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Renesas R5F566NDDGFB#10

Part No.:
R5F566NDDGFB#10
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixR5F566NDDGFB#10.pdf
Description:
IC MCU 32BIT 2MB FLASH 144LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,505

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Product details

Overview

R5F566NDDGFB#10 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring 4 MB on-chip code flash, 1 MB SRAM (including 32 KB ECC RAM), dual-bank flash architecture, IEEE-754 double-precision FPU, and integrated Ethernet MAC, CAN, SDHI, QSPI, and GLCDC. It targets industrial HMI, networked gateway, and real-time control applications requiring deterministic timing and functional safety support.

For engineers reviewing the R5F566NDDGFB#10 datasheet, R5F566NDDGFB#10 pinout, R5F566NDDGFB#10 application, or R5F566NDDGFB#10 equivalent, this MCU delivers verified IEC 60730 compliance features-including oscillation-stop detection, CRC acceleration, IWDT with window function, and A/D self-diagnostic-alongside hardware-accelerated 2D graphics, parallel camera capture, and secure AES/TSIP encryption options.

Technical Context

The R5F566NDDGFB#10 implements the RXv3 CPU core with 113 instructions, 16 general-purpose 32-bit registers, and dual 72-bit accumulators. Its memory subsystem includes 4 MB dual-bank flash (8.3 ns access at 120 MHz), 512 KB main SRAM, 512 KB expansion RAM, and 32 KB ECC RAM supporting SEC-DED error correction.

Peripherals are clocked across four domains: ICLK (up to 120 MHz for CPU), PCLKA (up to 120 MHz for ETHERC, GLCDC, DRW2D), PCLKB (up to 60 MHz for timers, UARTs, ADC), and PCLKC/PCLKD (up to 60 MHz for S12AD units). The ELC enables zero-CPU-latency interconnection of 123 internal event sources-including timer triggers, interrupt requests, and pin state changes-to peripheral functions.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core RXv3 32-bit, 120 MHz max, 698 CoreMark, IEEE-754 double-precision FPU
Memory 4 MB code flash (dual-bank), 1 MB SRAM (512 KB + 512 KB), 32 KB ECC RAM, 8 KB standby RAM
Timers 4×32-bit GPTW, 9×16-bit MTU3a, 6×16-bit TPUa, 4×8-bit TMR, 4×16-bit CMT, 2×32-bit CMTW
Analog Two 12-bit S12AD units (8 + 21 channels), 2×12-bit D/A, on-die temperature sensor
Connectivity Ethernet MAC (10/100 Mbps, MII/RMII), 3×CAN (ISO 11898-1), 13×SCI, 3×RIIC (1 Mbps), 3×RSPI, 1×QSPI, SDHI, MMCIF
Graphics & Media GLCDC (3-plane overlay), DRW2D (vector/bit-blit), PDC (CMOS camera interface), SSIE (2-channel audio)
Security & Safety AES-128/192/256, TSIP, IEC 60730 support (CRC, IWDT window, A/D self-test, register write protection)

Pinout & Package

Package: PLQP0176KB-C, 176-pin LFBGA, 24 × 24 mm, 0.5-mm pitch, –40°C to +105°C (G-version).

Pin/Terminal Circuit Role Design Meaning
VCC / AVCC0 / AVCC1 Power supply inputs Separate digital/analog supplies; AVCC0/AVCC1 power analog peripherals including S12AD and RTC
RES# Active-low reset input Asynchronous hardware reset; initiates full system reset sequence including POR and voltage monitoring
XTAL / EXTAL Main crystal oscillator terminals Supports 8–24 MHz external crystal; PLL generates 120 MHz system clock
VBATT Battery backup supply Enables RTC operation during main VCC dropout; requires external coin cell or capacitor
ETH_MDC / ETH_MDIO PHY management interface IEEE 802.3u-compliant MDIO bus for configuring external Ethernet PHY devices
ETXD0–ETXD3 / ERXD0–ERXD3 Ethernet data lines MII interface signals; supports 10/100 Mbps full/half-duplex operation with flow control

