Renesas R5F56609HDFB#30
- Part No.:
- R5F56609HDFB#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R5F56609HDFB#30.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 144LFQFP
- Quantity:
- Payment:

- Shipping:

Inventory:237
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Product details
Overview
R5F56609HDFB#30 from Renesas is a 32-bit RXv3 microcontroller with 120 MHz maximum operating frequency, 1 Mbyte on-chip code flash, 128 Kbytes SRAM, and integrated CAN FD, 12-bit A/D and D/A converters, RTC, and remote control signal receiver - deployed in industrial motor control, building automation gateways, and automotive body electronics requiring IEC60730-compliant functional safety.
For engineers reviewing the R5F56609HDFB#30 datasheet, R5F56609HDFB#30 pinout, R5F56609HDFB#30 application, or R5F56609HDFB#30 equivalent, key selection criteria include its 144-pin LFQFP (PLQP0144KA-B) package, JTAG + FINE debug support, sub-clock oscillator inclusion, full 24-channel S12ADH ADC, dual R12DAb DAC outputs, and CAN FD compliance per ISO 11898-1:2015.
Technical Context
The R5F56609HDFB#30 implements the RXv3 CPU core with single-precision FPU, 16 register banks for fast context switching, and MPU-based memory protection. Its clock system integrates main (8–24 MHz crystal), sub (32.768 kHz), and on-chip oscillators (LOCO/HOCO/IWDT), with independent PLL paths enabling up to 120 MHz ICLK and configurable peripheral clocks (PCLKA/PCLKB/PCLKD).
Peripheral integration includes MTU3a (9-channel 16/32-bit timer with complementary PWM), ELC-driven event chaining across 83 internal signals, DMACAa (8-channel DMA), and DTCb - enabling deterministic low-latency operation without CPU intervention during sleep modes like deep software standby with RTC active.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv3 32-bit with single-precision FPU, IEEE 754 compliant, 709 CoreMark @ 120 MHz |
| Max Operating Frequency | 120 MHz system clock (ICLK); supports no-wait access to 1 Mbyte flash and 128 Kbytes SRAM |
| Memory | 1 Mbyte code flash (BGO programmable), 32 Kbytes data flash (100k erase cycles), 128 Kbytes SRAM |
| Analog Peripherals | 24-channel 12-bit S12ADH ADC (0.9 µs min conversion), 2-channel 12-bit R12DAb DAC, 4-channel CMPC, on-die temperature sensor (±1.0°C) |
| Communication | CAN FD (ISO 11898-1:2015), 13 SCI channels (async/sync/SmartCard/SPI/I²C), 2 RIIC (400 kbps), 1 RSPId (30 Mbps), 1 REMCa |
| Timers & Control | MTU3a (9 channels), TMRb (4×8-bit), CMT (4×16-bit), CMTW (2×32-bit), IWDT (14-bit, dedicated 120 kHz oscillator), RTCC with calendar mode |
| Package & Environment | 144-pin LFQFP (PLQP0144KA-B, 20 × 20 mm, 0.5 mm pitch), –40°C to +85°C (D-version), 5-V tolerant I/O (4 pins) |
Pinout & Package
Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 × 20 mm body, 0.5 mm lead pitch, exposed thermal pad, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, AVCC0 | Power supply inputs | Core/analog supply (2.7–5.5 V); AVCC0 must be ≥ VCC and within 3.0–5.5 V range for ADC/DAC accuracy |
| RES#, RESET | Reset input | Active-low asynchronous reset; triggers nine distinct reset sources including POR, LVD, and IWDT underflow |
| XTAL, EXTAL | Main clock oscillator terminals | Connects 8–24 MHz crystal; enables PLL reference for 120 MHz ICLK generation |
| RTCXTAL, RTCXTAL | Sub-clock oscillator terminals | Connects 32.768 kHz crystal; required for RTCC calendar mode and deep software standby with RTC running |
| TXD0, RXD0 | SCI0 serial interface | Asynchronous UART interface; supports LIN protocol, auto-baud detection, and ELC-triggered start/stop |
| CTX0, CRX0 | CAN FD channel 0 | Differential CAN FD transceiver interface (ISO 11898-1:2015); supports standard/extended frames at up to 5 Mbps |
| AD00–AD23 | Analog input channels | 24 dedicated ADC input pins; support scan/group priority modes, digital comparison, and self-diagnostic functions |
| DA0, DA1 | D/A converter outputs | Two buffered 12-bit analog outputs; usable as comparator reference voltage sources |
| POE0#, POE4#, etc. | Port output enable controls | Five dedicated pins for MTU3a waveform output fault detection and high-impedance state control |
Key Features
