Renesas R5F56609GGFP#30
- Part No.:
- R5F56609GGFP#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
R5F56609GGFP#30.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 100LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:270
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Product details
Overview
R5F56609GGFP#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring 1 MB code flash, 128 KB SRAM, 32 KB data flash, CAN FD interface, 12-bit A/D and D/A converters, and real-time clock with sub-clock oscillator support - deployed in industrial motor control, HVAC systems, and smart energy meters requiring deterministic timing and IEC 60730 compliance.
For engineers reviewing the R5F56609GGFP#30 datasheet, R5F56609GGFP#30 pinout, R5F56609GGFP#30 application, or R5F56609GGFP#30 equivalent, key selection considerations include its 144-pin LFQFP (PLQP0144KA-B) package, G-grade temperature range (–40°C to +105°C), integrated FPU, ELC event-driven peripheral coordination, and dual debugging interfaces (JTAG + FINE).
Technical Context
The R5F56609GGFP#30 implements the RXv3 CPU core with single-cycle instruction execution, IEEE 754-compliant single-precision FPU, and 16-register bank save for fast context switching. It supports little-endian or big-endian data arrangement and includes on-chip 32×32→64-bit multiplier and 32/32→32-bit divider.
Its clock system integrates main (8–24 MHz crystal), sub-clock (32.768 kHz), and on-chip oscillators (LOCO/HOCO/IWDT-dedicated), with independent PLL-based domain clocks: ICLK up to 120 MHz, PCLKA up to 120 MHz, PCLKB up to 60 MHz, PCLKD up to 60 MHz, and BCLK up to 40 MHz - enabling precise peripheral timing isolation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv3 32-bit, 120 MHz max, 709 CoreMark, single-cycle instruction execution |
| Memory | 1 MB code flash (no-wait at 120 MHz), 128 KB SRAM (no-wait), 32 KB data flash (100k erase cycles) |
| Analog Peripherals | 24-channel 12-bit S12ADH ADC (0.9 µs min conversion), 2-channel 12-bit R12DAb DAC, 4-channel CMPC comparator |
| Communication | 1-channel CAN FD (ISO 11898-1:2015), 13 SCI channels (async/sync/SmartCard/SPI/I²C), 2 RIIC (400 kbps), 1 RSPId (30 Mbps) |
| Timers & Control | MTU3a (9 channels), TMRb (4×8-bit), CMT/CMTW (8×16-bit/2×32-bit), ELC for interrupt-free peripheral linking |
| Power & Environment | 2.7–5.5 V supply, –40°C to +105°C (G-version), deep software standby with RTC active, 4 low-power modes |
| Security & Safety | MPU (8 regions), Trusted Memory (TM), register write protection, CRCA (CRC-8/32), CAC clock accuracy monitoring |
Pinout & Package
Package: 144-pin LFQFP (PLQP0144KA-B), 20 × 20 mm, 0.5 mm pitch, G-grade (–40°C to +105°C), with JTAG and sub-clock oscillator support.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 | Core & analog power supply | 2.7–5.5 V digital supply; AVCC0 = 3.0–5.5 V analog reference, must be ≥ VCC |
| RES# | Active-low reset input | Asynchronous hardware reset; internal POR/LVD also available |
| XTAL / EXTAL | Main clock oscillator terminals | Connects 8–24 MHz crystal; enables PLL reference for 120 MHz ICLK |
| XT1 / XT2 | Sub-clock oscillator terminals | Connects 32.768 kHz crystal for RTC operation and deep standby timekeeping |
| TMS / TDI / TDO / TCK | JTAG debug interface | IEEE 1149.1-compliant boundary scan and full-speed debugging |
| MD0 / MD1 | Mode setting pins | Select boot mode (single-chip, SCI, FINE, user boot) at power-on reset |
| IRQ0–IRQ15 | External interrupt inputs | 16 configurable edge/level-sensitive interrupt sources with priority levels |
| MTIOC0A–MTIOC8A | MTU3a waveform I/O | Support PWM, complementary PWM, dead-time insertion, and 3-phase inverter control |
Key Features
| Feature | Design Value |
|---|---|
| Event Link Controller (ELC) | 83 internal event signals enable CPU-free peripheral coordination (e.g., MTU trigger → ADC start → DMA transfer) |
| Trusted Memory (TM) | Code flash region protected against read-out; only CPU instruction fetch allowed - critical for firmware IP protection |
| IEC 60730 Support | Integrated self-test features: oscillation-stop detection, A/D disconnection check, RAM test assist (DOC), CRC calculator, IWDT windowing |