Key Features

Feature Design Value
Dual-bank flash architecture Enables background programming/erasing while executing from alternate bank; supports safe firmware updates without runtime interruption
Event Link Controller (ELC) Hardware routing of 123 internal events (e.g., timer overflow, A/D completion) to peripherals without CPU intervention-reducing latency and ISR overhead
GLCDC + DRW2D co-processing Offloads pixel composition, alpha blending, and 2D rendering from CPU; supports 3-layer overlay and hardware-accelerated bit blitting
IEC 60730 Class B support Integrated diagnostics: oscillation-stop detection, CRC accelerator, IWDT with configurable window, A/D disconnection detection, register lock bits
Secure boot & encryption Trusted Secure IP (TSIP) provides key management, AES acceleration, and secure key storage-enabling encrypted firmware loading and runtime decryption

Applications

Industrial HMI Gateway Smart Building Controller

Use Scenario: Central controller aggregating Modbus RTU, CAN bus, and Ethernet/IP field data into unified web-based visualization.

IC Role / Device Role / Timing Role: Real-time protocol bridging engine with deterministic 120 MHz RXv3 core, dual-bank flash for OTA updates, and Ethernet MAC + 3×CAN for multi-network interfacing.

Use Value: Eliminates external protocol translators by integrating CAN, SCI, and Ethernet MAC with hardware-accelerated DMA (DMACAa/EXDMAC) and ELC-triggered A/D sampling.

Use Scenario: HVAC zone controller managing temperature sensors, valve actuators, and occupancy detectors while reporting to cloud via Wi-Fi module over UART/USB.

IC Role / Device Role / Timing Role: Low-power system-on-chip with 4 low-power modes, RTC battery backup, and 12-bit S12AD for precision sensor acquisition.

Use Value: Achieves <10 µA deep software standby current using VBATT-backed RTC and 8 KB standby RAM-extending battery life in wireless edge nodes.

Networked PLC Edge Node Medical Display Terminal

Use Scenario: DIN-rail mounted programmable logic controller with EtherCAT slave interface, local I/O expansion, and web-based configuration portal.

IC Role / Device Role / Timing Role: Deterministic real-time controller with 120 MHz CPU, 1 MB SRAM for ladder logic execution, and Ethernet MAC with MII timing compliance.

Use Value: Meets EtherCAT cycle time requirements (<100 µs) using PCLKA-synchronized ETHERC and ELC-linked GPTW timer triggers for precise output update timing.

Use Scenario: Portable patient monitor with color LCD display, touch interface, and multi-parameter biosignal acquisition (ECG, SpO₂, NIBP).

IC Role / Device Role / Timing Role: Graphics-intensive application processor with GLCDC driving 800×480 RGB panel and DRW2D accelerating waveform overlays and UI animations.

Use Value: Reduces CPU load by >65% during display refresh using hardware-accelerated 2D drawing and triple-buffered frame rendering-ensuring glitch-free clinical displays.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance industrial MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
R5F566NEDGFB#10 Same RX66N group, identical 176-pin LFBGA package and 4 MB flash, but rated for –40°C to +85°C (D-version) instead of +105°C Suitable for non-extended temperature environments; lacks extended thermal qualification for under-hood or high-ambient industrial enclosures Select when ambient operating temperature remains ≤85°C and cost optimization is prioritized over thermal margin
R5F566TDDGFB#10 Same package and temperature grade, but with 2 MB flash (vs. 4 MB) and no dual-bank flash capability Limited firmware partitioning flexibility; cannot perform background flash writes during active execution-reducing OTA update safety Choose when application firmware size <2 MB and single-bank flash operation suffices for maintenance workflow

Compared with R5F566NDDGFB#10, the R5F566NEDGFB#10 offers identical performance and peripherals but reduced thermal range, while the R5F566TDDGFB#10 sacrifices flash capacity and dual-bank functionality-making the R5F566NDDGFB#10 optimal for safety-critical, thermally demanding, or field-upgradable systems.

