-B, 20 × 20 mm, 0.5 mm pitch); 130 GPIOs with 5-V tolerance, open-drain, pull-up, and switchable drive strength. |
Pinout & Package
Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 × 20 mm body, 0.5 mm pitch, lead-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 | Power supply input | Core and analog supply (2.7–5.5 V); AVCC0 must be ≥ VCC and within 3.0–5.5 V for ADC/DAC operation. |
| RES# | Active-low reset input | Asynchronous hardware reset; low pulse ≥ 100 ns initiates power-on or external reset sequence. |
| CLKIN / CLKOUT | Main clock oscillator interface | Connects to 8–24 MHz crystal/resonator; CLKOUT provides buffered clock output for system timing distribution. |
| XTAL / EXTAL | Sub-clock oscillator interface | Connects to 32.768 kHz crystal; required for RTC operation and deep software standby mode retention. |
| MD0 / MD1 | Mode setting pins | Configure boot mode (single-chip, SCI/FINE boot, user boot) and endian selection at power-on reset. |
| TRST#, TDI, TDO, TMS, TCK | JTAG debug interface | IEEE 1149.1-compliant boundary-scan and debug access; supports full-speed on-chip debugging and flash programming. |
| FIQ | FINE debug interface | Single-wire debug channel for minimal-pin debugging and programming; complements JTAG in space-constrained designs. |
| TXD0 / RXD0 | SCI0 serial interface | Asynchronous UART interface; supports baud rates up to 15 Mbps with programmable sampling timing for noise immunity. |
| CAN_TX / CAN_RX | CAN FD physical layer interface | Differential bus signals compliant with ISO 11898-1:2015; supports data rates up to 5 Mbps in FD mode. |
| AD00–AD23 | Analog input channels | 24 dedicated ADC input pins; each supports programmable sampling time and disconnection detection for sensor monitoring. |
| DA0 / DA1 | Digital-to-analog outputs | 2× 12-bit voltage outputs (0–AVCC0); usable as reference inputs for CMPC comparators in closed-loop control. |
| PO00–PO129 | General-purpose I/O ports | 130 configurable GPIOs; 4 pins support 5-V tolerance for mixed-voltage interfacing; all support interrupt-on-change and ELC event triggering. |
Key Features
| Feature | Design Value |
|---|---|
| Trusted Memory (TM) | Enables instruction-only execution from protected code flash regions, preventing unauthorized read-out while allowing secure firmware updates. |
| Event Link Controller (ELC) | Routes 83 internal peripheral events (e.g., timer overflow, ADC completion) directly to target modules without CPU intervention - reducing latency and ISR overhead. |
| Memory Protection Unit (MPU) | Configurable 8-region protection (min. 16-byte granularity) for read/write/execute permissions - essential for partitioned RTOS and IEC60730 safety tasks. |
| Background Operation (BGO) | Allows concurrent flash programming/erasing and CPU execution; critical for over-the-air (OTA) firmware updates without system halt. |
| Hardware Trigonometric Unit (TFU) | Accelerates sine/cosine/arctangent calculations in fixed-point or floating-point domains - offloads motor control and signal processing workloads from CPU. |
| Deep Software Standby Mode | Reduces current consumption to <10 µA while maintaining RTC operation and RAM retention - ideal for battery-backed industrial logging applications. |
Applications
| Industrial PLC I/O Module | Automotive Body Control Unit (BCU) |
|---|---|
Use Scenario: Modular I/O expansion node in distributed control architecture, acquiring analog sensor data (temperature, pressure), driving solenoids via PWM, and communicating via CAN FD to central PLC. IC Role / Device Role / Timing Role: Central MCU managing real-time I/O scheduling, deterministic CAN FD messaging, and safety-critical watchdog supervision using IWDT and MPU-enforced task isolation. Use Value: Integrated 24-channel ADC, 2× DAC, 4× comparator, and MTU3a PWM with dead-time control eliminate external signal conditioning ICs and reduce BOM count by ≥3 components per module. | Use Scenario: Centralized body electronics controller managing door locks, lighting, wipers, and HVAC actuators in 12 V automotive systems. IC Role / Device Role / Timing Role: Real-time scheduler executing LIN and CAN FD protocols, monitoring switch inputs via 5-V-tolerant GPIOs, and generating precise PWM for LED dimming and motor speed control. Use Value: 130 GPIOs with configurable drive strength and 5-V tolerance simplify direct connection to legacy automotive sensors/actuators; built-in LVD and POR ensure robust operation across cold-crank and load-dump conditions. |
| Smart Energy Metering Gateway | Factory Automation Remote I/O Terminal |
Use Scenario: DIN-rail mounted gateway aggregating metering data from multiple smart meters via RS485/SCI, performing local tariff calculation, and uploading via Ethernet or cellular modem. IC Role / Device Role / Timing Role: Secure host processor running lightweight RTOS, executing CRC-32 checksums (CRCA), validating firmware signatures (TM), and managing time-stamped data logging with RTC and backup SRAM. Use Value: Hardware-accelerated CRC, CAC clock accuracy monitoring, and register write protection meet IEC62056 and IEC61000-4-30 requirements for metrology-grade data integrity and tamper resistance. | Use Scenario: IP67-rated remote I/O terminal deployed near machinery, collecting vibration, temperature, and position feedback via analog/digital inputs and controlling pneumatic valves via relay drivers. IC Role / Device Role / Timing Role: Deterministic edge controller executing predictive maintenance algorithms using TFU-accelerated FFT preprocessing and triggering high-speed ADC sampling via ELC-linked MTU3a timers. Use Value: 120 MHz RXv3 core with FPU and hardware TFU enables real-time spectral analysis at 10 kHz sample rates - eliminating need for external DSP co-processor and reducing latency to <50 µs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F56608FGFP#30 | Same RX660 Group, identical 144-pin LFQFP package and peripherals, but with 512 Kbyte code flash instead of 1 Mbyte. | Suitable for cost-sensitive designs where firmware footprint remains under 512 KB and no future feature expansion is planned. | Select when flash headroom is not required and BOM cost optimization is prioritized over field-upgrade flexibility. |
| R5F566T9FGFP#30 | Same package and memory configuration, but includes JTAG interface disabled and sub-clock oscillator omitted - verified in Renesas part numbering matrix. | Applicable where RTC functionality is unnecessary and debug access is limited to FINE only; reduces test complexity in high-volume production. | Choose when RTC and JTAG are unused, enabling simplified layout and lower test overhead without sacrificing core compute or peripheral capability. |
Compared with R5F56609FGFP#30, R5F56608FGFP#30 offers identical performance and I/O but halves code flash capacity, while R5F566T9FGFP#30 removes RTC and JTAG - both serve as validated alternatives for specific footprint, cost, or debug constraints without altering core architecture or peripheral compatibility.
