Renesas R5F56609GDFP#10

Overview

R5F56609GDFP#10 from Renesas Electronics is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring 1 Mbyte of on-chip code flash, 128 Kbytes of zero-wait-state SRAM, 32 Kbytes of data flash (100,000 write/erase cycles), and integrated CAN FD, 12-bit A/D and D/A converters, RTC, and remote control signal receiver - deployed in industrial motor control and automotive body electronics requiring functional safety support per IEC 60730.

For engineers reviewing the R5F56609GDFP#10 datasheet, R5F56609GDFP#10 pinout, R5F56609GDFP#10 application, or R5F56609GDFP#10 equivalent, key selection criteria include its G-version temperature range (–40°C to +105°C), 144-pin LFQFP package (PLQP0144KA-B), single-precision FPU, MPU-based memory protection, and ELC-driven event-triggered peripheral coordination without CPU intervention.

Technical Context

The R5F56609GDFP#10 implements the RXv3 CPU core with 113 instructions including IEEE 754-compliant single-precision floating-point operations, barrel shifter, 32×32→64-bit multiplier, and 32/32→32-bit divider. It supports little-endian or big-endian data arrangement and features 16 collective register bank save banks for fast context switching.

Its clock system integrates a PLL with selectable reference sources (8–24 MHz external crystal, HOCO, or LOCO), independent IWDT-dedicated 120 kHz oscillator, and configurable peripheral clock domains (ICLK up to 120 MHz, PCLKA up to 120 MHz, PCLKB up to 60 MHz, ADCLK up to 60 MHz). The ELC enables hardware interlinking of 83 internal event signals across timers, ADC, CAN FD, and communication peripherals.

Key Specifications

Pinout & Package

Package: 144-pin Low-profile Quad Flat Package (LFQFP), PLQP0144KA-B, 20 × 20 mm, 0.5 mm pitch, lead-free and RoHS compliant. Supports 130 general-purpose I/O pins (5-V tolerant, open-drain, pull-up configurable), with dedicated JTAG and sub-clock oscillator pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit MCU applications.

Compared with R5F56609GDFP#10, R5F56608GDFP#10 reduces flash capacity by 50% without altering peripheral count or speed, while R5F56609DDFP#10 maintains full feature parity but limits thermal qualification - both require no PCB changes but differ in long-term scalability and environmental robustness.

Availability

R5F56609GDFP#10 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, smart energy metering, and factory automation I/O modules requiring stable component supply across multi-year production cycles.

Supply support for R5F56609GDFP#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, infrastructure, and IoT applications.

The RX660 Group - including R5F56609GDFP#10 - is engineered for functional safety-critical embedded systems, integrating IEC 60730 compliance features, memory protection, and deterministic real-time peripherals for motor control, building automation, and industrial HMI.

FAQ

What is the maximum operating frequency and core architecture of the R5F56609GDFP#10?

The R5F56609GDFP#10 operates at a maximum frequency of 120 MHz using the 32-bit RXv3 CPU core. It delivers 709 CoreMark performance and includes a single-precision floating-point unit compliant with IEEE 754. The core supports 113 instructions, 16 collective register bank save banks, and both little-endian and big-endian data arrangements - all confirmed in the R01DS0393EJ0100 datasheet Rev.1.00.

Does the R5F56609GDFP#10 support CAN FD, and what standard does it comply with?

Yes, the R5F56609GDFP#10 integrates one CAN FD module compliant with ISO 11898-1:2015 for both standard and extended frames. It supports bit rates up to 5 Mbps in the data phase and includes built-in message filtering, FIFO buffering, and error handling - verified in Section 1.1 and Table 1.1 of the R01DS0393EJ0100 datasheet.

What is the package type and pin count of the R5F56609GDFP#10?

The R5F56609GDFP#10 uses a 144-pin Low-profile Quad Flat Package (LFQFP) with part code PLQP0144KA-B, measuring 20 × 20 mm with 0.5 mm pitch. It provides 130 general-purpose I/O pins, including JTAG and sub-clock oscillator pins - explicitly listed in Table 1.1 and Figure 1.1 of the R01DS0393EJ0100 datasheet.

How does the R5F56609GDFP#10 support functional safety standards like IEC 60730?

The R5F56609GDFP#10 includes multiple hardware features for IEC 60730 Class B compliance: oscillation-stoppage detection, A/D converter self-diagnosis and disconnection detection, clock frequency accuracy measurement circuit (CAC), independent watchdog timer (IWDTa) with window function, RAM test assistance via DOC, and register write protection. These are documented in Section 1.1 "Useful functions for IEC60730 compliance" of R01DS0393EJ0100.

What are the memory resources available on the R5F56609GDFP#10?

The R5F56609GDFP#10 includes 1 Mbyte of on-chip code flash memory (no-wait access at 120 MHz), 32 Kbytes of reprogrammable data flash (rated for 100,000 write/erase cycles), and 128 Kbytes of zero-wait-state SRAM. All memory blocks support background programming/erasing (BGO), and code flash includes Trusted Memory (TM) protection - detailed in Tables 1.1 and 1.2 of R01DS0393EJ0100.