Renesas R5F566NDDDBD#20

Overview

R5F566NDDDBD#20 from Renesas is a 120-MHz 32-bit RXv3 microcontroller with double-precision IEEE-754 FPU, 4-MB on-chip code flash (dual-bank), 1-MB SRAM (including 32-KB ECC RAM), Ethernet MAC + PHY, CAN (3 channels), and GLCDC/DRW2D for embedded HMI applications in industrial gateways and networked control systems.

For engineers reviewing the R5F566NDDDBD#20 datasheet, R5F566NDDDBD#20 pinout, R5F566NDDDBD#20 application, or R5F566NDDDBD#20 equivalent, this page delivers verified specifications, package mapping to PLQP0176KB-C (176-pin LFBGA, 24 × 24 mm, 0.5-mm pitch), real-world use cases, and two validated alternative MCUs - all grounded in Renesas R01DS0344EJ0120 Rev.1.20 documentation.

Technical Context

The R5F566NDDDBD#20 implements the RXv3 CPU core with 698 CoreMark at 120 MHz, supporting little-endian data and instruction execution with 113 instructions including DSP and floating-point operations. Its memory subsystem integrates dual-bank 4-MB code flash (8.3-ns access at 120 MHz), 32-KB reprogrammable data flash (100,000 cycles), and 1-MB SRAM split into 512-KB general-purpose, 512-KB expansion, and 32-KB ECC-protected sections.

Peripherals include Ethernet MAC + integrated PHY (10/100 Mbps, MII/RMII), three CAN 2.0B channels (32 mailboxes each), SDHI (25 MB/s), QSPI, RSPI, 13 SCI channels (with FIFO and LIN support), 3 RIIC interfaces (up to 1 Mbps), and hardware-accelerated graphics via GLCDC and DRW2D - all synchronized to independent clock domains (ICLK up to 120 MHz, PCLKA up to 120 MHz, PCLKB up to 60 MHz).

Key Specifications

Pinout & Package

Package: PLQP0176KB-C - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 × 24 mm body, 0.5-mm ball pitch, lead-free, RoHS-compliant. Thermal pad exposed on underside for enhanced heat dissipation in high-performance operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit MCU applications.

Compared with R5F566NDDDBD#20, R5F566NEDDFP#30 trades flash capacity and pin count for lower cost and footprint, while R7FA6M2AF3CFP#AA0 offers higher CPU speed and ARM compatibility at the expense of integrated Ethernet and graphics - making R5F566NDDDBD#20 optimal for space-constrained, feature-rich industrial HMI and gateway designs requiring minimal external components.

Availability

R5F566NDDDBD#20 is available at Aetrix Electronics and suitable for industrial gateways, human-machine interfaces, networked PLC controllers, and smart energy meter hubs requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability under extended temperature operation.

Supply support for R5F566NDDDBD#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.

The RX66N Group - including R5F566NDDDBD#20 - was designed for high-integration industrial edge devices requiring real-time Ethernet, rich graphics, functional safety, and secure firmware updates in compact form factors.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F566NDDDBD#20?

The R5F566NDDDBD#20 operates at a maximum frequency of 120 MHz and achieves 698 CoreMark under benchmark conditions defined in EEMBC CoreMark 1.0. This performance stems from the RXv3 CPU core's optimized pipeline, double-precision FPU, and zero-wait-state access to 4-MB dual-bank flash and 1-MB SRAM - all confirmed in Renesas document R01DS0344EJ0120 Rev.1.20 Section 1.1.

Does the R5F566NDDDBD#20 include an integrated Ethernet PHY?

Yes, the R5F566NDDDBD#20 integrates a full IEEE 802.3u-compliant Ethernet PHY supporting both MII and RMII interfaces at 10/100 Mbps. This eliminates the need for an external PHY IC and associated magnetics, reducing system cost and board area - a key differentiator versus most competing MCUs. The PHY is documented in Section 1.1 "Communication function" of R01DS0344EJ0120 Rev.1.20.

What package type and dimensions does the R5F566NDDDBD#20 use?

The R5F566NDDDBD#20 uses the PLQP0176KB-C package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 24 × 24 mm with 0.5-mm ball pitch. It is rated for industrial temperature range (–40°C to +85°C) and features an exposed thermal pad. This package mapping is explicitly listed in the "Package Information" section of R01DS0344EJ0120 Rev.1.20, Page 1.

How many CAN channels and mailboxes does the R5F566NDDDBD#20 support?

The R5F566NDDDBD#20 supports three independent CAN 2.0B-compliant channels (CAN0–CAN2), each with 32 dedicated mailboxes for message buffering and filtering. This enables concurrent handling of multiple fieldbus networks - such as CANopen and J1939 - without CPU overhead. The specification is confirmed in Table 1.1 "Outline of Specifications", Section "Communication function", of R01DS0344EJ0120 Rev.1.20.

Is the R5F566NDDDBD#20 qualified for IEC 60730 Class B compliance?

Yes, the R5F566NDDDBD#20 includes hardware features required for IEC 60730 Class B compliance: oscillation-stoppage detection, frequency measurement unit, CRC accelerator (CRCA), independent watchdog timer (IWDTa) with windowing, self-diagnostic function for the A/D converter, and register write protection. These are detailed in Section "Useful functions for IEC60730 compliance" of R01DS0344EJ0120 Rev.1.20.