Availability
R5F56609FGFP#30 is available at Aetrix Electronics and suitable for industrial automation, automotive body electronics, and smart energy metering applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for R5F56609FGFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.
The RX660 Group, including R5F56609FGFP#30, was designed for functional-safety-critical industrial control applications demanding high computational throughput, integrated safety features (MPU, IWDT, CAC), and rich connectivity (CAN FD, RSPI, RIIC) in extended temperature environments.
FAQ
What is the maximum operating frequency and CoreMark score of the R5F56609FGFP#30?
The R5F56609FGFP#30 operates at a maximum frequency of 120 MHz and achieves 709 CoreMark points under benchmark conditions. This performance is sustained with zero-wait-state access to its 1 Mbyte on-chip code flash memory, enabling deterministic real-time execution without instruction fetch bottlenecks. The RXv3 CPU core includes hardware multiplier, divider, barrel shifter, and single-precision FPU - all contributing to the measured CoreMark result.
Does the R5F56609FGFP#30 support CAN FD, and what standard does it comply with?
Yes, the R5F56609FGFP#30 integrates a single-channel CAN FD module compliant with ISO 11898-1:2015, supporting both standard and extended frame formats. It enables data rates up to 5 Mbps in FD mode and maintains full backward compatibility with classical CAN 2.0B. The module includes dedicated message RAM, error counters, and loopback self-test modes - all accessible via the CANFD peripheral registers defined in the R01DS0393EJ0100 datasheet for R5F56609FGFP#30.
What package type and pin count does the R5F56609FGFP#30 use?
The R5F56609FGFP#30 uses a 144-pin Low-profile Quad Flat Package (LFQFP) with designation PLQP0144KA-B: 20 × 20 mm body size, 0.5 mm pitch, and lead-free RoHS-compliant construction. This package provides 130 general-purpose I/O pins, including 4 pins with 5-V tolerance, and supports JTAG and FINE debugging interfaces - as confirmed in Table 1.2 and package dimension diagrams of the R01DS0393EJ0100 datasheet for R5F56609FGFP#30.
How many analog-to-digital and digital-to-analog converter channels does the R5F56609FGFP#30 include?
The R5F56609FGFP#30 includes one 12-bit S12ADH analog-to-digital converter with 24 input channels and two 12-bit R12DAb digital-to-analog converter channels. The ADC supports self-diagnosis, analog input disconnection detection, and programmable sampling time per channel. The DAC outputs (DA0/DA1) can serve as reference voltages for the 4-channel CMPC analog comparators - all features explicitly documented for the R5F56609FGFP#30 in Section 1.1 and Table 1.1 of R01DS0393EJ0100.
Is the R5F56609FGFP#30 qualified for extended temperature operation, and what is its grade?
Yes, the R5F56609FGFP#30 is rated for the G-version industrial temperature range of –40°C to +105°C, as specified in Table 1.1 of the R01DS0393EJ0100 datasheet. This qualification applies to the full peripheral set, including flash memory, SRAM, ADC, DAC, and CAN FD operation - making it suitable for under-hood automotive, factory floor, and outdoor industrial deployments where thermal resilience is mandatory for R5F56609FGFP#30-based designs.
R5F56609FGFP#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-LQFP
- Series:
- RX600
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv3
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 90
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b; D/A 2x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56609FGFP#30 FAQ
1.How can I place an order for R5F56609FGFP#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56609FGFP#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56609FGFP#30 reliable?
The price and inventory of R5F56609FGFP#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56609FGFP#30 is usually 5 days.
3.What payment methods are accepted for R5F56609FGFP#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56609FGFP#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F56609FGFP#30?
R5F56609FGFP#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56609FGFP#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56609FGFP#30?
For technical support, including R5F56609FGFP#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56609FGFP#30 requirements.
6.How does Aetrix verify that R5F56609FGFP#30 is sourced from the original manufacturer or authorized distributors?
All R5F56609FGFP#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56609FGFP#30 meets industry standards.
7.What is the process for return or replacement of R5F56609FGFP#30?
All R5F56609FGFP#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56609FGFP#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56609FGFP#30 part is unused and in its original packaging.
Return procedure for R5F56609FGFP#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R5F56609FGFP#30 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

