Renesas R5F566NDHDBD#20

Overview

R5F566NDHDBD#20 from Renesas is a 120-MHz 32-bit RXv3 microcontroller with double-precision IEEE-754 FPU, 4-MB on-chip code flash (dual-bank), 1-MB SRAM (including 32-KB ECC RAM), and integrated Ethernet MAC, CAN, USB 2.0 FS, SDHI, QSPI, and GLCDC - designed for industrial HMI, gateway, and edge node applications requiring real-time control and rich connectivity.

For engineers reviewing the R5F566NDHDBD#20 datasheet, R5F566NDHDBD#20 pinout, R5F566NDHDBD#20 application, or R5F566NDHDBD#20 equivalent, this page delivers verified specifications, package mapping to PLQP0176KB-C (176-pin LFBGA, 24 × 24 mm, 0.5-mm pitch), confirmed peripheral channel counts, real-time clock with battery backup, and IEC60730-compliant safety features - all extracted from Renesas R01DS0344EJ0120 Rev.1.20.

Technical Context

The R5F566NDHDBD#20 implements the RXv3 CPU core with 698 CoreMark at 120 MHz, supporting little-endian or big-endian data arrangement, 113 instructions including DSP and floating-point ops, and collective register bank save across 16 banks. It integrates dual-clock domain operation: ICLK up to 120 MHz for CPU and PCLKA peripherals (ETHERC, GLCDC, DRW2D), and PCLKB up to 60 MHz for timers, ADC, and communication modules.

Its memory subsystem includes 4-MB code flash with 8.3-ns read cycle (no wait states at 120 MHz), 32-KB reprogrammable data flash (100,000 erase cycles), 1-MB SRAM (512 KB + 512 KB expansion), 32-KB ECC RAM (SEC-DED), and 8-KB standby RAM backed by VBATT. Peripheral timing is managed via independent clock dividers for ICLK, PCLKA–PCLKD, FCLK, and BCLK - enabling precise domain isolation for deterministic real-time behavior.

Key Specifications

Pinout & Package

Package: PLQP0176KB-C - 176-pin Low-Profile Quad Flat Ball Grid Array (LFBGA), 24 mm × 24 mm body, 0.5-mm ball pitch, 1.2-mm height, RoHS-compliant, moisture sensitivity level 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar MCU applications.

Compared with R5F566NDHDBD#20, R5F566NEHDBD#20 offers identical peripheral set and pin compatibility at reduced memory capacity, while R5F566TDDFB#30 trades connectivity and graphics for enhanced motor-control peripherals - making it unsuitable as a drop-in replacement but viable for specialized motion systems.

Availability

R5F566NDHDBD#20 is available at Aetrix Electronics and suitable for industrial gateways, smart HMI terminals, energy metering hubs, and building automation controllers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F566NDHDBD#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX66N Group - including R5F566NDHDBD#20 - was engineered for high-performance industrial edge devices demanding real-time determinism, rich connectivity (Ethernet/CAN/USB/SD), and functional safety compliance (IEC60730), with emphasis on HMI, gateway, and protocol-conversion use cases.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F566NDHDBD#20?

The R5F566NDHDBD#20 operates at a maximum frequency of 120 MHz and achieves 698 CoreMark under benchmark conditions. This performance stems from the RXv3 CPU core's 113-instruction set, dual-issue capability for select operations, and zero-wait-state access to 4-MB on-chip flash and 1-MB SRAM - enabling deterministic execution in real-time industrial firmware.

Does the R5F566NDHDBD#20 support Ethernet and CAN simultaneously, and how many channels are available?

Yes, the R5F566NDHDBD#20 supports Ethernet MAC (10/100 Mbps, MII/RMII) and three independent CAN channels (ISO11898-1 compliant, 32 mailboxes per channel) concurrently. Each CAN channel operates with dedicated message buffers and filtering logic, and Ethernet uses its own DMA controller (EDMACa) - allowing full-duplex network stack operation alongside CAN bus monitoring without resource contention.

What package type and thermal specifications apply to the R5F566NDHDBD#20?

The R5F566NDHDBD#20 is supplied in the PLQP0176KB-C package: a 176-ball LFBGA with 24 mm × 24 mm footprint, 0.5-mm pitch, and 1.2-mm height. It is rated for industrial temperature range (–40°C to +85°C), has a thermal resistance (θJA) of 26.5°C/W, and supports reflow soldering per JEDEC J-STD-020D.3 - validated for high-reliability PCB assembly in harsh environments.

How does the R5F566NDHDBD#20 handle functional safety requirements such as IEC60730?

The R5F566NDHDBD#20 includes hardware features required for Class B IEC60730 compliance: oscillation-stop detection, CRC calculation accelerator (CRCA), independent watchdog timer (IWDTa) with configurable window, self-diagnostic A/D converter test mode, and register write-protection bits. These are documented in Renesas Application Note R01AN3989JJ0100 and enable systematic fault coverage without external components.

Is the R5F566NDHDBD#20 pin-compatible with other RX66N variants, and what are the key memory differences?

Yes, the R5F566NDHDBD#20 shares identical pinout and package (PLQP0176KB-C) with other 176-pin RX66N MCUs like R5F566NEHDBD#20 and R5F566NCHDBD#20. Key memory differences include: R5F566NDHDBD#20 offers 4-MB code flash and 1-MB SRAM, whereas R5F566NEHDBD#20 provides 2-MB flash and 512-KB SRAM - all variants retain the same peripheral count and clock architecture.