| Feature | Design Value |
|---|---|
| IEC60730 Safety Support | Oscillation-stop detection, RAM test assist via DOC, CRC calculator (CRCA), register write protection, and clock accuracy measurement (CAC) for Class B compliance |
| Event Link Controller (ELC) | 83 internal event signals routed without CPU involvement - enables synchronized MTU/ADC/REMC operation in sleep mode |
| Trusted Memory (TM) | Code flash area protected against read-out; only CPU instruction fetch allowed - secures firmware IP in production devices |
| Low-Power Operation | Four power modes including deep software standby with RTC active; IWDT runs independently on dedicated 120 kHz oscillator |
| Floating-Point Performance | Single-precision FPU with 11 instructions; enables real-time trigonometric (TFU) and signal processing without external math libraries |
Applications
| Industrial Motor Drive | Building Automation Gateway |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC motors in HVAC compressors and pump systems using space-vector PWM. IC Role / Device Role / Timing Role: Primary MCU executing FOC algorithm, generating complementary PWM via MTU3a with automatic dead-time insertion, sampling current/voltage via 24-channel ADC, and monitoring thermal feedback via on-die sensor. Use Value: Integrated 120 MHz RXv3 core + FPU delivers real-time computation; dual DAC outputs provide precise reference voltages for analog comparators used in overcurrent protection. | Use Scenario: Protocol translation hub connecting BACnet MS/TP field devices to Ethernet/IP backbone in smart buildings. IC Role / Device Role / Timing Role: Central controller managing concurrent SCI (LIN/BACnet), CAN FD (for lighting control), and RIIC (sensor bus) interfaces while maintaining secure OTA update capability via TM-protected flash. Use Value: 13 SCI channels and dual RIIC ports eliminate external bridge ICs; ELC synchronizes time-critical CAN FD frame transmission with RTC-stamped event logging. |
| Automotive Body Control Module | Medical Infusion Pump Controller |
Use Scenario: Centralized door/window/mirror control unit with LIN slave nodes and diagnostic CAN FD communication. IC Role / Device Role / Timing Role: Safety-aware MCU executing ASIL-B-equivalent diagnostics (via CAC, IWDT, MPU), driving window lift motors via PWM, and receiving remote keyless entry signals via REMCa. Use Value: IEC60730-certified features (oscillation detection, RAM test, register lock) reduce functional safety validation effort; 5-V tolerant I/O interfaces directly with legacy 5 V automotive sensors. | Use Scenario: Precision fluid delivery system requiring calibrated flow rate control, pressure sensing, and alarm-triggered shutdown. IC Role / Device Role / Timing Role: Real-time controller acquiring analog pressure/temperature data via 12-bit ADC, generating smooth motor drive waveforms via R12DAb DAC, and enforcing safety interlocks using independent watchdog (IWDT) and voltage monitoring (LVDA). Use Value: On-chip 12-bit DAC eliminates external precision DAC IC; self-diagnostic ADC and analog input disconnection detection ensure therapy integrity per IEC 62304. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F56608HDFB#30 | Same RX660 Group, identical 144-pin LFQFP package and peripherals, but 512 Kbyte code flash (vs. 1 Mbyte) | Suitable for cost-sensitive designs where firmware size < 512 KB and no future feature expansion is planned | Select when flash capacity headroom is not required and BOM cost optimization is critical |
| R5F566T9HDFB#30 | Same package and flash/SRAM specs, but G-version (-40°C to +105°C) vs. D-version (-40°C to +85°C) of R5F56609HDFB#30 | Required for under-hood automotive or high-ambient industrial environments exceeding 85°C | Choose for extended temperature operation; otherwise R5F56609HDFB#30 provides identical functionality at lower cost |
Compared with R5F56609HDFB#30, R5F56608HDFB#30 reduces flash capacity by 50% without altering peripheral count or timing performance, while R5F566T9HDFB#30 maintains full specification compatibility but extends thermal rating - both require no PCB redesign but differ in lifecycle qualification and long-term availability planning.
