My Inquiry
My Account
Renesas R5F56609GDFB#30
- Part No.:
- R5F56609GDFB#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R5F56609GDFB#30.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:240
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R5F56609GDFB#30 from Renesas is a 32-bit RXv3 core microcontroller operating at up to 120 MHz, delivering 709 CoreMark performance. It integrates 1 Mbyte of on-chip code flash, 128 Kbytes of zero-wait-state SRAM, and 32 Kbytes of data flash rated for 100,000 erase/program cycles. The device supports CAN FD (ISO 11898-1:2015), 12-bit A/D and D/A converters, RTC with sub-clock oscillator support, and operates across –40°C to +105°C for industrial-grade applications.
For engineers reviewing the R5F56609GDFB#30 datasheet, R5F56609GDFB#30 pinout, R5F56609GDFB#30 application, or R5F56609GDFB#30 equivalent, key selection considerations include its 144-pin LFQFP (PLQP0144KA-B) package, G-version temperature rating, integrated FPU, ELC event-driven peripheral coordination, and IEC60730 safety features including MPU, CAC, CRCA, and register write protection.
Technical Context
The R5F56609GDFB#30 implements the RXv3 CPU core with single-precision IEEE 754-compliant FPU, 16-register bank save capability, and memory protection unit (MPU) supporting eight configurable regions down to 16-byte granularity. Its clock system combines an 8–24 MHz main oscillator, 32.768 kHz sub-clock, and selectable on-chip oscillators (LOCO/HOCO/IWDT-dedicated), enabling independent domain clocking: ICLK up to 120 MHz, PCLKA up to 120 MHz, PCLKB up to 60 MHz, and ADCLK up to 60 MHz.
Peripheral coordination is managed via the Event Link Controller (ELC), which interconnects 83 internal event signals-such as MTU compare-match, SCI transmit-complete, or A/D conversion end-without CPU intervention. Safety-critical functions are reinforced by oscillation-stop detection, hardware CRC calculation (8-/32-bit polynomials), DOCA arithmetic unit, and Trusted Memory (TM) protection for secure code execution in the flash target area.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv3 32-bit core with single-precision FPU, IEEE 754 compliant, 113 instructions including DSP and floating-point ops |
| Max Operating Frequency | 120 MHz system clock (ICLK); enables real-time deterministic control with 709 CoreMark score |
| Memory | 1 Mbyte code flash (no-wait access), 128 Kbytes SRAM (no wait states), 32 Kbytes data flash (100k cycle endurance) |
| Temperature Range | –40°C to +105°C (G-version), qualified for extended industrial and automotive under-hood environments |
| Package | 144-pin LFQFP (PLQP0144KA-B), 20 × 20 mm, 0.5 mm pitch, with JTAG and FINE debug interfaces |
| Communication Interfaces | CAN FD (1 channel, ISO 11898-1:2015), 13 SCI channels (asynchronous/smart-card/SPI/I²C modes), 2 RIIC (400 kbps), 1 RSPI (30 Mbps), 1 REMC |
| Analog Peripherals | 24-channel 12-bit S12ADH ADC (0.9 µs min conversion), 2-channel 12-bit R12DAb DAC, 4-channel CMPC, on-die temperature sensor (±1.0°C) |
Pinout & Package
Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 × 20 mm body, 0.5 mm lead pitch, exposed thermal pad, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, AVCC0 | Power supply inputs | Core/analog supply: 2.7–5.5 V (VCC), 3.0–5.5 V (AVCC0); AVCC0 ≥ VCC ensures analog accuracy |
| RES#, RESET | Reset input | Active-low asynchronous reset; triggers nine distinct reset sources including POR, LVD, and deep software standby release |
| XTAL, EXTAL | Main clock oscillator terminals | Connects 8–24 MHz crystal; enables PLL reference for 120 MHz ICLK generation |
| RTCXTAL, RTCXTAL | Sub-clock oscillator terminals | Connects 32.768 kHz crystal for RTC operation; required for calendar/time-capture functionality |
| TDI, TDO, TCK, TMS | JTAG debug interface | IEEE 1149.1-compliant boundary-scan and debug; supports full-speed emulation and flash programming |
| MTIOC0A–MTIOC8A | MTU3a waveform I/O | 16-bit timer PWM/complementary PWM outputs with dead-time control; supports 3-phase inverter gate drive |
| ADTRG0–ADTRG3 | A/D conversion trigger inputs | Accept external or peripheral-generated start signals (e.g., MTU compare match) for synchronized sampling |