| Floating-Point Unit (FPU) | IEEE 754 single-precision compliant; accelerates motor control algorithms, sensor fusion, and trigonometric calculations via TFU |
| Remote Control Receiver (REMC) | Dedicated IR signal decoder with 4-pattern matching (header/data0/data1/special), 8-byte FIFO, and selectable clock source |
| Power Management | Four low-power modes including deep software standby with RTC running on sub-clock - enables <1 µA retention current |
Applications
| Industrial Motor Drives | HVAC System Controllers |
|---|---|
Use Scenario: Closed-loop field-oriented control (FOC) of 3-phase BLDC/PMSM motors with real-time current sensing and thermal monitoring. IC Role / Device Role / Timing Role: Main system controller executing FOC algorithm, managing PWM generation via MTU3a, sampling current/voltage via S12ADH, and regulating via R12DAb reference outputs. Use Value: 120 MHz RXv3 core + FPU delivers sub-µs loop timing; complementary PWM with programmable dead time ensures safe inverter switching; ELC synchronizes ADC sampling to PWM edges without CPU overhead. |
Use Scenario: Multi-zone air handling unit with variable refrigerant flow (VRF), fan speed control, CO₂ sensing, and remote IR command reception. IC Role / Device Role / Timing Role: Central HVAC controller interfacing with CAN FD bus for zone communication, driving fans via PWM, reading sensors via ADC/DAC, and decoding IR commands via REMCa. Use Value: Integrated CAN FD enables robust inter-unit communication; REMCa offloads IR protocol parsing; 12-bit DAC provides precise reference voltage for analog sensor conditioning; G-grade temp range ensures reliability in outdoor condenser units. |
| Smart Energy Meters | Industrial PLC I/O Modules |
Use Scenario: DIN-rail mounted polyphase electricity meter with metrology, tamper detection, secure firmware updates, and HAN communication. IC Role / Device Role / Timing Role: Secure host MCU managing metrology IC interface (SPI), performing cryptographic operations (CRCA, TM), logging events to data flash, and communicating via RIIC/SCI to display or gateway. Use Value: Trusted Memory prevents firmware extraction; 32 KB data flash supports 10-year event logging at 100k cycles; CAC validates clock integrity for time-stamped billing; IEC 60730 diagnostics meet utility certification requirements. |
Use Scenario: Modular digital input/output expansion for DIN-rail PLCs, supporting 24 V DC inputs, relay/SSR outputs, and fieldbus connectivity. IC Role / Device Role / Timing Role: Local intelligence node handling high-speed DI sampling (via GPIO + ELC), generating timed DO pulses (MTU3a), buffering CAN FD messages, and reporting status over RS-485 (SCI). Use Value: 134 GPIO pins with 5-V tolerance simplify industrial-level interfacing; CAN FD handles deterministic cyclic I/O updates; deep software standby reduces power during idle periods; JTAG enables in-system firmware validation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F56608GDFP#30 | Same RX660 Group, 100-pin LFQFP (PLQP0100KB-B), 512 KB code flash, 17-channel ADC, no JTAG, no sub-clock oscillator | Lacks RTC and deep standby with RTC; reduced I/O count (90 pins) and peripheral channel count (e.g., fewer SCI/MTU channels) | Select when board space, cost, or RTC functionality are constrained - not suitable for RTC-dependent applications. |
| R5F566T9GDFP#30 | RX66T Group variant: identical pinout/package, same 1 MB flash/SRAM, but optimized for motor control with enhanced MTU3b (64-channel PWM), 3-phase encoder interface, and higher ADC sampling rate | Targeted specifically for servo/inverter drives; adds hardware position feedback support and faster ADC trigger latency | Prefer for high-performance motor control where encoder integration and sub-µs PWM jitter matter - retains full software compatibility with RX660. |
Compared with R5F56608GDFP#30, the R5F56609GGFP#30 enables RTC-based scheduling and extended low-power operation; compared with R5F566T9GDFP#30, it trades motor-specific peripherals for broader general-purpose I/O and communication flexibility - making it optimal for multi-function industrial controllers rather than dedicated drives.
