Renesas R5F56609GDFP#30

Overview

R5F56609GDFP#30 from Renesas is a 120-MHz 32-bit RXv3 microcontroller with integrated FPU, 1 Mbyte code flash, 128 Kbytes SRAM, 32 Kbytes data flash, CAN FD interface, 12-bit A/D and D/A converters, RTC, and remote control signal receiver - deployed in industrial motor control, building automation gateways, and automotive body electronics requiring extended temperature operation.

For engineers reviewing the R5F56609GDFP#30 datasheet, R5F56609GDFP#30 pinout, R5F56609GDFP#30 application, or R5F56609GDFP#30 equivalent, key selection criteria include G-grade (–40°C to +105°C) thermal rating, 144-pin LFQFP (PLQP0144KA-B) package with JTAG+FINE debug, 120-MHz real-time deterministic execution, IEC60730 safety support, and CAN FD compliance per ISO 11898-1:2015.

Technical Context

The R5F56609GDFP#30 implements the RXv3 CPU core with single-cycle instruction execution, IEEE 754-compliant single-precision FPU, and collective register bank save for fast interrupt response. It integrates a memory protection unit (MPU), Trusted Memory (TM) for secure code execution, and register write protection for functional safety.

Its clock system combines an 8–24 MHz main oscillator, 32.768 kHz sub-clock, and selectable on-chip oscillators (LOCO/HOCO/IWDT-dedicated), enabling independent domain clocking: ICLK up to 120 MHz, PCLKA up to 120 MHz (for MTU/RSPI/SCI10–11), PCLKB up to 60 MHz (for TMR/CMT/CMTW), and ADCLK up to 60 MHz for the S12ADH A/D converter.

Key Specifications

Pinout & Package

Package: 144-pin LFQFP (PLQP0144KA-B), 20 × 20 mm, 0.5 mm pitch, with JTAG and FINE debugging interfaces, sub-clock oscillator support, and 130 general-purpose I/O pins (including 4×5-V-tolerant, open-drain, pull-up configurable).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit MCU applications.

Compared with R5F56609GDFP#30, the R5F56608GDFP#30 reduces code flash to 512 KB - sufficient for lean firmware but limiting OTA update flexibility - while the R5F56609DDFP#30 maintains full feature parity except thermal rating, making it viable only where ambient conditions guarantee <85°C operation.

Availability

R5F56609GDFP#30 is available at Aetrix Electronics and suitable for industrial motor control, building automation gateways, and automotive body electronics requiring stable component supply, long-term lifecycle assurance, and G-grade thermal performance.

Supply support for R5F56609GDFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.

The RX660 Group - including R5F56609GDFP#30 - is engineered for high-reliability embedded applications demanding real-time determinism, functional safety (IEC60730), and rich connectivity (CAN FD, multiple SCI, RSPI, RIIC), targeting motor control, HMI, and gateway systems.

FAQ

What is the maximum operating frequency and core architecture of the R5F56609GDFP#30?

The R5F56609GDFP#30 features a 32-bit RXv3 CPU core with a maximum operating frequency of 120 MHz, achieving 709 CoreMark performance. It supports single-cycle instruction execution, IEEE 754-compliant single-precision floating-point operations, and collective register bank save for low-latency interrupt handling - all confirmed in the official R01DS0393EJ0100 datasheet Rev.1.00.

Does the R5F56609GDFP#30 support CAN FD, and what standard does it comply with?

Yes, the R5F56609GDFP#30 integrates one CAN FD module compliant with ISO 11898-1:2015, supporting both standard and extended frames with bit rates up to 5 Mbps in the data phase. This capability is explicitly documented in the "Communication function" section of the R01DS0393EJ0100 datasheet and verified across all 144-pin RX660 variants including R5F56609GDFP#30.

What is the operating temperature range and package type of the R5F56609GDFP#30?

The R5F56609GDFP#30 is a G-version device rated for –40°C to +105°C operation and housed in a 144-pin LFQFP package (PLQP0144KA-B, 20 × 20 mm, 0.5 mm pitch). It includes JTAG and FINE debugging interfaces and supports the sub-clock oscillator - all specified in Table 1.2 and package outline diagrams of the R01DS0393EJ0100 datasheet.

How much on-chip memory does the R5F56609GDFP#30 provide, and what are its key attributes?

The R5F56609GDFP#30 provides 1 Mbyte of code flash memory (no-wait access at 120 MHz), 128 Kbytes of SRAM (no-wait), and 32 Kbytes of reprogrammable data flash (rated for 100,000 erase/write cycles). These values are fixed for this part number and confirmed in Table 1.1 and Section 1.2 of the R01DS0393EJ0100 datasheet.

What safety and reliability features does the R5F56609GDFP#30 include for industrial applications?

The R5F56609GDFP#30 includes MPU, Trusted Memory (TM), register write protection, CRCA, CAC, DOCA, and IWDT with window function - all supporting IEC60730 Class B compliance. These features enable oscillation-stop detection, self-diagnostic A/D disconnection checks, clock accuracy monitoring, and secure code execution, as detailed in the "Safety" section of the R01DS0393EJ0100 datasheet.