Availability
R5F56609HDFB#30 is available at Aetrix Electronics and suitable for industrial motor control, building automation gateways, and automotive body electronics requiring stable component supply, long-term manufacturability, and IEC60730-compliant safety features.
Supply support for R5F56609HDFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications.
The RX660 Group, including R5F56609HDFB#30, was designed for real-time industrial control and functional-safety-critical systems - integrating high-performance RXv3 cores, robust analog peripherals, and comprehensive IEC60730 support in scalable packages.
FAQ
What is the maximum operating frequency and core architecture of the R5F56609HDFB#30?
The R5F56609HDFB#30 operates at a maximum frequency of 120 MHz using the 32-bit RXv3 CPU core with single-precision floating-point unit (FPU), achieving 709 CoreMark. It supports collective register bank save, memory protection unit (MPU), and JTAG/FINE debugging interfaces - all confirmed in Renesas document R01DS0393EJ0100 Rev.1.00.
Does the R5F56609HDFB#30 include a sub-clock oscillator and support real-time clock functionality?
Yes, the R5F56609HDFB#30 includes dedicated RTCXTAL/RTCXTAL pins for a 32.768 kHz crystal and supports full RTCC functionality - including calendar mode, alarm interrupts, time capture, and operation in deep software standby. This is explicitly confirmed for 144-pin LFQFP variants with sub-clock oscillator in Table 1.2 of R01DS0393EJ0100.
How many analog-to-digital converter channels does the R5F56609HDFB#30 support, and what is their resolution?
The R5F56609HDFB#30 integrates a single 12-bit S12ADH analog-to-digital converter with 24 input channels, minimum conversion time of 0.9 µs at 60 MHz ADCLK, and features including group scan prioritization, digital comparison, and analog input disconnection detection - all specified in Section 1.1 and Table 1.1 of R01DS0393EJ0100.
Is the R5F56609HDFB#30 CAN FD compliant, and which standard does it meet?
Yes, the R5F56609HDFB#30 includes one CAN FD module compliant with ISO 11898-1:2015, supporting both standard and extended frames at data rates up to 5 Mbps. This is documented in the "Communication function" section of Table 1.1 and confirmed in the product overview on page 1 of R01DS0393EJ0100.
What package type and pin count does the R5F56609HDFB#30 use?
The R5F56609HDFB#30 uses a 144-pin Low-profile Quad Flat Package (LFQFP) with part code PLQP0144KA-B - 20 × 20 mm body, 0.5 mm pitch, and exposed thermal pad. This is explicitly listed in Table 1.1 and Table 1.2 of R01DS0393EJ0100 Rev.1.00 as the package for RX660 Group devices with full peripheral complement.
R5F56609HDFB#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RX600
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RXv3
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 130
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b; D/A 2x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56609HDFB#30 FAQ
1.How can I place an order for R5F56609HDFB#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56609HDFB#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56609HDFB#30 reliable?
The price and inventory of R5F56609HDFB#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56609HDFB#30 is usually 5 days.
3.What payment methods are accepted for R5F56609HDFB#30?
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Once your R5F56609HDFB#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56609HDFB#30?
For technical support, including R5F56609HDFB#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56609HDFB#30 requirements.
6.How does Aetrix verify that R5F56609HDFB#30 is sourced from the original manufacturer or authorized distributors?
All R5F56609HDFB#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56609HDFB#30 meets industry standards.
7.What is the process for return or replacement of R5F56609HDFB#30?
All R5F56609HDFB#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56609HDFB#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56609HDFB#30 part is unused and in its original packaging.
Return procedure for R5F56609HDFB#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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