| DA0, DA1 | D/A converter outputs | 2-channel 12-bit voltage outputs (0–AVCC0); usable as comparator reference or analog actuator control |
Key Features
| Feature | Design Value |
|---|---|
| Event Link Controller (ELC) | Enables 83 internal peripheral events (e.g., MTU overflow, SCI TX complete) to trigger actions without CPU wake-up or ISR overhead |
| Trusted Memory (TM) | Prevents unauthorized read-out of code flash contents in TM target area; only CPU instruction fetch allowed when enabled |
| IEC60730 Safety Support | Includes hardware-accelerated CRC (CRCA), clock accuracy monitor (CAC), RAM test assist (DOC), and register write protection |
| Floating-Point Unit (FPU) | Single-precision IEEE 754 engine integrated into RXv3 core; eliminates need for software emulation in motor control or sensor fusion |
| Deep Software Standby Mode | Retains RTC operation and SRAM content while disabling CPU, flash, and most peripherals; wakeup latency < 10 µs from external interrupt |
Applications
| Industrial Motor Control | Automotive Body Electronics |
|---|---|
Use Scenario: Closed-loop field-oriented control (FOC) of 3-phase BLDC motors in HVAC blowers or pump drives. IC Role / Device Role / Timing Role: Main controller executing FOC algorithm via FPU, generating complementary PWM via MTU3a with programmable dead time, and sampling current/voltage via 24-channel ADC with synchronized triggers. Use Value: Enables precise torque ripple suppression and efficiency optimization using hardware-accelerated trigonometric functions (TFU) and real-time ELC-triggered ADC sampling. | Use Scenario: Central body controller managing door locks, window lift, lighting, and LIN communication to sensors. IC Role / Device Role / Timing Role: System host MCU interfacing with LIN transceivers (via SCIh), driving relays/LEDs via 134 GPIOs, monitoring battery voltage via ADC, and logging faults in data flash. Use Value: Integrates LIN protocol stack, EEPROM-like data retention (32 KB data flash), and -40°C to +105°C operation for under-dash mounting without external cooling. |
| Smart Energy Metering | Factory Automation I/O Module |
Use Scenario: DIN-rail mounted electricity meter with harmonic analysis, tamper detection, and secure firmware updates. IC Role / Device Role / Timing Role: High-accuracy metrology processor using 24-channel ADC with digital filtering, CRC-protected OTA updates via CAN FD, and RTC-backed time-stamped event logging. Use Value: Meets IEC62053-21/22 accuracy requirements via self-calibration routines supported by on-chip temperature sensor and CAC clock monitoring. | Use Scenario: Distributed I/O node collecting analog/digital sensor data and controlling solenoids/valves over EtherCAT or CANopen. IC Role / Device Role / Timing Role: Real-time I/O concentrator with 134 GPIOs (5-V tolerant), CAN FD for fieldbus communication, and ELC-synchronized timestamping of digital inputs. Use Value: Eliminates external timing ICs via hardware RTC capture on GPIO edges and deterministic response (< 1 µs jitter) using MTU3a input capture and POE3a fault shutdown. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F56608GDFB#30 | Same RX660 Group, identical 144-pin LFQFP package and G-temp grade, but with 512 Kbyte code flash (vs. 1 Mbyte) | Suitable for cost-sensitive designs where firmware footprint < 512 KB; retains all peripherals including CAN FD, FPU, and ELC | Select when flash capacity requirement is ≤512 KB and BOM cost reduction is prioritized over future firmware headroom |
| R5F56609DDFB#30 | Same die and feature set, but D-version (-40°C to +85°C) instead of G-version; otherwise pin-to-pin and code-compatible | Applicable in commercial/industrial environments without extended temperature needs; lower qualification cost | Choose for non-extended-temperature applications where full RX660 peripheral set is required but +105°C operation is unnecessary |
Compared with R5F56609GDFB#30, R5F56608GDFB#30 reduces flash capacity by 50% without altering peripheral count or speed, while R5F56609DDFB#30 maintains identical functionality at a lower thermal grade-both offer drop-in compatibility for design reuse, though only the G-version guarantees operation at +105°C.