Availability

R5F566NDDGFB#10 is available at Aetrix Electronics and suitable for industrial HMI, smart building controllers, networked PLC edge nodes, and medical display terminals requiring stable component supply across long product lifecycles.

Supply support for R5F566NDDGFB#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX66N Group is designed for high-integrity industrial applications requiring real-time responsiveness, functional safety certification (IEC 60730), rich connectivity, and graphics acceleration-targeting HMI, gateway, and control systems where reliability and long-term supply stability are critical.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F566NDDGFB#10?

The R5F566NDDGFB#10 operates at a maximum frequency of 120 MHz and achieves 698 CoreMark in benchmark testing. This performance stems from its RXv3 CPU core with dual 72-bit accumulators, 113-instruction set, and zero-wait-state 4 MB flash access-enabling deterministic real-time execution for industrial control loops and protocol stacks.

Does the R5F566NDDGFB#10 support IEC 60730 Class B compliance out of the box?

Yes, the R5F566NDDGFB#10 includes hardware features required for IEC 60730 Class B: oscillation-stoppage detection, CRC accelerator (CRCA), independent watchdog timer (IWDTa) with configurable window, self-diagnostic function for the A/D converter, and register write protection. These are implemented in silicon-not dependent on software libraries-and documented in the R01DS0344EJ0120 datasheet.

What package type and pin count does the R5F566NDDGFB#10 use?

The R5F566NDDGFB#10 uses the PLQP0176KB-C package: a 176-pin low-profile fine-pitch ball grid array (LFBGA) measuring 24 × 24 mm with 0.5-mm pitch. It is qualified for operation from –40°C to +105°C (G-version), making it suitable for extended-temperature industrial environments.

How does the dual-bank flash architecture benefit firmware updates on the R5F566NDDGFB#10?

The R5F566NDDGFB#10's dual-bank flash allows background programming and erasing of one bank while executing code from the other-enabling safe over-the-air (OTA) firmware updates without halting real-time operations. This eliminates risk of corruption during power loss and supports seamless failover between active and updated banks via startup area swapping.

Can the R5F566NDDGFB#10 drive a color LCD display directly?

Yes, the R5F566NDDGFB#10 integrates a Graphic-LCD Controller (GLCDC) supporting RGB, YUV, and MPU interfaces, plus a 2D Drawing Engine (DRW2D) for hardware-accelerated bit blitting and vector rendering. It drives resolutions up to 800×480 with triple-layer overlay and supports CLUT-based palettes-eliminating need for external display controllers in many HMI designs.

R5F566NDDGFB#10 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
144-LQFP
Series:
RX
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
RXv3
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F566NDDGFB#10 FAQ

1.How can I place an order for R5F566NDDGFB#10 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F566NDDGFB#10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F566NDDGFB#10 reliable?

The price and inventory of R5F566NDDGFB#10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F566NDDGFB#10 is usually 5 days.

3.What payment methods are accepted for R5F566NDDGFB#10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F566NDDGFB#10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R5F566NDDGFB#10?

R5F566NDDGFB#10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F566NDDGFB#10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F566NDDGFB#10?

For technical support, including R5F566NDDGFB#10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F566NDDGFB#10 requirements.

6.How does Aetrix verify that R5F566NDDGFB#10 is sourced from the original manufacturer or authorized distributors?

All R5F566NDDGFB#10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F566NDDGFB#10 meets industry standards.

7.What is the process for return or replacement of R5F566NDDGFB#10?

All R5F566NDDGFB#10 units undergo pre-shipment inspection (PSI). If there is an issue with R5F566NDDGFB#10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F566NDDGFB#10 part is unused and in its original packaging.

Return procedure for R5F566NDDGFB#10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

R5F566NDDGFB#10 Tags

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