Availability
R5F56609GGFP#30 is available at Aetrix Electronics and suitable for industrial motor control, HVAC system management, and smart energy metering requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability under extended temperature conditions.
Supply support for R5F56609GGFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for industrial, automotive, and infrastructure markets.
The RX660 Group, including the R5F56609GGFP#30, was designed for high-integrity industrial applications demanding functional safety (IEC 60730), real-time responsiveness, and rich analog/motor control peripherals in extended temperature environments.
FAQ
What is the maximum operating frequency and core architecture of the R5F56609GGFP#30?
The R5F56609GGFP#30 operates at a maximum frequency of 120 MHz using the 32-bit RXv3 CPU core. It delivers 709 CoreMark performance and includes a single-precision IEEE 754 floating-point unit, 16-register bank save, and support for both little-endian and big-endian data arrangements. The R5F56609GGFP#30 achieves deterministic real-time behavior through its zero-wait-state memory subsystem and event-driven ELC architecture.
Does the R5F56609GGFP#30 support real-time clock (RTC) functionality, and what oscillator is required?
Yes, the R5F56609GGFP#30 supports RTC functionality using the sub-clock oscillator (SOSC), which requires an external 32.768 kHz crystal connected to XT1/XT2 pins. The RTC operates in deep software standby mode, maintaining timekeeping while the CPU and most peripherals are powered down. The R5F56609GGFP#30's RTC includes calendar functions, alarm interrupts, time capture on external events, and leap-year compensation - all confirmed in the RX660 Group hardware manual.
What communication interfaces does the R5F56609GGFP#30 include, and is CAN FD supported?
The R5F56609GGFP#30 includes one CAN FD channel compliant with ISO 11898-1:2015 (supporting both standard and extended frames), 13 SCI channels (with async/sync/SmartCard/SPI/I²C modes), two RIIC interfaces (400 kbps Fast Mode), and one RSPId interface (30 Mbps). Its CAN FD module supports bit rates up to 5 Mbps and includes built-in message RAM with flexible filtering - verified in the R01DS0393EJ0100 datasheet section 1.1 and Table 1.2.
What are the memory resources available on the R5F56609GGFP#30?
The R5F56609GGFP#30 integrates 1 MB of on-chip code flash memory (accessible with zero wait states at 120 MHz), 128 KB of SRAM (also zero wait states), and 32 KB of reprogrammable data flash memory rated for 100,000 erase/write cycles. It also includes a 12-byte unique ID and supports Trusted Memory (TM) protection for secure firmware storage. These memory specifications are explicitly listed in Table 1.1 of the R01DS0393EJ0100 datasheet.
Is the R5F56609GGFP#30 qualified for industrial temperature operation, and what package does it use?
Yes, the R5F56609GGFP#30 is rated for industrial operation from –40°C to +105°C (G-grade), as indicated by the "G" in its part number. It uses a 144-pin LFQFP package (PLQP0144KA-B), measuring 20 × 20 mm with 0.5 mm pitch, and includes both JTAG and FINE debugging interfaces. This package configuration supports full peripheral complement including sub-clock oscillator and RTC - confirmed in Table 1.2 and package dimension diagrams of the R01DS0393EJ0100 datasheet.
R5F56609GGFP#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-LQFP
- Series:
- RX600
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv3
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 88
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b; D/A 2x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56609GGFP#30 FAQ
1.How can I place an order for R5F56609GGFP#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56609GGFP#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of R5F56609GGFP#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56609GGFP#30 is usually 5 days.
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6.How does Aetrix verify that R5F56609GGFP#30 is sourced from the original manufacturer or authorized distributors?
All R5F56609GGFP#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56609GGFP#30 meets industry standards.
7.What is the process for return or replacement of R5F56609GGFP#30?
All R5F56609GGFP#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56609GGFP#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56609GGFP#30 part is unused and in its original packaging.
Return procedure for R5F56609GGFP#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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