Availability
R5F56609GDFB#30 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, smart energy metering, and factory automation I/O modules requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for R5F56609GDFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.
The RX660 Group is designed for high-integrity industrial control systems demanding real-time responsiveness, functional safety compliance (IEC60730), and rich analog/peripheral integration-all within a single 120 MHz 32-bit MCU platform.
FAQ
What is the maximum operating frequency and CoreMark score of the R5F56609GDFB#30?
The R5F56609GDFB#30 operates at a maximum system clock frequency of 120 MHz and achieves 709 CoreMark performance. This benchmark reflects deterministic execution of the RXv3 core with integrated FPU, collective register bank save, and zero-wait-state memory access-enabling real-time control loops in motor drives and industrial PLCs without software overhead.
Does the R5F56609GDFB#30 support CAN FD, and what standard does it comply with?
Yes, the R5F56609GDFB#30 includes one CAN FD module compliant with ISO 11898-1:2015, supporting both standard and extended frames with bit rates up to 5 Mbps in FD mode. It is implemented as a dedicated peripheral with message RAM, filtering, and error handling logic-requiring no external transceiver beyond standard CAN PHY components.
What package type and pin count does the R5F56609GDFB#30 use?
The R5F56609GDFB#30 uses the PLQP0144KA-B package: a 144-pin Low-profile Quad Flat Package measuring 20 × 20 mm with 0.5 mm lead pitch. It includes JTAG and FINE debug interfaces, supports sub-clock oscillator connection, and provides 130 general-purpose I/O pins with 5-V tolerance and configurable pull-up/open-drain.
How does the Event Link Controller (ELC) function in the R5F56609GDFB#30?
The ELC in the R5F56609GDFB#30 allows 83 internal peripheral events-including MTU compare-match, SCI transmit-complete, and A/D conversion end-to directly trigger actions in other modules without CPU involvement or interrupt latency. This enables ultra-low-power operation (e.g., deep software standby with RTC running) and deterministic real-time responses critical for motor control and industrial I/O.
What IEC60730 safety features are integrated into the R5F56609GDFB#30?
The R5F56609GDFB#30 integrates multiple hardware-based IEC60730 Class B compliance features: memory protection unit (MPU), clock accuracy measurement circuit (CAC), CRC calculator (CRCA), data operation circuit (DOCA), register write protection, oscillation-stop detection, and self-diagnostic A/D disconnection detection. These are documented in the R01DS0393EJ0100 datasheet and require no external components to implement certified safety routines.
Is the R5F56609GDFB#30 pin-compatible with other RX660 Group MCUs?
Yes, the R5F56609GDFB#30 is pin-compatible with other 144-pin LFQFP variants in the RX660 Group-including R5F56608GDFB#30 (512 KB flash) and R5F56609DDFB#30 (D-temp grade)-as confirmed by Renesas' package compatibility matrix in the R01DS0393EJ0100 datasheet. All share identical PLQP0144KA-B mechanical dimensions, pinout, and signal mapping.
R5F56609GDFB#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RX600
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv3
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 130
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b; D/A 2x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56609GDFB#30 FAQ
1.How can I place an order for R5F56609GDFB#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56609GDFB#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56609GDFB#30 reliable?
The price and inventory of R5F56609GDFB#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56609GDFB#30 is usually 5 days.
3.What payment methods are accepted for R5F56609GDFB#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56609GDFB#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F56609GDFB#30?
R5F56609GDFB#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56609GDFB#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56609GDFB#30?
For technical support, including R5F56609GDFB#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56609GDFB#30 requirements.
6.How does Aetrix verify that R5F56609GDFB#30 is sourced from the original manufacturer or authorized distributors?
All R5F56609GDFB#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56609GDFB#30 meets industry standards.
7.What is the process for return or replacement of R5F56609GDFB#30?
All R5F56609GDFB#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56609GDFB#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56609GDFB#30 part is unused and in its original packaging.
Return procedure for R5F56609GDFB#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R5F56609GDFB#30 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
